CN102694103B - Led封装结构 - Google Patents
Led封装结构 Download PDFInfo
- Publication number
- CN102694103B CN102694103B CN201110073542.8A CN201110073542A CN102694103B CN 102694103 B CN102694103 B CN 102694103B CN 201110073542 A CN201110073542 A CN 201110073542A CN 102694103 B CN102694103 B CN 102694103B
- Authority
- CN
- China
- Prior art keywords
- encapsulation structure
- plane
- led chip
- led
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000031700 light absorption Effects 0.000 abstract 4
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004954 Polyphthalamide Substances 0.000 description 6
- 229920006375 polyphtalamide Polymers 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
LED封装结构 | 10 |
基板 | 12 |
顶面 | 120 |
底面 | 1202 |
电极 | 122、124 |
反射层 | 14 |
第一斜面 | 142 |
第一倾斜角 | α |
光吸收层 | 15 |
第二斜面 | 152 |
第二倾斜角 | β |
荧光层 | 16 |
透明覆盖层 | 162 |
LED芯片 | 18 |
导电线 | 182 |
发射光束 | X |
阳光光束 | Y |
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110073542.8A CN102694103B (zh) | 2011-03-25 | 2011-03-25 | Led封装结构 |
TW100114355A TW201240154A (en) | 2011-03-25 | 2011-04-25 | Structure of the LED package |
US13/300,618 US8564003B2 (en) | 2011-03-25 | 2011-11-20 | LED package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110073542.8A CN102694103B (zh) | 2011-03-25 | 2011-03-25 | Led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102694103A CN102694103A (zh) | 2012-09-26 |
CN102694103B true CN102694103B (zh) | 2015-07-08 |
Family
ID=46859447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110073542.8A Expired - Fee Related CN102694103B (zh) | 2011-03-25 | 2011-03-25 | Led封装结构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8564003B2 (zh) |
CN (1) | CN102694103B (zh) |
TW (1) | TW201240154A (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI626395B (zh) | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | 發光裝置 |
CN103762292A (zh) * | 2014-01-17 | 2014-04-30 | 桂林电子科技大学 | 一种使用低反光的黑色emc塑封材料达到高反光效果的led封装工艺 |
CN104392676A (zh) * | 2014-12-11 | 2015-03-04 | 广东威创视讯科技股份有限公司 | 一种led显示屏 |
JP6762736B2 (ja) * | 2015-03-16 | 2020-09-30 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 光反射層付光半導体素子、および、光反射層および蛍光体層付光半導体素子の製造方法 |
US10290783B2 (en) * | 2016-09-21 | 2019-05-14 | Foshan Nationstar Optoelectronics Co., Ltd. | LED bracket, LED device and LED display screen |
JP6485503B2 (ja) * | 2017-08-01 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN110391324A (zh) * | 2018-04-19 | 2019-10-29 | 群创光电股份有限公司 | 发光元件与电子装置 |
US11018284B2 (en) | 2018-04-19 | 2021-05-25 | Innolux Corporation | Light emitting element and electronic device |
CN110970572A (zh) * | 2019-11-14 | 2020-04-07 | 京东方科技集团股份有限公司 | 封装结构、显示面板及显示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090065792A1 (en) * | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
TW200950136A (en) * | 2008-05-26 | 2009-12-01 | wei-hong Luo | LED packaging structure |
TWI456784B (zh) | 2008-07-29 | 2014-10-11 | Nichia Corp | 發光裝置 |
JP5468600B2 (ja) | 2009-03-10 | 2014-04-09 | 株式会社東芝 | 白色ledおよびそれを用いたバックライト並びにebu規格対応液晶表示装置 |
-
2011
- 2011-03-25 CN CN201110073542.8A patent/CN102694103B/zh not_active Expired - Fee Related
- 2011-04-25 TW TW100114355A patent/TW201240154A/zh unknown
- 2011-11-20 US US13/300,618 patent/US8564003B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201240154A (en) | 2012-10-01 |
CN102694103A (zh) | 2012-09-26 |
US20120241790A1 (en) | 2012-09-27 |
US8564003B2 (en) | 2013-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201125 Address after: Group 11, Zhennan community, Chengbei street, Rugao City, Nantong City, Jiangsu Province Patentee after: RUGAO TIANAN ELECTRIC TECHNOLOGY Co.,Ltd. Address before: 518109, Shenzhen, Guangdong, Baoan District province Longhua Street tenth Pine Industrial Zone, No. two, East Ring Road, No. two Patentee before: ZHANJING Technology (Shenzhen) Co.,Ltd. Patentee before: Advanced Optoelectronic Technology Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 |