CN204102898U - 全周光led光源 - Google Patents

全周光led光源 Download PDF

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Publication number
CN204102898U
CN204102898U CN201420494157.XU CN201420494157U CN204102898U CN 204102898 U CN204102898 U CN 204102898U CN 201420494157 U CN201420494157 U CN 201420494157U CN 204102898 U CN204102898 U CN 204102898U
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fluorescent material
led chip
substrate
light source
line
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Expired - Fee Related
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王维昀
李永德
童其武
黄运炬
王琛
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

全周光LED光源，涉及一种LED光源，其包括基板、荧光粉胶层和至少一个LED芯片，每个LED芯片固定于基板的顶面，通过焊接金线来实现LED芯片的电连接，荧光粉胶层设置在基板顶面以将各个LED芯片及所述金线完全覆盖，基板设有荧光粉玻璃层，荧光粉玻璃层位于基板的顶面，并位于LED芯片下方。在基板顶面设置含有荧光粉的荧光粉玻璃层，其与荧光粉胶层配合将各个LED芯片完全包覆，即，每个LED芯片发出的初始光都需经过荧光粉胶层或者荧光粉玻璃层才可出射到灯外，从而解决了初始光泄露的问题。

Description

全周光LED光源
技术领域
 本实用新型涉及一种LED光源，具体涉及一种可向全角度出射光的全周光LED光源。
背景技术
随着LED（Light Emitting Diode，发光二极管）光效的不断提高，在通用照明领域，开始显现出使用LED替代传统的发光器件的趋势。
全周光LED光源，是指能够全角度发光的LED光源。全角度LED光源由于还具有发光效率高的特点，具有广阔的市场前景。
现有的全周光LED光源的结构如图1所示，其包括基板1和LED芯片3，基板1通常由玻璃或蓝宝石材料制成，LED芯片3通过固晶胶2固定在基板1上，再焊接金线4来使各个LED芯片3串联或并联，最后在基板1上下两面点涂荧光粉胶形成上下两层荧光粉胶层5，荧光粉胶层5的材料通常为掺有荧光粉的硅胶。LED芯片3发出的初始光（多为蓝光）透过荧光粉胶层5后被转变成另一颜色的光（多为白光）作为出射光射出。然而，由于基板1有多个出光面，点涂荧光粉胶形成的荧光粉胶层5难以完全覆盖所有出光面，会出现不同程度的初始光泄露的问题，破坏整体的发光效果。例如图1所示的全周光LED光源，初始光就会从基板1的侧面泄露出来。
发明内容
针对现有技术存在的上述问题，本实用新型提供一种全周光LED光源，以解决初始光泄露的问题。
为实现上述目的，本实用新型提供以下技术方案。
全周光LED光源，包括基板、荧光粉胶层和至少一个LED芯片，每个LED芯片固定于基板的顶面，通过焊接金线来实现LED芯片的电连接，荧光粉胶层设置在基板顶面从而将各个LED芯片及所述金线完全覆盖，基板设有荧光粉玻璃层，荧光粉玻璃层位于基板的顶面，并位于LED芯片下方。
其中，基板包括透明基板层，荧光粉玻璃层烧结形成在透明基板层的顶面。
其中，基板固设有用于外接电源以给各个LED芯片供电的导电端子。
本实用新型的有益效果是：在基板顶面设置含有荧光粉的荧光粉玻璃层，其与荧光粉胶层配合将各个LED芯片完全包覆，即，每个LED芯片发出的初始光都需经过荧光粉胶层或者荧光粉玻璃层才可出射到灯外，从而解决了初始光泄露的问题。
附图说明
图1为现有的全周光LED光源的截面的结构示意图。
图2为本实用新型的全周光LED光源的截面的结构示意图。
附图标记包括：基板1、透明基板层11、荧光粉玻璃层12、固晶胶2、LED芯片3、金线4、荧光粉胶层5、导电端子6。
具体实施方式
以下结合附图和具体实施例对本实用新型作详细说明。
如图2所示，本实用新型的全周光LED光源由基板1、若干个LED芯片3、荧光粉胶层5和导电端子6构成，其中，LED芯片3为正装芯片，基板1由透明基板层11和荧光粉玻璃层12构成，透明基板层11由超白平板玻璃或蓝宝石材料制成，荧光粉玻璃层12的形成过程为，先将荧光玻璃粉浆料涂覆在透明基板层11顶面，再在400℃-600℃的环境中高温烧结形成荧光粉玻璃层12，烧结形成的荧光粉玻璃层12表面平整且足够坚硬，利于将LED芯片3固定于其上。每个LED芯片3采用固晶胶2固定在荧光粉玻璃层12的顶面，各个LED芯片3一字排开，每个LED芯片3与相邻的LED芯片3之间焊接有金线4，通过焊接的金线4，各个LED芯片3得以串联连接，导电端子6共有两个，如图2所示，它们分别与首尾两端的两个LED芯片3相邻，它们也分别与首尾两端的连个LED芯片3通过焊接金线4的方式电连接，导电端子6外接电源以给各个LED芯片3供电。荧光粉胶层5设置在荧光粉玻璃层12的顶面，其采用点涂工艺形成，荧光粉胶层5完全覆盖了各个LED芯片3的除底面以外的其余面，荧光粉胶层5与荧光粉玻璃层12一同将LED芯片3的所有出光面完全覆盖，从而解决了初始光泄露的问题。金线4也被荧光粉胶层5覆盖，以让金线4得到荧光粉胶层5的保护。
最后应当说明的是，以上实施例仅用以说明本实用新型的技术方案，而非对本实用新型保护范围的限制，尽管参照较佳实施例对本实用新型作了详细地说明，本领域的普通技术人员应当理解，可以对本实用新型的技术方案进行修改或者等同替换，而不脱离本实用新型技术方案的实质和范围。

Claims (3)

1.全周光LED光源，包括基板、荧光粉胶层和至少一个LED芯片，每个LED芯片固定于基板的顶面，通过焊接金线来实现LED芯片的电连接，荧光粉胶层设置在基板顶面从而将各个LED芯片及所述金线完全覆盖，其特征是，基板设有荧光粉玻璃层，荧光粉玻璃层位于基板的顶面，并位于LED芯片下方。
2.根据权利要求1所述的全周光LED光源，其特征是，基板包括透明基板层，荧光粉玻璃层烧结形成在透明基板层的顶面。
3.根据权利要求1所述的全周光LED光源，其特征是，基板固设有用于外接电源以给各个LED芯片供电的导电端子。
CN201420494157.XU 2014-08-29 2014-08-29 全周光led光源 Expired - Fee Related CN204102898U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105280782A (zh) * 2015-11-05 2016-01-27 深圳市超频三科技股份有限公司 灯具、片状发光体及其制造方法
CN105449082A (zh) * 2015-11-18 2016-03-30 深圳市鸿兆实业发展有限公司 一种360°发光led光源的制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105280782A (zh) * 2015-11-05 2016-01-27 深圳市超频三科技股份有限公司 灯具、片状发光体及其制造方法
CN105449082A (zh) * 2015-11-18 2016-03-30 深圳市鸿兆实业发展有限公司 一种360°发光led光源的制备方法

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