CA2093994A1 - Electrically conductive and semi-conductive polymers - Google Patents
Electrically conductive and semi-conductive polymersInfo
- Publication number
- CA2093994A1 CA2093994A1 CA 2093994 CA2093994A CA2093994A1 CA 2093994 A1 CA2093994 A1 CA 2093994A1 CA 2093994 CA2093994 CA 2093994 CA 2093994 A CA2093994 A CA 2093994A CA 2093994 A1 CA2093994 A1 CA 2093994A1
- Authority
- CA
- Canada
- Prior art keywords
- polymeric material
- polymer
- metal salt
- ohms
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920001940 conductive polymer Polymers 0.000 title abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 73
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 150000003839 salts Chemical class 0.000 claims abstract description 36
- 239000000243 solution Substances 0.000 claims description 21
- 229920001971 elastomer Polymers 0.000 claims description 17
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 239000005060 rubber Substances 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- 239000002243 precursor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229920005862 polyol Polymers 0.000 claims description 7
- 150000003077 polyols Chemical group 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 239000004606 Fillers/Extenders Substances 0.000 claims description 5
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 claims description 4
- VEPSWGHMGZQCIN-UHFFFAOYSA-H ferric oxalate Chemical compound [Fe+3].[Fe+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O VEPSWGHMGZQCIN-UHFFFAOYSA-H 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 4
- 229910021592 Copper(II) chloride Inorganic materials 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Inorganic materials [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011496 polyurethane foam Substances 0.000 claims description 3
- 239000006104 solid solution Substances 0.000 claims description 3
- 235000005074 zinc chloride Nutrition 0.000 claims description 3
- 239000011592 zinc chloride Substances 0.000 claims description 3
- 229910021590 Copper(II) bromide Inorganic materials 0.000 claims description 2
- 244000043261 Hevea brasiliensis Species 0.000 claims description 2
- 229910021575 Iron(II) bromide Inorganic materials 0.000 claims description 2
- 229910021577 Iron(II) chloride Inorganic materials 0.000 claims description 2
- 229910021576 Iron(III) bromide Inorganic materials 0.000 claims description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 2
- 239000002998 adhesive polymer Substances 0.000 claims description 2
- RSJOBNMOMQFPKQ-UHFFFAOYSA-L copper;2,3-dihydroxybutanedioate Chemical compound [Cu+2].[O-]C(=O)C(O)C(O)C([O-])=O RSJOBNMOMQFPKQ-UHFFFAOYSA-L 0.000 claims description 2
- DYROSKSLMAPFBZ-UHFFFAOYSA-L copper;2-hydroxypropanoate Chemical compound [Cu+2].CC(O)C([O-])=O.CC(O)C([O-])=O DYROSKSLMAPFBZ-UHFFFAOYSA-L 0.000 claims description 2
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 claims description 2
- 229910000398 iron phosphate Inorganic materials 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- WBJZTOZJJYAKHQ-UHFFFAOYSA-K iron(3+) phosphate Chemical compound [Fe+3].[O-]P([O-])([O-])=O WBJZTOZJJYAKHQ-UHFFFAOYSA-K 0.000 claims description 2
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 claims description 2
- 229910001496 lithium tetrafluoroborate Inorganic materials 0.000 claims description 2
- 229920003052 natural elastomer Polymers 0.000 claims description 2
- 229920001194 natural rubber Polymers 0.000 claims description 2
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229910052723 transition metal Inorganic materials 0.000 claims description 2
- 150000003624 transition metals Chemical group 0.000 claims description 2
- FEONEKOZSGPOFN-UHFFFAOYSA-K tribromoiron Chemical compound Br[Fe](Br)Br FEONEKOZSGPOFN-UHFFFAOYSA-K 0.000 claims description 2
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 claims 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims 1
- 150000002825 nitriles Chemical group 0.000 claims 1
- 239000000126 substance Substances 0.000 description 8
- -1 carbon black Chemical compound 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000006260 foam Substances 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 229920006311 Urethane elastomer Polymers 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 239000012266 salt solution Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241001112258 Moca Species 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920002176 Pluracol® Polymers 0.000 description 2
- 241000350481 Pterogyne nitens Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000010907 mechanical stirring Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 2
- CGLQOIMEUPORRI-UHFFFAOYSA-N 2-(1-benzoyloxypropan-2-yloxy)propyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(C)OC(C)COC(=O)C1=CC=CC=C1 CGLQOIMEUPORRI-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910021579 Iron(II) iodide Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- JQGGAELIYHNDQS-UHFFFAOYSA-N Nic 12 Natural products CC(C=CC(=O)C)c1ccc2C3C4OC4C5(O)CC=CC(=O)C5(C)C3CCc2c1 JQGGAELIYHNDQS-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N Nitrogen dioxide Chemical class O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NRVFKVASDOWZIR-UHFFFAOYSA-I [Cl-].[Cr+3].[Cu](Br)Br.[Cl-].[Cl-] Chemical compound [Cl-].[Cr+3].[Cu](Br)Br.[Cl-].[Cl-] NRVFKVASDOWZIR-UHFFFAOYSA-I 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- BQZGVMWPHXIKEQ-UHFFFAOYSA-L iron(ii) iodide Chemical compound [Fe+2].[I-].[I-] BQZGVMWPHXIKEQ-UHFFFAOYSA-L 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical group 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010058 rubber compounding Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- KVMPUXDNESXNOH-UHFFFAOYSA-N tris(1-chloropropan-2-yl) phosphate Chemical compound ClCC(C)OP(=O)(OC(C)CCl)OC(C)CCl KVMPUXDNESXNOH-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
- G21F9/00—Treating radioactively contaminated material; Decontamination arrangements therefor
- G21F9/04—Treating liquids
- G21F9/06—Processing
- G21F9/12—Processing by absorption; by adsorption; by ion-exchange
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/28—Treatment of water, waste water, or sewage by sorption
- C02F1/281—Treatment of water, waste water, or sewage by sorption using inorganic sorbents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/122—Ionic conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31605—Next to free metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Polyurethanes Or Polyureas (AREA)
- Conductive Materials (AREA)
- Silicon Polymers (AREA)
- Rolls And Other Rotary Bodies (AREA)
Abstract
ELECTRICALLY CONDUCTIVE AND
SEMI-CONDUCTIVE POLYMERS
Abstract of the Disclosure An electrically conductive or semi-conductive polymeric material including a metal salt dissolved in a polymer. The metal salt is complexed with the polymer, which is what provides the material with its conductive properties. The materials have a resistivity of between 105 and 1012 ohms-cm.
