ATE537212T1 - Halbleitende harzzusammensetzung - Google Patents

Halbleitende harzzusammensetzung

Info

Publication number
ATE537212T1
ATE537212T1 AT07849905T AT07849905T ATE537212T1 AT E537212 T1 ATE537212 T1 AT E537212T1 AT 07849905 T AT07849905 T AT 07849905T AT 07849905 T AT07849905 T AT 07849905T AT E537212 T1 ATE537212 T1 AT E537212T1
Authority
AT
Austria
Prior art keywords
resin composition
semiconductive resin
kinds
conductive fillers
tube
Prior art date
Application number
AT07849905T
Other languages
German (de)
English (en)
Inventor
Yuji Nagao
Ryuji Yamamoto
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Application granted granted Critical
Publication of ATE537212T1 publication Critical patent/ATE537212T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Electrophotography Configuration And Component (AREA)
AT07849905T 2007-02-28 2007-10-29 Halbleitende harzzusammensetzung ATE537212T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007049730 2007-02-28
PCT/JP2007/071434 WO2008105121A1 (en) 2007-02-28 2007-10-29 Semiconductive resin composition

Publications (1)

Publication Number Publication Date
ATE537212T1 true ATE537212T1 (de) 2011-12-15

Family

ID=39030994

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07849905T ATE537212T1 (de) 2007-02-28 2007-10-29 Halbleitende harzzusammensetzung

Country Status (9)

Country Link
US (1) US8653177B2 (enExample)
EP (1) EP2115054B1 (enExample)
JP (1) JP5242128B2 (enExample)
KR (1) KR101150774B1 (enExample)
CN (1) CN101616973B (enExample)
AT (1) ATE537212T1 (enExample)
MY (1) MY146575A (enExample)
TW (1) TWI437035B (enExample)
WO (1) WO2008105121A1 (enExample)

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WO2010013810A1 (ja) * 2008-08-01 2010-02-04 旭硝子株式会社 Ｒｆｉｄタグおよびその製造方法、インピーダンス調整方法及び樹脂シート及びその製造方法
JP2010144112A (ja) * 2008-12-22 2010-07-01 Polyplastics Co 燃料用部品
US8246862B2 (en) * 2009-07-30 2012-08-21 Eastman Kodak Company Static dissipative polymeric composition having controlled conductivity
KR20120066753A (ko) * 2010-12-15 2012-06-25 엠파워(주) 웨이퍼 케리어용 복합소재 조성물
KR101409032B1 (ko) * 2011-02-25 2014-06-19 주식회사 디와이엠 우수한 공간전하 축적 억제 특성을 갖는 초고압 직류 전력 케이블용 반도전성 조성물
JP5788252B2 (ja) * 2011-07-25 2015-09-30 オリンパス株式会社 ポリエーテルエーテルケトン複合材料
JP5816487B2 (ja) * 2011-08-22 2015-11-18 国立大学法人信州大学 複合樹脂
US20130228726A1 (en) * 2012-03-02 2013-09-05 Yun Zheng Injection moldable esd compounds having low tribo-charge
JPWO2014002581A1 (ja) * 2012-06-27 2016-05-30 クレハエクストロン株式会社 合成樹脂組成物及び成形体
WO2014033827A1 (ja) * 2012-08-28 2014-03-06 日立ビークルエナジー株式会社 二次電池
JP6155847B2 (ja) * 2013-05-28 2017-07-05 コニカミノルタ株式会社 シームレスベルト用樹脂組成物
DE102013221968A1 (de) * 2013-10-29 2015-04-30 Vitrulan Technical Textiles Gmbh Heizmittel und elektrisch leitender Heizkörper
JP6167459B2 (ja) * 2013-11-01 2017-07-26 パナソニックＩｐマネジメント株式会社 有機エレクトロルミネッセンスデバイス
KR101672089B1 (ko) * 2014-05-20 2016-11-03 주식회사 엘지화학 수지 복합재의 제조방법 및 이로부터 얻어진 성형품
EP3172146B1 (en) 2014-07-22 2019-06-05 Entegris, Inc. Molded fluoropolymer breakseal with compliant material
JP2016128541A (ja) * 2015-01-09 2016-07-14 株式会社リコー 半導電性樹脂組成物、電子写真用部材及び画像形成装置
WO2016208648A1 (ja) * 2015-06-24 2016-12-29 コスモ石油株式会社 樹脂配合物
US9493696B1 (en) 2015-11-24 2016-11-15 International Business Machines Corporation Multiphase resins with reduced percolation threshold
EP3341798B1 (en) * 2016-01-27 2019-08-21 Hewlett-Packard Development Company, L.P. Liquid electrophotographic ink developer unit
CN106336630B (zh) * 2016-08-29 2018-12-25 付融冰 一种导电材料及其制备方法和用途
CN110637048B (zh) * 2017-05-24 2022-05-03 三菱瓦斯化学株式会社 由碳纤维强化热塑性树脂形成的片材和该片材的制造方法
JP6972764B2 (ja) * 2017-08-21 2021-11-24 日本電気硝子株式会社 ガラス繊維強化熱硬化性樹脂成形体及びガラス繊維強化熱硬化性樹脂成形体の製造方法
JP7200536B2 (ja) * 2018-08-20 2023-01-10 富士フイルムビジネスイノベーション株式会社 樹脂成形体
JP7393279B2 (ja) 2020-03-31 2023-12-06 日鉄ケミカル＆マテリアル株式会社 導電性樹脂組成物及び該組成物を用いた電磁波シールド材
JP7564642B2 (ja) * 2020-05-26 2024-10-09 住友化学株式会社 液晶ポリマー樹脂組成物、及び、その製造方法、並びに、半導体搬送用キャリア
CN111978732B (zh) * 2020-09-04 2022-05-24 广东思泉新材料股份有限公司 一种三维导热网络结构的热界面材料

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JP3948217B2 (ja) * 2000-06-05 2007-07-25 昭和電工株式会社 導電性硬化性樹脂組成物、その硬化体、及びその成形体
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Also Published As

Publication number Publication date
TWI437035B (zh) 2014-05-11
KR20090055521A (ko) 2009-06-02
US8653177B2 (en) 2014-02-18
MY146575A (en) 2012-08-30
KR101150774B1 (ko) 2012-06-08
JP5242128B2 (ja) 2013-07-24
EP2115054A1 (en) 2009-11-11
WO2008105121A1 (en) 2008-09-04
CN101616973B (zh) 2012-09-19
JP2008239947A (ja) 2008-10-09
CN101616973A (zh) 2009-12-30
EP2115054B1 (en) 2011-12-14
US20100173108A1 (en) 2010-07-08
TW200844154A (en) 2008-11-16

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