CN101616973B - 半导电树脂组合物 - Google Patents

半导电树脂组合物 Download PDF

Info

Publication number
CN101616973B
CN101616973B CN2007800518165A CN200780051816A CN101616973B CN 101616973 B CN101616973 B CN 101616973B CN 2007800518165 A CN2007800518165 A CN 2007800518165A CN 200780051816 A CN200780051816 A CN 200780051816A CN 101616973 B CN101616973 B CN 101616973B
Authority
CN
China
Prior art keywords
conductive filler
resin composition
filler material
quality
semiconductive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800518165A
Other languages
English (en)
Chinese (zh)
Other versions
CN101616973A (zh
Inventor
长尾勇志
山本龙之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN101616973A publication Critical patent/CN101616973A/zh
Application granted granted Critical
Publication of CN101616973B publication Critical patent/CN101616973B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Electrophotography Configuration And Component (AREA)
CN2007800518165A 2007-02-28 2007-10-29 半导电树脂组合物 Expired - Fee Related CN101616973B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP49730/2007 2007-02-28
JP2007049730 2007-02-28
PCT/JP2007/071434 WO2008105121A1 (en) 2007-02-28 2007-10-29 Semiconductive resin composition

Publications (2)

Publication Number Publication Date
CN101616973A CN101616973A (zh) 2009-12-30
CN101616973B true CN101616973B (zh) 2012-09-19

Family

ID=39030994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800518165A Expired - Fee Related CN101616973B (zh) 2007-02-28 2007-10-29 半导电树脂组合物

Country Status (9)

Country Link
US (1) US8653177B2 (enExample)
EP (1) EP2115054B1 (enExample)
JP (1) JP5242128B2 (enExample)
KR (1) KR101150774B1 (enExample)
CN (1) CN101616973B (enExample)
AT (1) ATE537212T1 (enExample)
MY (1) MY146575A (enExample)
TW (1) TWI437035B (enExample)
WO (1) WO2008105121A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010013810A1 (ja) * 2008-08-01 2010-02-04 旭硝子株式会社 Ｒｆｉｄタグおよびその製造方法、インピーダンス調整方法及び樹脂シート及びその製造方法
JP2010144112A (ja) * 2008-12-22 2010-07-01 Polyplastics Co 燃料用部品
US8246862B2 (en) * 2009-07-30 2012-08-21 Eastman Kodak Company Static dissipative polymeric composition having controlled conductivity
KR20120066753A (ko) * 2010-12-15 2012-06-25 엠파워(주) 웨이퍼 케리어용 복합소재 조성물
KR101409032B1 (ko) * 2011-02-25 2014-06-19 주식회사 디와이엠 우수한 공간전하 축적 억제 특성을 갖는 초고압 직류 전력 케이블용 반도전성 조성물
JP5788252B2 (ja) * 2011-07-25 2015-09-30 オリンパス株式会社 ポリエーテルエーテルケトン複合材料
JP5816487B2 (ja) * 2011-08-22 2015-11-18 国立大学法人信州大学 複合樹脂
US20130228726A1 (en) * 2012-03-02 2013-09-05 Yun Zheng Injection moldable esd compounds having low tribo-charge
JPWO2014002581A1 (ja) * 2012-06-27 2016-05-30 クレハエクストロン株式会社 合成樹脂組成物及び成形体
WO2014033827A1 (ja) * 2012-08-28 2014-03-06 日立ビークルエナジー株式会社 二次電池
JP6155847B2 (ja) * 2013-05-28 2017-07-05 コニカミノルタ株式会社 シームレスベルト用樹脂組成物
DE102013221968A1 (de) * 2013-10-29 2015-04-30 Vitrulan Technical Textiles Gmbh Heizmittel und elektrisch leitender Heizkörper
JP6167459B2 (ja) * 2013-11-01 2017-07-26 パナソニックＩｐマネジメント株式会社 有機エレクトロルミネッセンスデバイス
KR101672089B1 (ko) * 2014-05-20 2016-11-03 주식회사 엘지화학 수지 복합재의 제조방법 및 이로부터 얻어진 성형품
EP3172146B1 (en) 2014-07-22 2019-06-05 Entegris, Inc. Molded fluoropolymer breakseal with compliant material
JP2016128541A (ja) * 2015-01-09 2016-07-14 株式会社リコー 半導電性樹脂組成物、電子写真用部材及び画像形成装置
WO2016208648A1 (ja) * 2015-06-24 2016-12-29 コスモ石油株式会社 樹脂配合物
US9493696B1 (en) 2015-11-24 2016-11-15 International Business Machines Corporation Multiphase resins with reduced percolation threshold
EP3341798B1 (en) * 2016-01-27 2019-08-21 Hewlett-Packard Development Company, L.P. Liquid electrophotographic ink developer unit
CN106336630B (zh) * 2016-08-29 2018-12-25 付融冰 一种导电材料及其制备方法和用途
CN110637048B (zh) * 2017-05-24 2022-05-03 三菱瓦斯化学株式会社 由碳纤维强化热塑性树脂形成的片材和该片材的制造方法
JP6972764B2 (ja) * 2017-08-21 2021-11-24 日本電気硝子株式会社 ガラス繊維強化熱硬化性樹脂成形体及びガラス繊維強化熱硬化性樹脂成形体の製造方法
JP7200536B2 (ja) * 2018-08-20 2023-01-10 富士フイルムビジネスイノベーション株式会社 樹脂成形体
JP7393279B2 (ja) 2020-03-31 2023-12-06 日鉄ケミカル＆マテリアル株式会社 導電性樹脂組成物及び該組成物を用いた電磁波シールド材
JP7564642B2 (ja) * 2020-05-26 2024-10-09 住友化学株式会社 液晶ポリマー樹脂組成物、及び、その製造方法、並びに、半導体搬送用キャリア
CN111978732B (zh) * 2020-09-04 2022-05-24 广东思泉新材料股份有限公司 一种三维导热网络结构的热界面材料