SEMI-CONDUCTIVE POLYMERS
Abstract of the Disclosure An electrically conductive or semi-conductive polymeric material including a metal salt dissolved in a polymer. The metal salt is complexed with the polymer, which is what provides the material with its conductive properties. The materials have a resistivity of between 105 and 1012 ohms-cm.
Description
~ 1 --ATTORNEY DOCRET NO: 05211/0(12001 Elsctrically Co~duct~e and 8emi-~o~ducti~e Poly~ers Field of the_Invention This invention relates to the field of polymers, 5 particularly urethane rubbers and foams, and to a method of making such polymers electrically conductive or electrically semi-conductive.
Backqround of the Invention In the prior art, polymers, particularly urethane 10 rubber, have been used for a variety of applications in which it is desirable that the product have some electrical conductivity, either throughout the product itself or at least on the exposed surface of the product.
one example involves rollers used in many printers 15 to help transport paper or carry toner in electrograhic printing. The rollers are often made of a polvmer such as polyurethane or covered with a similar polvmer to facilitate their paper-carrying or toner transfer abilityO Different materials, including rubber, may be 20 used in place of polymers for these applications, but because these polymers are much more durable than rubber, they are preferred. Most polymers do not conduct electricity, however, and static charges, which adversely effect the operation of the printer, can build up on the 25 rollers. A similar problem xists if rollers of the same material are used for other purposes, such as carrying semiconductors as part of a semiconductor manufacturing process. Other end uses require conductive or semi-conductive parts as well.
As a result, there have been attempts make such polymer parts electrically conductive. In some cases, the part made from the polymer has been coated with an electrically conductive material. Unfortunately, these coatings have short life spans, and some are toxic.
35 Another approach has been to disperse an electrically-2 IJ ~J 3 ~ 9 ~
conductive material in the polymer when the part is beingfabricated. These electrically-conductive materials have included metal powders such as silver, copper, and nickel, and also materials such as carbon black, 5 graphite, or other conductive polymers. However, the resulting products have several serious drawbacks. In the prior art, in order to make the polymer even semi-conductive, a large amount of conductive filler, eOg., metal powder like carbon black, had to be used, often as 10 high as 10% to 40% of the overall mixture by weight.
This degraded the mechanical and thermal properties of the resulting polymer part. Moreover, because of the size, and nature of the conductive particles, as well as the way in which the particles were mixed with the 15 polymer, conductivity was not very great.
Another related problem is that it is very difficult, due to the relative size and weight of the added particles and the difficulty in dispersing them into the polymeric composition, to achieve a uniform 20 distribution of the conductive material throughout the polymer. As a result of an uneven distribution, the electrical conductivity of the resulting product is not uniform, and the resulting product's mechanical and thermal properties suffer as well. As a result of all 25 this, in general, products made from such compounds have been far less than satisfactory, and in fact, in some applications, become high maintenance items.
Finally, a related problem is that it is often desirable to select the specific conductivity of an 30 polymer in advance, as different end applications preferentially require parts with different conductivities. Selection was not really possible with the prior art methods of making semi-conductive polymers.
Accordingly, one object of the invention is to 35 provide a method by which polymeric materials may be made - 3 ~ 3 3 t~ 9 ~
electrically conductive, without the need for conductive coatings or large amounts of conductive fillers.
Another ob~ect of the invention is to provide a method of making an electrically conductive polymeric 5 material so that the resulting product has uniform electrical conductivity throughout.
Another object of the invention is to provide a method of making an electrically conductive polymeric material so that the relative electrical resistance of 10 the resulting product may be varied with a high degree of accuracy.
Another object of the invention is to provide a method of making an electrically-conductive polymeric material whereby the mechanical and thermal properties of 15 the resulting product are not degraded from what would be expected with a similar material which was non-conductive.
Another object of the invention is to provide a pslymeric material which is electrically conductive and 20 which may be molded and machined.
Another object of the invention is to provide an electrically-conductive polymeric material that is free of voids.
Another object of the invention is to provide an 25 electrically-conductive polymeric material that when used on the surface of rollers, e.g., in a printer, inhibits build-up a static charge on the roller.
Another object of the invention is to provide a polymeric material with good thermal stability.
Summary of the Invention The invention features an electrically conductive or semi-conductive polymeric material that has a resistivity of between 10l2 ohm-cm and 105 ohm-cm. The material i5 a solid solution of metal salt dissolved in a 35 polymer. The metal salt is complexed with the polymer, 2 i3 ~ 3 ~
which is what provides the material with its conductive properties. Depending on the desired resistivity, the quantity of metal salt in the material can be vari~d, although preferably the material includes only a small 5 amount (less than 1%, more preferably less than 0.1%) of the metal salt by weight. B~cause only a small amount of the metal salt is included in the material, the material has good mechanical and thermal propertie~. These properties, coupled with the conductive nature of the 10 material, make the material suitable for use as coatings on, e.g., rollers used on paper printers.
The preferred polymers contain, e.g., nitrogen, oxygen, sulfur or halida atoms, or unsaturated (double and triple bond) groups, which are available for 15 complexing with the metal salt. Preferred polymers include elastomeric polymers like polyurethanes and rubbers, adhesive polymers, and plastics. When rubbers are used, the material also preferably includes a plasticizer.
