CN101582419A - 用于小型表面安装器件的装置和系统 - Google Patents

用于小型表面安装器件的装置和系统 Download PDF

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CN101582419A
CN101582419A CNA2009101454123A CN200910145412A CN101582419A CN 101582419 A CN101582419 A CN 101582419A CN A2009101454123 A CNA2009101454123 A CN A2009101454123A CN 200910145412 A CN200910145412 A CN 200910145412A CN 101582419 A CN101582419 A CN 101582419A
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CN101582419B (zh
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亚历克斯·陈
王璇
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Cree Huizhou Solid State Lighting Co Ltd
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Abstract

本发明为用于小型表面安装器件的装置和系统。在一个实施例中,表面安装器件包括具有相对的第一和第二主表面、侧表面以及端表面的壳体。由壳体部分包封的引线框包括:(1)导电LED芯片装载件,该芯片装载件具有装载适于通电以组合地产生基本上全范围颜色的LED线性阵列的表面,每个LED具有第一电气端子和第二电气端子,每个LED的第一电气端子电气和热耦合至芯片装载件的芯片装载表面;和(2)与芯片装载件分开的导电连接件,这些连接件中的每一个具有连接垫,LED中的每一个的第二端子利用单根丝焊电气耦合至连接件中相应一个的连接垫。LED线性阵列沿第一方向延伸,芯片装载件和连接件中的每一个具有引线。引线可彼此平行地设置并沿第二方向穿过壳体的端表面延伸,该第二方向正交于第一方向。表面安装器件的阵列可用于诸如室内LED屏幕之类的LED显示器。

Description

用于小型表面安装器件的装置和系统
本发明总体涉及电子组装,更具体来说,涉及用于LED显示器的表面安装器件(SMD)。
发明背景
技术领域
近年来,在发光二极管(LED)技术方面已有极大的改进,已引入了亮度和彩色逼真度提高的LED。由于这些改进的LED和改进的图像处理技术,已可获得大型、全色彩的LED视频屏幕并且它们现已得到普遍使用。大型LED显示器通常包括单独LED面板的组合,其所提供的图像清晰度由相邻像素之间的距离或称像素节距来确定。
用于从更大距离进行观看的室外显示器具有相对较大的像素节距且通常包括分立的LED阵列。在分立的LED阵列中,驱动一束单独安装的红色、绿色和蓝色LED以形成观看者看来如一个全色像素的单元。另一方面,要求较近的,如3mm或更近的像素节距的室内屏幕包括载有安装在单个SMD芯片组上的红色、绿色和蓝色LED的面板,每个芯片组形成一个像素。相对较小的SMD附连于驱动器印刷电路板(PCB)上。
尽管室内和室外显示器都可在大至145°或甚至更大的较大离轴角度范围中进行观看,但随着观看角度的增加会有可察觉的彩色逼真度损失。此外,每个LED组件的材料和/或用于安装每个LED的材料可能具有反射特性,这会由于产生不想要的光反射和/或眩光而进一步降低彩色逼真度。
还有,在本技术领域中的人们熟知,SMD和许多其它类型的电子组件,无论它们包含集成电路或是诸如二极管或功率晶体管之类的分立的元件,都会散发出足以需要进行热管理的热。在电子组装设计中的热管理目标是保持有源电路或元件连结侧的工作温度,以使其足够低(例如110℃或更低)以防止元件的过早失效。人们通常使用包括传导式热传递在内的各种冷却策略。在电子组件中实现用于散热的传导式热传递的一种传统方式是使热量能沿着器件的引线传导离开。然而,引线通常没有足够的质量或暴露表面积来提供有效的散热。例如,在发出主要是电磁波谱的可见部分中的光的高密度LED可能会产生大量的热,使用这样的传统技术很难消散这些热。