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082240A (zh) * 1992-04-16 1994-02-16 米尔芬产品公司 导电和半导电聚合物
US5688862A (en) * 1994-10-11 1997-11-18 Shin-Etsu Chemical Co., Ltd. Semiconductive silicone elastomer compositions and method for making
CN1245515A (zh) * 1996-11-29 2000-02-23 吴羽化学工业株式会社 半导电性树脂组合物
US6380294B1 (en) * 1997-10-17 2002-04-30 The Dow Chemical Company COMPOSITIONS OF INTERPOLYMERS OF α-OLEFIN MONOMERS WITH ONE OR MORE VINYL OR VINYLIDENE AROMATIC MONOMERS AND/OR ONE OR MORE HINDERED ALIPHATIC OR CYCLOALIPHATIC VINYL OR VINYLIDENE MONOMERS BLENDED WITH A CONDUCTIVE ADDITIVE
US7132062B1 (en) * 2003-04-15 2006-11-07 Plasticolors, Inc. Electrically conductive additive system and method of making same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3636516B2 (ja) 1995-09-25 2005-04-06 呉羽化学工業株式会社 合成樹脂組成物及び合成樹脂成形物
JP4239347B2 (ja) 1999-08-06 2009-03-18 アルプス電気株式会社 磁気ディスク用磁気ヘッドの搬送用トレイ
JP2001247772A (ja) 2000-03-06 2001-09-11 Denki Kagaku Kogyo Kk 導電性樹脂成形品およびその製造方法
US6780388B2 (en) 2000-05-31 2004-08-24 Showa Denko K.K. Electrically conducting fine carbon composite powder, catalyst for polymer electrolyte fuel battery and fuel battery
JP3948217B2 (ja) * 2000-06-05 2007-07-25 昭和電工株式会社 導電性硬化性樹脂組成物、その硬化体、及びその成形体
JP4789312B2 (ja) 2000-09-08 2011-10-12 株式会社クレハ 基板用カセット
JP2002105329A (ja) * 2000-09-29 2002-04-10 Toray Ind Inc 熱可塑性樹脂組成物及び成形品
JP4548922B2 (ja) 2000-10-19 2010-09-22 株式会社クレハ 半導電性樹脂組成物
CN1195793C (zh) 2001-08-06 2005-04-06 昭和电工株式会社 导电的可固化树脂组合物和燃料电池用的隔板
JP3736479B2 (ja) 2002-03-06 2006-01-18 油化電子株式会社 半導電性樹脂成形品
JP2003313428A (ja) 2002-04-25 2003-11-06 Dainichiseika Color & Chem Mfg Co Ltd 導電性樹脂組成物
CN100373503C (zh) 2002-12-26 2008-03-05 昭和电工株式会社 用于形成导电材料的碳质材料及其应用
JP4342929B2 (ja) 2002-12-26 2009-10-14 昭和電工株式会社 導電性組成物用炭素質材料及びその用途
KR100795876B1 (ko) * 2003-09-02 2008-01-21 쇼와 덴코 가부시키가이샤 도전성 폴리머, 그 제조 방법 및 용도
US20050070658A1 (en) * 2003-09-30 2005-03-31 Soumyadeb Ghosh Electrically conductive compositions, methods of manufacture thereof and articles derived from such compositions
JP4363206B2 (ja) * 2004-02-05 2009-11-11 Ｎｏｋ株式会社 カーボンナノチューブの分散方法
WO2005100483A1 (en) * 2004-04-12 2005-10-27 Showa Denko K.K. Electrically conducting resin composition and container for transporting semiconductor-related parts
WO2005100465A1 (en) * 2004-04-15 2005-10-27 Showa Denko K. K. Carbon-based electrically conducting filler, composition and use thereof
JP4994671B2 (ja) 2005-01-21 2012-08-08 昭和電工株式会社 導電性樹脂組成物、その製造方法及び用途