Preferred metal salts suitable for use in the material include transition metal halides like CuCl2, CuBr2, CoC12, ZnCl2, NiC12, FeCl2, FeBr2, FeBr3, CUI2, FeCl3, FeI3, and FeI2. Other preferred salts include Cu(NO3)2~ copper lactate, copper tartrate, iron phosphate, 25 iron oxalate, LiBF4, and H4Fe~CN)6.
The invention also features a method of preparing these polymeric materials. Generally, the method includes making a homogenous solution of the metal salt in a polymer or polymer precursor, and curing the 30 composition. When the polymer precursor is an isocyanate functional prepolymer, the solution also includes an extender (polyol or polyamine) that reacts with the isocyanate groups during curing to form a polyurethane resin. This method results in an even distribution of 35 the metal salt throughout the polymeric material, which ,~ ~,i tJ
provides the material with uniform conductivity throughout.
The conductive elastomers are suitable for use in a variety of industrial applications to control surface 5 charge and to provide good heat conductivity and expanded life. For example, the poly~ers can be used to coat the belts, shafts, wheels, inserters, and paper handling and copier toner pick-up rollers in paper printers. The polymer can be used to coat car bodies, print circuits, 10 seals, and to dissipate charges in various other electrical applications, such as coating on belts that are used to transport semiconductor wafers during manufacture. The conductive plastic materials (such as nylonl can be used to coat disc drives, machine body 15 parts, cabinets, and carry cases.
Other features and advantages of the invention will be apparent from the description of the preferred embodiment thereof, and from the claims.
Description of the Preferred Embodiment The preferred polymers are polyurethanes. The preferred method of preparing conductive polymeric materials including a polyurethane is to mix an extender (polyol or amine) or an isocyanate-functional prepolymer with a solution of a metal salt. The mixture is then 25 cured. Of course, other standard ingredients, like a cure accelerator or a flame retardant, may be included in the mixture.
Example l - Conductive Laser Roller A steel core was coated with an adhesive (Thixon 30 AP 3437 from Morton International, West Alexandria, Ohio). The part was then completely dried.
A 5~ solution of copper chloride was prepared as follows. In a one liter container, 475 grams of Fyrol PCF (tri(B-chloropropyl) phosphate, available from Akzo 35 Chemical Inc., Chicago, IL), 475 grams of Fyrol CEF
- 6 - 2~,~93~9~
(tri(B-chlorethyl) phosphate, available from Akzo Chemical Inc., Chicago, IL), 50 grams of dried copper chloride (available from Aldrich Chemical Company, Milwaukee, WI), and 6 grams of Pluracol TP-440 (polyol 5 available from BASF Corporation, Parsippany, NJ) were mixed under mechanical stirring at 200-500 rpm and at 220 F for 2 hours. A green solution was obtained.
A 55 gallon resin tank (made by Amplan Inc., Middlesex, NJ, equipped with vacuum, stirring, pressure, 10 venting valves and temperature control) was filled with a polyisocyanate functional prepolymer, Vibrathane 8011 (available from Uniroyal Chemicals, Middlebury, CT) and the temperature raised to, and maintained at, 170F. In a 15 liter container, 8200 grams of Isonol 93 (available 15 from the Upjohn Co., Kalam~zoo, MI), 1400 grams of TIPA
(tributoxyethyl phosphate, available from FMC Corp. of Nitro, WV), 160 grams of copper chloride solution (5~) and 48 grams of Metacure T-12 (dibutylton dilaurate, available fro~ Air Products, Allertown, PA) were mixed 20 with mechanical stirring at 200-500 rpm for 5 minutes at room temperature. The TIPA increases the solubility of the ingredients; the T-12 is a catalyst. The mixture was then degassed for 30 minutes under vacuum. The mixture was transferred to the 5 gallon curative tank (made by 25 Amplan Inc. and equipped with a mechanical mixer~.
Both the prepolymer and the curative were mixed through an Automatic Process Control dispenser to produce a uniform mixing. By adjusting the flow rate for each tank, 148600 grams of the prepolymer (Vibrathane 8011) 30 and 9800 grams of the curative were mixed thoroughly.
The mixture was charged to each casting mold surrounding the steel cores. The mixture then was cured in the casting mold at 260F for 20 minutes. It was then demolded and left in the oven at 230F for 12 hours.
- 7 - ~J939.~-~
The cased roller was then ground to obtain the specified dimensions. The finished part has hardness of 53 Shore A and had electrical resistivity of 3 x 109 ohms-cm.
Example 2 - Conductive Laser Roller A second conductive laser roller was made by an analagous procedure as in Example 1, except that the formulation was changed to the following:
ComponentsWeiqht (qrams) copper Chloride 800 The finished part had a hardness of 53 Shore A and a resistivity of 1.5 x 109 ohms-cm.
Example 3 -- ~on-Foam Polyurethane Formulation and the Effect of Varyina the Quantity of Metal Salt A 0.5% solution of copper chloride (lOg) is added to l90g of Metacure T-12 and mixed until the copper chloride dissolved. The resulting copper chloride solution (165g) was mixed with 8200 grams of polyol-234-630 (polyglycol, available from BASF, NJ), and this 25 solution is mixed with 1300 grams of trisopropanolamine 99 (available from Dow Chemical USA, MO) at room temperature. This solution (30.4g) is then vigorously mixed with 455g of Vibrathane 8011 at 90-110F. The mixture was then poured into multiple cavity molds and 30 cured at 220-250F for 30 minutes. It was demolded and post-cured in an oven at 220F for 12 hours. The urethane rubber had a resultant of 3.5 x 109 ohms-cm.