发明内容
本发明涉及用于表面安装器件的系统和设备,它们能提高彩色逼真度和热消散同时降低所不想要的光反射和眩光。一个实施例包括用于表面安装器件的引线框,该引线框包括导电LED芯片装载件,该芯片装载件具有装载适于通电以组合地产生基本上全范围颜色的LED线性阵列。每个LED具有第一电气端子和第二电气端子,LED中的每一个的第一端子电气和热耦合至芯片装载件的芯片装载表面。引线框和包括与芯片装载件分开的导电连接件,这些连接件中的每一个具有连接垫块。LED中的每一个的第二端子电气耦合至连接件中的相应一个的连接垫块。引线框还包括至少部分包封引线框的黑色壳体。
根据另一特定的示范性实施例,提供一种表面安装器件,该表面安装器件包括壳体,该壳体包括相对的第一和第二主表面、相对的侧表面以及相对的端表面,并形成从第一主表面伸入壳体内部的空腔。该表面安装器件还包括由壳体部分包封的引线框,该引线框包括:(1)导电LED芯片装载件,该芯片装载件具有装载适于通电以组合地产生基本上全范围颜色的LED线性阵列的表面,每个LED具有第一电气端子和第二电气端子,每个LED的第一电气端子电气和热耦合至芯片装载件的芯片装载表面;和(2)与芯片装载件分开的导电连接件,这些连接件中的每一个具有连接垫,LED中的每一个的第二端子电气耦合至连接件中相应一个的连接垫。
根据再一特定的示范性实施例,提供一种LED显示器,该显示器包括基底,该基底装载以垂向列和水平行布置的表面安装器件阵列,表面安装器件中的每一个包括深色壳体并包含垂向定向的LED线性排列,该LED线性排列适于在通电时组合地产生基本上全范围的颜色并形成显示器的一个像素。信号处理和LED驱动电路系统电气连接成选择性地对表面安装器件阵列通电以在显示器上产生可视图像。已发现这样的LED线性定向可在宽范围的观察角度中提高彩色逼真度。
在结合附图阅读了下面的详细描述之后,本领域的技术人员会明白本发明的这些和其它的特征和优点,在附图中:
附图说明
图1是根据本发明的表面安装器件的立体图;
图2是图1所示实施例的俯视图;
图3是如沿着图2的线3-3所见的图1实施例的剖视图;
图4是图1所示实施例的仰视图;
图5是图1所示实施例的端视图;
图6是可在图1的器件中使用的根据一个实施例的引线框的立体图;
图7是图6所示实施例的俯视图;
图8是图6所示实施例的侧视图;
图9是根据本发明的表面安装器件的另一实施例沿着图3所示线的剖视图;
图10是图9所示实施例的仰视图;
图11是图9所示实施例的端视图;
图12是根据本发明的表面安装器件的一个实施例的立体图;
图13是图12所示实施例的仰视图;
图14是图12所示实施例的前侧视图,其背侧以及左侧和右侧基本上类似;
图15是根据本发明的表面安装器件的一个实施例的俯视尺寸图;
图16是图15所示实施例的仰视尺寸图;
图17是图15所示实施例的右侧尺寸图;
图18是采用根据本发明实施例的表面安装器件的LED显示屏幕的一部分的前视图;
具体实施方式
下面的描述给出本发明较佳实施例,它们代表为实施本发明所设计的最佳模式。不应以限制的意思来理解本描述,作出本描述仅仅是用于描述本发明的总体原理,本发明的保护范围由所附权利要求书限定。
图1-8示出根据用于诸如室内和/或室外LED屏幕的LED显示器中的特定的示范性实施例的表面安装器件(SMD)10及其零件。SMD 10包括载有引线框14的壳体12,引线框14包括多个导电连接件,这些导电连接件在本例子中包括四个连接件16、18、20、22(图6最清楚地示出)。
壳体12可以大体呈矩形,包括相对且平行的上表面24和下表面26、侧表面28和30以及端表面32和34。壳体的角部可呈圆形以用作通孔,如下面结合图8所最清楚地描述的那样。
以举例而非限制的方式,并如图12-14中最清楚地示出的那样,SMD 10的总长为约2.0mm,总宽为约2.0mm以及高0.90mm。
该壳体还形成从上表面24伸入壳体12的本体的凹陷或空腔36。在一些实施例中,反射插入件或环38可沿着在空腔36的侧部或壁40的至少一部分定位并固定,较佳地通过使空腔36和装载于其中的环38向内朝向壳体的内部成锥度来增强环38的反射性的效用。