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1082240A (zh) * 1992-04-16 1994-02-16 米尔芬产品公司 导电和半导电聚合物
US5688862A (en) * 1994-10-11 1997-11-18 Shin-Etsu Chemical Co., Ltd. Semiconductive silicone elastomer compositions and method for making
CN1245515A (zh) * 1996-11-29 2000-02-23 吴羽化学工业株式会社 半导电性树脂组合物
US6380294B1 (en) * 1997-10-17 2002-04-30 The Dow Chemical Company COMPOSITIONS OF INTERPOLYMERS OF α-OLEFIN MONOMERS WITH ONE OR MORE VINYL OR VINYLIDENE AROMATIC MONOMERS AND/OR ONE OR MORE HINDERED ALIPHATIC OR CYCLOALIPHATIC VINYL OR VINYLIDENE MONOMERS BLENDED WITH A CONDUCTIVE ADDITIVE
US7132062B1 (en) * 2003-04-15 2006-11-07 Plasticolors, Inc. Electrically conductive additive system and method of making same

Also Published As

Publication number Publication date
TWI437035B (zh) 2014-05-11
KR20090055521A (ko) 2009-06-02
US8653177B2 (en) 2014-02-18
MY146575A (en) 2012-08-30
KR101150774B1 (ko) 2012-06-08
JP5242128B2 (ja) 2013-07-24
ATE537212T1 (de) 2011-12-15
EP2115054A1 (en) 2009-11-11
WO2008105121A1 (en) 2008-09-04
JP2008239947A (ja) 2008-10-09
CN101616973A (zh) 2009-12-30
EP2115054B1 (en) 2011-12-14
US20100173108A1 (en) 2010-07-08
TW200844154A (en) 2008-11-16

Similar Documents

Publication Publication Date Title
CN101616973B (zh) 半导电树脂组合物
JP3972674B2 (ja) 炭素繊維その製造方法および炭素繊維強化樹脂組成物
TW555797B (en) Synthetic resin composition
CA2600311C (en) Composite material
CN100439574C (zh) 具有线性的细碳纤维以及使用该纤维的树脂复合材料
JP4817772B2 (ja) 導電性樹脂組成物、その製造方法及び用途
JP5634870B2 (ja) 炭素繊維を含有する複合材料
KR20070100770A (ko) 전기전도성 조성물 및 그의 제조방법
JPWO2014002581A1 (ja) 合成樹脂組成物及び成形体
JP2009127038A (ja) 樹脂組成物およびその製造方法、並びに、その用途
Via et al. Electrical conductivity modeling of carbon black/polycarbonate, carbon nanotube/polycarbonate, and exfoliated graphite nanoplatelet/polycarbonate composites
Buketov et al. Electrophysical properties of epoxy composite materials filled with carbon black nanopowder
EP1950253A1 (en) Recycled composite material
US7955699B2 (en) Composite material
King et al. Electrical and thermal conductivity and tensile and flexural properties: comparison of carbon black/polycarbonate and carbon nanotube/polycarbonate resins
Zeng et al. Effect of ultrasonic-assisted impregnation parameters on the preparation and interfacial properties of MWCNT/glass-fiber reinforced composites
CN100556956C (zh) 导电聚合物及其制备方法和用途
KR102894880B1 (ko) 그래핀 복합수지 제조장치, 이에 의한 그래핀 복합수지의 제조방법 및 에어코일
JP2003105676A (ja) 炭素繊維、炭素繊維強化熱可塑性樹脂組成物、成形用材料および成形品
JP2006137938A (ja) 磁気ディスク用磁気ヘッド搬送トレイ用樹脂組成物及び搬送トレイ
HK1160545B (en) Composite material containing carbon fiber

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120919

Termination date: 20181029