The amount of copper chloride in the material was O.03%. Further materials were made in which the quantity 35 of copper chloride was increased while the remaining materials remained the same. The resistivity dropped 2 ~
- ~ -tmore conductivity) as the level of copper chloride increased, as follows:
Amount (arams) of CuCl2 per lOOg of polyol Resistivity (ohms-cm~
5.0 x 10-6 4.0 x 101 5.0 x 10-5 3.5 x 109 7 x 10-5 3.0 x 109 9.4 x 10-5 2.1 x 109 1.5 x 10-4 1.7 x 109 2.0 x 10-4 1.2 x 109 3.0 x 10-4 9.0 x 108 5.0 x 10-4 7.0 x 108 9.0 x 10-3 2.0 x 108 1.4 x 10-2 7.6 x 107 1.9 x 10-2 1.8 x 107 2.5 4.4 x 106 5.0 5.0 x 105 Example 4 -- Other Non-Foam Polyurethane Formulations A metal salt solution (25%) was formulated with 15 grams of the metal salt; 20 grams of a flame retardant, tri-(B-chloropropyl)phosphate; 20 grams of Isonol 93; and 5 grams of tributoxyethyl phosphate. The metal salts that were used in the solution included zinc chloride, 25 cobalt chloride, iron oxalate, lithium chloride, copper bromide chromium chloride, and copper chloride, all of which were purchased from Aldrich Chemical Co. of Milwaukee, Wisconsin. The salts were ground and dried prior to use. The solutions were prepared by 30 mechanically mixing ~t 200-500 rpm at 150F for 1-3 hours.
The 25~ metal salt solution (50 grams) was combined with a 38 grams of an extender MOCA (4,4'-diamino-3,3'-dichlorodiphenylmethane, available from 35 Palmer Davis Seikra, Inc., NY), and a polyurethane c~ 3 1 g prepolymer, Vibrathane B-601 (a polyester/TDI prepolymer, available from Uniroyal Chemical). This was done by adding first the MOCA and then the prepolymer to the metal solution, with mixing, at 180-220F. Vigorous 5 mixing continued for 2-5 minutes.
The mixtures were then poured into a multiplecavity metal mold, and the prepolymer was cured at 220-250F for 30 minutes. The material was removed from the mold and post-cured in an oven for 12 to 20 10 hours at 200F, after which curing was completed by letting the material sit at room temperature for at least 3 days to complete curing.
The polymeric materials that were obtained had the following resistivities:
Salt Resistivity (ohms-cm~
zinc chloride2.5 x 101 cobalt chloride1.2 x 1ol0 iron chloride1.0 x 106 iron oxalate 1.3 x 101 lithium chloride1.6 x 101 copper bromide1 x 1o6 chromium chloride 1.9 x 101 copper chlorids5.0 x 1o6 Example 5 -- Polyurethane Foams The following conductive foams were prepared according to the same general procedure used above. The numbers in the table are the grams of the particular ingredient included in the example. The metal salt solutions were prepared as described previously; a foam 30 agent such as methylene chloride, H2O was used. The notes at the end of the table supply further information concerning the ingredients.
- lo - 2~, 3~99~
ExamDle ~
In~redient~ 1 2 3 4 5 6 7 8 p_3801450325 143 155 180180180 400 DC 20021.8 1.8 6.6 10 76.6 7 7 81ack ~48003 6 6 2.33 3.5 5 2.33 5 15 Methylene 6 16 4.33 65 4.33 4.33 4.33 4.33 chloride Water3.53.5 1.3 2.25 1 1 1 0.5 DABCo43.53.5 1.1 0.5 0.51.16 drop drop B-9-885 1 1 0.33 0.5 0.33 0.33 0.33 20 ~--1260.10.1 -- -- -- -- -- --Mondur~ PF7 120 120 56.7 70 50 50 50 53 (22.6%) 35 Metal Salt - 0.5 33.3 25 40 40 40 60 Formula CuC1z CuClz FeClz F~Clz CuClz ~C12 CuCl CuCl Solution 25~ 25~ 25~ 25~ 15~ 20% 20~2 2~
Shoro A 15A 20A 20A 20A 15A 20A loA 30A
40 R~tMq 5xl0l 3xl0 1 ~1o8 sxlo7 5xl07 3~l07 3xl07 ~lO
~OHM~) NOTES
1. P-380 (Pluracol polyol 380) iS a polyether polyol available from BASF Corporation of Wyandotte, Missouri.
2. A silicone surfactant available from Dow Corning.
3. Black #4800 is a black pigment from Pigment Dispersions, Inc.
Backqround of the Invention In the prior art, polymers, particularly urethane 10 rubber, have been used for a variety of applications in which it is desirable that the product have some electrical conductivity, either throughout the product itself or at least on the exposed surface of the product.
one example involves rollers used in many printers 15 to help transport paper or carry toner in electrograhic printing. The rollers are often made of a polvmer such as polyurethane or covered with a similar polvmer to facilitate their paper-carrying or toner transfer abilityO Different materials, including rubber, may be 20 used in place of polymers for these applications, but because these polymers are much more durable than rubber, they are preferred. Most polymers do not conduct electricity, however, and static charges, which adversely effect the operation of the printer, can build up on the 25 rollers. A similar problem xists if rollers of the same material are used for other purposes, such as carrying semiconductors as part of a semiconductor manufacturing process. Other end uses require conductive or semi-conductive parts as well.
As a result, there have been attempts make such polymer parts electrically conductive. In some cases, the part made from the polymer has been coated with an electrically conductive material. Unfortunately, these coatings have short life spans, and some are toxic.
35 Another approach has been to disperse an electrically-2 IJ ~J 3 ~ 9 ~
conductive material in the polymer when the part is beingfabricated. These electrically-conductive materials have included metal powders such as silver, copper, and nickel, and also materials such as carbon black, 5 graphite, or other conductive polymers. However, the resulting products have several serious drawbacks. In the prior art, in order to make the polymer even semi-conductive, a large amount of conductive filler, eOg., metal powder like carbon black, had to be used, often as 10 high as 10% to 40% of the overall mixture by weight.
This degraded the mechanical and thermal properties of the resulting polymer part. Moreover, because of the size, and nature of the conductive particles, as well as the way in which the particles were mixed with the 15 polymer, conductivity was not very great.