在一些实施例中,空腔36可以至少部分地填充有填充材料42。填充材料42可保护并在位置上稳定引线框14以及籍由其装载的LED。在一些例子中,填充材料42可覆盖LED、引线框连接件16、18、20、22通过空腔36而暴露的部分以及LED的电气连接。填充材料42可选择成具有预定的光学性能,从而加强从LED投射的光。填充材料42可由树脂、环氧化物、热塑性缩聚物、玻璃和/或其它合适的材料或材料的组合制成。在一些实施例中,可对填充材料添加一些材料,以增强至LED或从LED的光发射、吸收和/或色散。
壳体12可由较佳的是既电气绝缘又导热的材料制成。这样的材料在本领域中是人们熟知的,可包括(并非限制):某些陶瓷、树脂、环氧化物、热塑性缩聚物(例如聚邻苯二酰胺(PPA))以及玻璃。在较佳的实施例中,壳体12可由黑色陶瓷材料制成。已发现,在诸如视频显示器中采用的SMD之类的图像生成SMD组件中使用黑色材料可提高对比度。
在所述的说明性实施例中,SMD 10容纳有较佳的是分别发出红色、绿色及蓝色光的三个LED 44、46、48,从而当合适地通电时这三个LED组合地产生基本上全范围的颜色。
在所示的说明性实施例中,引线框连接件16、18、20、22分别包括引线50、52、54、56,这些引线从壳体12的中心区域58穿过壳体的相对端表面32和34向外凸伸。
连接件16包括芯片装载件,该装载件具有加大的中心表面或垫块60,用于以沿横向62,即垂直于侧表面28和30的方向延伸的线性阵列装载LED芯片44、46、48。引线50、52、54、56彼此平行并沿垂直于线性LED阵列的方向62的方向延伸。引线的宽度可以是相当小的,以致当从顶上观看SMD 10时,它们几乎是不可见或完全不可见。附加地和/或可替代地,引线可被壳体12挡住而无法从顶上看见。垫块60包括导热体64的顶表面,导热体64例如呈矩形块的形式,垂向地穿过壳体12延伸到导热体64的底表面66,底表面66通过壳体12的下表面26中的孔68外露并设置成与下表面26基本上齐平。
连接件60的本体的底表面66适于设置成与散热器或称消热器70成热传递关系,散热器或称消热器70由诸如印刷布线或电路板之类的基底72载带。可以看到,导热体64由于具有正交于热流方向的相对较大的质量和横截面积,可用作有效的散热装置,在由垫块60装载的发热LED44、46、48与散热器70之间提供低热阻路径(箭头74)。一些热还沿着引线50(箭头76)消散。
其余的连接件18、20、22分别包括加大的电气连接垫块78、80、82,这些电气连接垫块位于中心区域58中并与连接件16装载元件的表面60相邻但间隔开。在SMD的较佳形式中,引线50、52、54、56直角地弯曲以在壳体外侧并沿着壳体的相应端表面32和34延伸,然后再次直角地弯曲以使引线的端部84、86、88、90沿着壳体12的下表面26延伸。引线端部84、86、88、90面向外的表面和导热体64的底表面基本上齐平以便于连接至下面的基底72。引线端部84、86、88、90可利用许多人们熟知的连接技术(包括钎焊)电气连接或结合到基底72上的迹线或垫块。在一个较佳的实施例中,钎焊垫块包括在端部的底部上,从而当从顶上观看各单独的SMD时看不见任何焊料。这是有利的,因为这可帮助防止眩光并改善对比度,特别是在白天观看时。如在图1-3中最清楚可见的那样,空腔36伸入壳体内部足够的深度,以暴露连接件垫块60以及78、80、82。
引线50、52、54、56的端部84、86、88、90从壳体的端表面32和34向内延伸的尺寸可取决于SMD的实施方式、所用的LED、壳体12的材料、SMD的尺寸和/或其它这样的因素和/或因素的组合。在一些实施方式中,在壳体外部的每个引线50、52、54、56在垫块间可分开间隙92,以将连接件彼此电气隔离。
连接件16、18、20、22可由导电金属或金属合金制成,如铜、铜合金和/或其它合适的低电阻率、耐腐蚀材料或材料的组合。如可注意到的,连接件16的引线50的导热性在某种程度上可帮助从SMD所装载的LED 44、46、48将热引导走,如箭头76所示。
如人们所熟知的那样,每个LED 44、46、48具有被称为阴极和阳极的一对电气端子或电极。根据所示实施例的典型实施方式,LED 44、46、48的阴极耦合至中心垫块60,而LED的阳极分别通过单个丝焊耦合至各单独连接件的垫块78、80、82。
LED 44、46、48中的每一个借助于导电导热的接口100与垫块60电气耦合,前述接口如焊料、粘结剂、涂层、薄膜、密封件、膏剂、油脂和/或其它合适的材料。在一个较佳的实施例中,LED可利用在LED底部上的焊料隆起焊盘而与垫块60电气耦合并固定于其,以使从顶上看不见焊料。防止从顶上看见焊料是有利的,可减少反射并提供更好的对比度,尤其在白天的时候。