Another related problem is that it is very difficult, due to the relative size and weight of the added particles and the difficulty in dispersing them into the polymeric composition, to achieve a uniform 20 distribution of the conductive material throughout the polymer. As a result of an uneven distribution, the electrical conductivity of the resulting product is not uniform, and the resulting product's mechanical and thermal properties suffer as well. As a result of all 25 this, in general, products made from such compounds have been far less than satisfactory, and in fact, in some applications, become high maintenance items.
Finally, a related problem is that it is often desirable to select the specific conductivity of an 30 polymer in advance, as different end applications preferentially require parts with different conductivities. Selection was not really possible with the prior art methods of making semi-conductive polymers.
Accordingly, one object of the invention is to 35 provide a method by which polymeric materials may be made - 3 ~ 3 3 t~ 9 ~
electrically conductive, without the need for conductive coatings or large amounts of conductive fillers.
Another ob~ect of the invention is to provide a method of making an electrically conductive polymeric 5 material so that the resulting product has uniform electrical conductivity throughout.
Another object of the invention is to provide a method of making an electrically conductive polymeric material so that the relative electrical resistance of 10 the resulting product may be varied with a high degree of accuracy.
Another object of the invention is to provide a method of making an electrically-conductive polymeric material whereby the mechanical and thermal properties of 15 the resulting product are not degraded from what would be expected with a similar material which was non-conductive.
Another object of the invention is to provide a pslymeric material which is electrically conductive and 20 which may be molded and machined.
Another object of the invention is to provide an electrically-conductive polymeric material that is free of voids.
Another object of the invention is to provide an 25 electrically-conductive polymeric material that when used on the surface of rollers, e.g., in a printer, inhibits build-up a static charge on the roller.
Another object of the invention is to provide a polymeric material with good thermal stability.
Summary of the Invention The invention features an electrically conductive or semi-conductive polymeric material that has a resistivity of between 10l2 ohm-cm and 105 ohm-cm. The material i5 a solid solution of metal salt dissolved in a 35 polymer. The metal salt is complexed with the polymer, 2 i3 ~ 3 ~
which is what provides the material with its conductive properties. Depending on the desired resistivity, the quantity of metal salt in the material can be vari~d, although preferably the material includes only a small 5 amount (less than 1%, more preferably less than 0.1%) of the metal salt by weight. B~cause only a small amount of the metal salt is included in the material, the material has good mechanical and thermal propertie~. These properties, coupled with the conductive nature of the 10 material, make the material suitable for use as coatings on, e.g., rollers used on paper printers.
The preferred polymers contain, e.g., nitrogen, oxygen, sulfur or halida atoms, or unsaturated (double and triple bond) groups, which are available for 15 complexing with the metal salt. Preferred polymers include elastomeric polymers like polyurethanes and rubbers, adhesive polymers, and plastics. When rubbers are used, the material also preferably includes a plasticizer.
Preferred metal salts suitable for use in the material include transition metal halides like CuCl2, CuBr2, CoC12, ZnCl2, NiC12, FeCl2, FeBr2, FeBr3, CUI2, FeCl3, FeI3, and FeI2. Other preferred salts include Cu(NO3)2~ copper lactate, copper tartrate, iron phosphate, 25 iron oxalate, LiBF4, and H4Fe~CN)6.
The invention also features a method of preparing these polymeric materials. Generally, the method includes making a homogenous solution of the metal salt in a polymer or polymer precursor, and curing the 30 composition. When the polymer precursor is an isocyanate functional prepolymer, the solution also includes an extender (polyol or polyamine) that reacts with the isocyanate groups during curing to form a polyurethane resin. This method results in an even distribution of 35 the metal salt throughout the polymeric material, which ,~ ~,i tJ
provides the material with uniform conductivity throughout.
The conductive elastomers are suitable for use in a variety of industrial applications to control surface 5 charge and to provide good heat conductivity and expanded life. For example, the poly~ers can be used to coat the belts, shafts, wheels, inserters, and paper handling and copier toner pick-up rollers in paper printers. The polymer can be used to coat car bodies, print circuits, 10 seals, and to dissipate charges in various other electrical applications, such as coating on belts that are used to transport semiconductor wafers during manufacture. The conductive plastic materials (such as nylonl can be used to coat disc drives, machine body 15 parts, cabinets, and carry cases.
Other features and advantages of the invention will be apparent from the description of the preferred embodiment thereof, and from the claims.
Description of the Preferred Embodiment The preferred polymers are polyurethanes. The preferred method of preparing conductive polymeric materials including a polyurethane is to mix an extender (polyol or amine) or an isocyanate-functional prepolymer with a solution of a metal salt. The mixture is then 25 cured. Of course, other standard ingredients, like a cure accelerator or a flame retardant, may be included in the mixture.
Example l - Conductive Laser Roller A steel core was coated with an adhesive (Thixon 30 AP 3437 from Morton International, West Alexandria, Ohio). The part was then completely dried.
A 5~ solution of copper chloride was prepared as follows. In a one liter container, 475 grams of Fyrol PCF (tri(B-chloropropyl) phosphate, available from Akzo 35 Chemical Inc., Chicago, IL), 475 grams of Fyrol CEF
- 6 - 2~,~93~9~
(tri(B-chlorethyl) phosphate, available from Akzo Chemical Inc., Chicago, IL), 50 grams of dried copper chloride (available from Aldrich Chemical Company, Milwaukee, WI), and 6 grams of Pluracol TP-440 (polyol 5 available from BASF Corporation, Parsippany, NJ) were mixed under mechanical stirring at 200-500 rpm and at 220 F for 2 hours. A green solution was obtained.