在其它的实施例中,引线50、52、54、56中的一个或更多个还可包括一个或更多个缺口、通孔或孔、延伸部和/或其它有助于SMD组件的稳定性、整体性和/或坚固性的结构。例如,引线50、52、54、56可分别包括缺口102、104、106、108,它们大体沿着引线的外侧边缘延伸。引线的缺口和/或其它这样的结构与壳体和/或填充材料至少部分地协配,以增强SMD组件的结构稳定性和整体性。在一些实施方式中,壳体材料和/或填充材料至少部分地围绕、伸入和/或穿过间隙92中的一个或多个以及由形成在引线中的缺口102、104、106、108所露出的区域延伸。
SMD 10可通过各种已知方法中的任一种来形成和/或装配。例如,壳体12可围绕连接件16、18、20、22来形成或模制。可替代地,壳体可以分部分来模制,例如分为随后可由环氧化物、粘结剂或其它合适的连结材料来连结的顶部和底部。
在一些制造方法中,LED可在围绕连接垫块模制和/或装配壳体12之前耦合至垫块60。可替代地,LED可在连接件已部分地包封在壳体内之后耦合至垫块60。伸入壳体的空腔36可以构造成垫块60以及78、80、82有足够的部分暴露以接纳LED和相关联的丝焊。
连接件16、18、20、22的制造可以通过冲压、注塑、切割、蚀刻、弯曲或通过其它已知方法和/或方法的组合来实现,以形成所想要的构造。例如,连接件可部分地金属冲压(例如同时从单片相关材料中冲压),合适地弯曲,最后完全分开,或在形成一些或全部壳体之后完全分开。
图9-11示出根据用举例方式来说的用于LED显示屏幕的另一特定示范性实施例的表面安装器件200。图9-11的SMD 200除了省去了导热体64之外,在所有方面均与图1-8所示的实施例相同。因此,图9-11的SMD包括较佳的是黑色陶瓷壳体202,该壳体包括相对的上表面204和下表面206、侧表面208、210以及端表面212、214。SMD 200装载有引线框216,如前面的例子那样,引线框216包括四个电气连接件,这些电气连接件分别包括芯片装载件218和三个单独的连接件(包括连接件220)以及从壳体的中心区域230穿过壳体的相对端表面212、214向外凸伸的引线222、224、226、228。芯片装载件218具有用于接纳LED芯片的加大的中心表面或垫块232,LED芯片通常包括红色、绿色以及蓝色LED。如前面的例子那样,其余连接件包括加大的丝焊垫块,这些丝焊垫块位于中心区域并与芯片装载件218相邻但间隔开。
如前面的例子那样,引线222、224、226、228直角地弯曲以沿着其相应的壳体端表面并在它们外侧延伸,然后再次直角地弯曲,以使引线222、224、226、228的端部234、236、238、240沿着壳体的底表面206延伸。引线的端部234、236、238、240的面向外表面利用许多已知的连接技术电气连接或结合至基底242上的迹线或垫块,基底242通常为印刷电路板。如前面的例子那样,壳体具有延伸足够的深度以露出连接件的垫块的空腔214。连接件较佳的是由导电金属片或金属合金片制成,该金属片或金属合金片通过冲压加工从金属片原料中切下,然后在围绕引线框形成壳体之前或之后弯曲成它们的最终构造。
每个LED具有一对电气端子或电极,其中的阴极电气耦合至中心垫块232,而LED的阳极则分别通过单根丝焊耦合至各单独连接件的垫块。
现参见图12-17,图中示出SMD 250的各个部件的尺寸特征的一些例子。以举例方式而非限制,图12-17中所描述的尺寸也可以应用于SMD 10或200的共有结构。可注意到,SMD 250的引线结构布置得与SMD 10或200的引线结构稍有不同。不过,该不同的构造描述的是另一可能的实施例,不会影响本发明的功能性。图13示出可帮助进行热管理以从任何安装的器件消散热量的热垫块252。
参见图18,以示意的形式示出例如室内屏幕的一LED显示屏幕300的一部分,通常来说包括驱动器PCB 302,它装载有成行和成列布置的大量表面安装器件304,每个SMD形成一个像素。SMD 304可包括诸如图1-8、9-11以及12-17所示实施例的器件。SMD器件304电气连接至PCB 302上的迹线或垫块,PCB 302连接成可对合适的电气信号处理和驱动器电路系统(未示出)作出响应。