A 55 gallon resin tank (made by Amplan Inc., Middlesex, NJ, equipped with vacuum, stirring, pressure, 10 venting valves and temperature control) was filled with a polyisocyanate functional prepolymer, Vibrathane 8011 (available from Uniroyal Chemicals, Middlebury, CT) and the temperature raised to, and maintained at, 170F. In a 15 liter container, 8200 grams of Isonol 93 (available 15 from the Upjohn Co., Kalam~zoo, MI), 1400 grams of TIPA
(tributoxyethyl phosphate, available from FMC Corp. of Nitro, WV), 160 grams of copper chloride solution (5~) and 48 grams of Metacure T-12 (dibutylton dilaurate, available fro~ Air Products, Allertown, PA) were mixed 20 with mechanical stirring at 200-500 rpm for 5 minutes at room temperature. The TIPA increases the solubility of the ingredients; the T-12 is a catalyst. The mixture was then degassed for 30 minutes under vacuum. The mixture was transferred to the 5 gallon curative tank (made by 25 Amplan Inc. and equipped with a mechanical mixer~.
Both the prepolymer and the curative were mixed through an Automatic Process Control dispenser to produce a uniform mixing. By adjusting the flow rate for each tank, 148600 grams of the prepolymer (Vibrathane 8011) 30 and 9800 grams of the curative were mixed thoroughly.
The mixture was charged to each casting mold surrounding the steel cores. The mixture then was cured in the casting mold at 260F for 20 minutes. It was then demolded and left in the oven at 230F for 12 hours.
- 7 - ~J939.~-~
The cased roller was then ground to obtain the specified dimensions. The finished part has hardness of 53 Shore A and had electrical resistivity of 3 x 109 ohms-cm.
Example 2 - Conductive Laser Roller A second conductive laser roller was made by an analagous procedure as in Example 1, except that the formulation was changed to the following:
ComponentsWeiqht (qrams) copper Chloride 800 The finished part had a hardness of 53 Shore A and a resistivity of 1.5 x 109 ohms-cm.
Example 3 -- ~on-Foam Polyurethane Formulation and the Effect of Varyina the Quantity of Metal Salt A 0.5% solution of copper chloride (lOg) is added to l90g of Metacure T-12 and mixed until the copper chloride dissolved. The resulting copper chloride solution (165g) was mixed with 8200 grams of polyol-234-630 (polyglycol, available from BASF, NJ), and this 25 solution is mixed with 1300 grams of trisopropanolamine 99 (available from Dow Chemical USA, MO) at room temperature. This solution (30.4g) is then vigorously mixed with 455g of Vibrathane 8011 at 90-110F. The mixture was then poured into multiple cavity molds and 30 cured at 220-250F for 30 minutes. It was demolded and post-cured in an oven at 220F for 12 hours. The urethane rubber had a resultant of 3.5 x 109 ohms-cm.
The amount of copper chloride in the material was O.03%. Further materials were made in which the quantity 35 of copper chloride was increased while the remaining materials remained the same. The resistivity dropped 2 ~
- ~ -tmore conductivity) as the level of copper chloride increased, as follows:
Amount (arams) of CuCl2 per lOOg of polyol Resistivity (ohms-cm~
5.0 x 10-6 4.0 x 101 5.0 x 10-5 3.5 x 109 7 x 10-5 3.0 x 109 9.4 x 10-5 2.1 x 109 1.5 x 10-4 1.7 x 109 2.0 x 10-4 1.2 x 109 3.0 x 10-4 9.0 x 108 5.0 x 10-4 7.0 x 108 9.0 x 10-3 2.0 x 108 1.4 x 10-2 7.6 x 107 1.9 x 10-2 1.8 x 107 2.5 4.4 x 106 5.0 5.0 x 105 Example 4 -- Other Non-Foam Polyurethane Formulations A metal salt solution (25%) was formulated with 15 grams of the metal salt; 20 grams of a flame retardant, tri-(B-chloropropyl)phosphate; 20 grams of Isonol 93; and 5 grams of tributoxyethyl phosphate. The metal salts that were used in the solution included zinc chloride, 25 cobalt chloride, iron oxalate, lithium chloride, copper bromide chromium chloride, and copper chloride, all of which were purchased from Aldrich Chemical Co. of Milwaukee, Wisconsin. The salts were ground and dried prior to use. The solutions were prepared by 30 mechanically mixing ~t 200-500 rpm at 150F for 1-3 hours.
The 25~ metal salt solution (50 grams) was combined with a 38 grams of an extender MOCA (4,4'-diamino-3,3'-dichlorodiphenylmethane, available from 35 Palmer Davis Seikra, Inc., NY), and a polyurethane c~ 3 1 g prepolymer, Vibrathane B-601 (a polyester/TDI prepolymer, available from Uniroyal Chemical). This was done by adding first the MOCA and then the prepolymer to the metal solution, with mixing, at 180-220F. Vigorous 5 mixing continued for 2-5 minutes.
The mixtures were then poured into a multiplecavity metal mold, and the prepolymer was cured at 220-250F for 30 minutes. The material was removed from the mold and post-cured in an oven for 12 to 20 10 hours at 200F, after which curing was completed by letting the material sit at room temperature for at least 3 days to complete curing.
The polymeric materials that were obtained had the following resistivities:
Salt Resistivity (ohms-cm~
zinc chloride2.5 x 101 cobalt chloride1.2 x 1ol0 iron chloride1.0 x 106 iron oxalate 1.3 x 101 lithium chloride1.6 x 101 copper bromide1 x 1o6 chromium chloride 1.9 x 101 copper chlorids5.0 x 1o6 Example 5 -- Polyurethane Foams The following conductive foams were prepared according to the same general procedure used above. The numbers in the table are the grams of the particular ingredient included in the example. The metal salt solutions were prepared as described previously; a foam 30 agent such as methylene chloride, H2O was used. The notes at the end of the table supply further information concerning the ingredients.
- lo - 2~, 3~99~
ExamDle ~
In~redient~ 1 2 3 4 5 6 7 8 p_3801450325 143 155 180180180 400 DC 20021.8 1.8 6.6 10 76.6 7 7 81ack ~48003 6 6 2.33 3.5 5 2.33 5 15 Methylene 6 16 4.33 65 4.33 4.33 4.33 4.33 chloride Water3.53.5 1.3 2.25 1 1 1 0.5 DABCo43.53.5 1.1 0.5 0.51.16 drop drop B-9-885 1 1 0.33 0.5 0.33 0.33 0.33 20 ~--1260.10.1 -- -- -- -- -- --Mondur~ PF7 120 120 56.7 70 50 50 50 53 (22.6%) 35 Metal Salt - 0.5 33.3 25 40 40 40 60 Formula CuC1z CuClz FeClz F~Clz CuClz ~C12 CuCl CuCl Solution 25~ 25~ 25~ 25~ 15~ 20% 20~2 2~
Shoro A 15A 20A 20A 20A 15A 20A loA 30A
40 R~tMq 5xl0l 3xl0 1 ~1o8 sxlo7 5xl07 3~l07 3xl07 ~lO
~OHM~) NOTES
1. P-380 (Pluracol polyol 380) iS a polyether polyol available from BASF Corporation of Wyandotte, Missouri.
2. A silicone surfactant available from Dow Corning.
3. Black #4800 is a black pigment from Pigment Dispersions, Inc.
4. DABC0 is a triethylenediamine catalyst available from Air Products, Inc.
5. B-9-88 (Benzoflex 9-88) is a benzoate ester plasticizer available from Harcros Chemicals Inc.
6. T-12 is Metacure T-12 catalyst.
A further example of a conductive polyurethane foam included 60g of 20% copper chloride solution, prepared as previously described; 3.5g of trimethylolpropane, (available from Celanese Chemical 10 Company of Dallas, Texas); 7g of DC 200; 0.5g of water;
4.3g of methylene chloride; 20g of the B-9-88; and 400g of Vibrathane 8011. The material was prepared by following the same general procedures previously described. The foam had a resistivity of 8 x 106 ohm/cm.
Example 6 -- Semiconductive Rubber Conductive rubber materials are prepared as follows.
Iron Chloride (15g, purchased from Johnson Mathley Electronics of Ward Hill, Massachusetts) are added to 85g 20 of the plasticizer dibutyl phthalate. The mixture is heated to 200C and mechanically stirred for 4 hours. A
dark solution is obtained.
This solution is mixed with rubber materials (such as natural rubber, nitrile rubber, EPDM, styrene 25 hutadiene rubber, neoprene rubber, polysulfide rubber), and polyacrylate rubber, sulfer, and additives for rubber compounding. The rubber was then compression molded at 300psi and 300 F for 20 minutes to cure the rubber.
Example 7 -- Adhesive A copper chloride solution is mixed with a curative and adhesive, such as Thixon 405 (available from Morton International), Chemlok 205, 213, and 214 (available from Lord Corp.), and Conap 1146 (available from Conap Corp~. These adhesives were mixed with copper 35 chloride solutions to provide rubber materials with ~ t J ;j~ '`J (3 4 resistivitieæ of betw~n 1 x 107 ohms-cm and 1 x 1012 ohms-cm. It is then coatad on metal surfaces, dried and casted with urethane rubber~
Example 8 -= Hot Melt Plastic materials are melted and mixed with metal salts under heat. The molten polymer was poured with into mold to form conductive parts, "cure", as used herein, is meant to include this procedure, as well as procedures in which the prepolymer actually cross-links 10 and chemically reacts to form further bonds. The plastic material used should contain electrons donor groups or atoms such as oxygen, nitrogen, sulfur, halides, or unsaturated bonds. The plastic material can be, for example, a polycarbonate, polyimide, polyamide, 15 polysulfer, or fluorocarbon.
Other embodiments are within the following claims.
A further example of a conductive polyurethane foam included 60g of 20% copper chloride solution, prepared as previously described; 3.5g of trimethylolpropane, (available from Celanese Chemical 10 Company of Dallas, Texas); 7g of DC 200; 0.5g of water;
4.3g of methylene chloride; 20g of the B-9-88; and 400g of Vibrathane 8011. The material was prepared by following the same general procedures previously described. The foam had a resistivity of 8 x 106 ohm/cm.
Example 6 -- Semiconductive Rubber Conductive rubber materials are prepared as follows.
Iron Chloride (15g, purchased from Johnson Mathley Electronics of Ward Hill, Massachusetts) are added to 85g 20 of the plasticizer dibutyl phthalate. The mixture is heated to 200C and mechanically stirred for 4 hours. A
dark solution is obtained.
This solution is mixed with rubber materials (such as natural rubber, nitrile rubber, EPDM, styrene 25 hutadiene rubber, neoprene rubber, polysulfide rubber), and polyacrylate rubber, sulfer, and additives for rubber compounding. The rubber was then compression molded at 300psi and 300 F for 20 minutes to cure the rubber.
Example 7 -- Adhesive A copper chloride solution is mixed with a curative and adhesive, such as Thixon 405 (available from Morton International), Chemlok 205, 213, and 214 (available from Lord Corp.), and Conap 1146 (available from Conap Corp~. These adhesives were mixed with copper 35 chloride solutions to provide rubber materials with ~ t J ;j~ '`J (3 4 resistivitieæ of betw~n 1 x 107 ohms-cm and 1 x 1012 ohms-cm. It is then coatad on metal surfaces, dried and casted with urethane rubber~
Example 8 -= Hot Melt Plastic materials are melted and mixed with metal salts under heat. The molten polymer was poured with into mold to form conductive parts, "cure", as used herein, is meant to include this procedure, as well as procedures in which the prepolymer actually cross-links 10 and chemically reacts to form further bonds. The plastic material used should contain electrons donor groups or atoms such as oxygen, nitrogen, sulfur, halides, or unsaturated bonds. The plastic material can be, for example, a polycarbonate, polyimide, polyamide, 15 polysulfer, or fluorocarbon.
Other embodiments are within the following claims.