如上所述,每个SMD装载有红色、绿色和蓝色LED的垂向定向线性阵列306。已发现这样的LED线性定向可在宽范围的观察角度中提高彩色逼真度。也可设置通孔308以使陶瓷SMD本体更好且距离更短地与PCB接触。通孔308还可改善热消散。
尽管已图示和描述了本发明的若干说明性实施例,但熟悉本领域的技术人员会想到许多变化形式和可替代的实施例。可构想这样的变化形式和可替代实施例,并且它们可不超出所附权利要求书中所定义的本发明的精神和范围。

Claims (11)

1.一种用于表面安装器件的引线框,所述引线框包括:
导电LED芯片装载件,所述芯片装载件具有装载适于通电以组合地产生基本上全范围颜色的LED线性阵列的表面,每个LED具有第一电气端子和第二电气端子,所述LED中的每一个的第一电气端子电气和热耦合至所述芯片装载件的所述芯片装载表面;
与所述芯片装载件分开的导电连接件,所述连接件中的每一个具有连接垫块;
所述LED中的每一个的第二端子电气耦合至所述连接件中的相应一个的连接垫块;以及
黑色壳体,所述壳体至少部分地包封所述引线框。
2.如权利要求1所述的引线框,其特征在于,所述LED线性阵列沿第一方向延伸,所述芯片装载件和连接件中的每一个具有引线,所述引线设置成彼此成平行关系并沿第二方向延伸,并且,所述第二方向垂直于所述第一方向。
3.如权利要求1所述的引线框,其特征在于,所述芯片装载件具有电气耦合至所述芯片装载表面的引线,所述引线具有一厚度,并且所述芯片装载件的所述芯片装载表面包括导热体的表面,所述导热体沿正交于所述芯片装载表面的方向延伸,并且所述导热体的厚度大于所述芯片装载件引线的厚度。
4.如权利要求1所述的引线框,其特征在于,所述LED包括红色、绿色以及蓝色LED。
5.如权利要求1所述的引线框,其特征在于,所述LED中的每一个的第二电气端子通过单根丝焊电气耦合至相关联连接件的连接垫块。
6.如权利要求1所述引线框,其特征在于,所述LED中的每一个经由焊料耦合至相应的连接垫块。
7.如权利要求6所述的引线框,其特征在于,在从顶上观看所述引线框时所述焊料是不可见的。
8.如权利要求1所述的引线框,其特征在于,所述壳体包括相对的第一和第二主表面、相对的侧表面以及相对的端表面,所述壳体形成从所述第一主表面伸入所述壳体的内部的空腔。
9.如权利要求8所述器件,其特征在于,所述芯片装载件的所述芯片装载表面包括沿正交于所述芯片装载表面的方向延伸至所述导热体的底表面的导热体的表面,所述导热体的底表面通过形成在所述壳体的第二主表面中的孔而外露。
10.一种LED显示器,该显示器包括:
基底,所述基底装载以垂向列和水平行布置的表面安装器件阵列,所述表面安装器件中的每一个包括深色壳体并包含垂向定向的LED线性排列,所述LED线性排列适于通电以组合地产生基本上全范围的颜色并形成所述显示器的一个像素;以及
信号处理和LED驱动电路系统,所述电路系统电气连接成选择性地对所述表面安装器件阵列通电以在所述显示器上产生可视图像。
11.如权利要求10所述的显示器,其特征在于,每个表面安装器件的所述壳体包括圆形边缘,以致在所述表面安装器件布置在所述基底上时形成通孔,所述通孔帮助进行热管理。
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CN102386307A (zh) * 2010-09-03 2012-03-21 惠州科锐光电有限公司 具有对比面的led封装
CN103190006A (zh) * 2010-11-03 2013-07-03 科锐香港有限公司 白色陶瓷led封装
TWI609508B (zh) * 2010-11-03 2017-12-21 惠州科銳半導體照明有限公司 具有大型接腳墊片的微型表面安裝元件
CN102934228A (zh) * 2011-03-02 2013-02-13 惠州科锐半导体照明有限公司 微型表面安装器件
CN102934228B (zh) * 2011-03-02 2017-09-01 惠州科锐半导体照明有限公司 发光二极管封装件及发光二极管
CN109237319A (zh) * 2013-06-28 2019-01-18 皇家飞利浦有限公司 将led裸片与引线框架带的接合

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