Claims (23)
1. An electrically conductive or semi-conductive polymeric material, comprising a solid solution of metal salt in polymer, said metal salt being complexed with said polymer to provide said material with a resistivity of between about l012 ohms-cm and 105 ohms cm.
2. The polymeric material of claim 1, wherein said polymeric material comprises less than 5% of said metal salt by weight.
3. The polymeric material of claim 2, wherein said polymeric material comprises less than 0.2% of said metal salt by weight.
4. The polymeric material of claim 1, wherein the molecular size of said metal salt is of between about 1.ANG. and 10.ANG..
5. The polymeric material of claim 1, wherein said polymer is an elastomeric polymer.
6. The polymeric material of claim 1, wherein said polymer is a polyurethane foam.
7. The polymeric material of claim 5, wherein said elastomeric polymer is a polyurethane.
8. The polymeric material of claim 5, wherein said elastomeric polymer is a rubber.
9. The polymeric material of claim 8, wherein said rubber is selected from the group consisting of nitriles, natural rubbers, neoprenes, fluorocarbons, and silicones.
10. The polymeric material of claim 8, said material further comprising a plasticizer.
11. The polymeric material of claim 1, wherein said polymeric material comprises less than 1% of said metal salt by weight.
12. The polymeric material of claim 1, wherein said polymer is an adhesive polymer.
13. The polymeric material of claim 1, wherein said polymer is a plastic, containing electron donating substituents.
14. The polymeric material of claim 1, wherein said material has a resistivity of between about 107 ohms-cm and 109 ohms-cm.
15. The polymeric material of claim 1, wherein said metal salt is a transition metal halide.
16. The polymeric material of claim 1, wherein said metal salt is selected from the group consisting of CuCl2, CuBr2, CoCl2, ZnCl2, NiCl2, FeCl2, Cu(N03)2, FeBr2, LiBF4, and H4Fe(CN)6, CuI2, FeI3, FeCl3, FeBr3, copper lactate, copper tartrate, iron phosphate, and iron oxalate.
17. A roller comprising a cylinder having a surface comprising a conductive or semi-conductive polymeric material comprising a solid solution of a metal salt in a polymer, wherein said metal salt is complexed with said polymer to provide said polymeric material with a resistivity of between about 1012 ohms-cm and 105 ohms-cm.
18. The roller of claim 17 wherein said polymeric material comprises a polyurethane polymer.
19. A method of making an electrically conductive or semi-conductive polymeric material having a resistivity of between 1012 ohms-cm and 105 ohms-cm, said method comprising mixing a metal salt with a polymer or polymer precursor to provide a solution that includes said metal salt and said polymer or polymer precursor;
curing said solution to provide a polymeric material in which said metal salt is complexed to said polymer or a polymer produced from said polymer precursor;
wherein a sufficient quantity of said metal salt is mixed with said polymer of polymer precursor so that the resistivity of said polymeric material is between 1010 ohms-cm and 105 ohms-cm.
curing said solution to provide a polymeric material in which said metal salt is complexed to said polymer or a polymer produced from said polymer precursor;
wherein a sufficient quantity of said metal salt is mixed with said polymer of polymer precursor so that the resistivity of said polymeric material is between 1010 ohms-cm and 105 ohms-cm.
20. The method of claim 19 wherein said polymeric material comprises less than 1% of said metal salt by weight.
21. The method of claim 19, wherein said polymer precursor is an isocyanate-functional prepolymer.
22. The method of claim 19, wherein an extender is also mixed with said polymer precursor and said metal salt to provide said curable mixture.
23. The method of claim 19, wherein said extender is a polyol or a polyamine.
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US87061092A | 1992-04-16 | 1992-04-16 | |
US07/870,610 | 1992-04-16 |
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CA 2093994 Abandoned CA2093994A1 (en) | 1992-04-16 | 1993-04-14 | Electrically conductive and semi-conductive polymers |
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US (3) | US6063499A (en) |
EP (2) | EP0566418A2 (en) |
JP (1) | JPH0616948A (en) |
KR (1) | KR100284640B1 (en) |
CN (1) | CN1082240A (en) |
AU (1) | AU3692693A (en) |
CA (1) | CA2093994A1 (en) |
MX (1) | MX9302237A (en) |
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-
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- 1993-04-14 CA CA 2093994 patent/CA2093994A1/en not_active Abandoned
- 1993-04-14 JP JP11103293A patent/JPH0616948A/en active Pending
- 1993-04-15 CN CN93104548A patent/CN1082240A/en active Pending
- 1993-04-15 KR KR1019930006290A patent/KR100284640B1/en not_active Expired - Lifetime
- 1993-04-15 EP EP19930302947 patent/EP0566418A2/en not_active Withdrawn
- 1993-04-15 AU AU36926/93A patent/AU3692693A/en not_active Abandoned
- 1993-04-15 EP EP19990203759 patent/EP0982739A1/en not_active Withdrawn
- 1993-04-16 MX MX9302237A patent/MX9302237A/en unknown
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1997
- 1997-07-24 US US08/899,678 patent/US6063499A/en not_active Expired - Lifetime
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2000
- 2000-04-21 US US09/557,062 patent/US6361484B1/en not_active Expired - Fee Related
-
2001
- 2001-12-11 US US10/016,046 patent/US20020077402A1/en not_active Abandoned
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CN1082240A (en) | 1994-02-16 |
EP0566418A2 (en) | 1993-10-20 |
US6361484B1 (en) | 2002-03-26 |
KR100284640B1 (en) | 2001-03-15 |
JPH0616948A (en) | 1994-01-25 |
AU3692693A (en) | 1993-10-21 |
US6063499A (en) | 2000-05-16 |
EP0982739A1 (en) | 2000-03-01 |
US20020077402A1 (en) | 2002-06-20 |
KR930022392A (en) | 1993-11-24 |
EP0566418A3 (en) | 1994-04-20 |
MX9302237A (en) | 1994-04-29 |
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