TWI469316B - 發光二極體照明裝置 - Google Patents

發光二極體照明裝置 Download PDF

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TWI469316B
TWI469316B TW101131076A TW101131076A TWI469316B TW I469316 B TWI469316 B TW I469316B TW 101131076 A TW101131076 A TW 101131076A TW 101131076 A TW101131076 A TW 101131076A TW I469316 B TWI469316 B TW I469316B
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light
illuminating
transparent
electrode
carrier
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TW201409661A (zh
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Lung Hsin Chen
Wen Liang Tseng
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Advanced Optoelectronic Tech
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Electroluminescent Light Sources (AREA)

Description

發光二極體照明裝置
本發明涉及一種發光二極體照明裝置。
發光二極體是一種節能、環保、長壽命之固體光源，因此近十幾年來對發光二極體技術之研究一直非常活躍，發光二極體也有漸漸取代日光燈、白熾燈等傳統光源之趨勢。在先前技術中，發光二極體照明裝置一般只能朝向一個方向發光，而無法實現多角度發光，在一些特定場合，不能夠滿足實際需要。
有鑒於此，有必要提供一種可實現多角度發光之發光二極體照明裝置。
一種發光二極體照明裝置，其包括發光部以及承載座。所述發光部包括透光基板、分別設置在該透光基板兩端之第一電極以及設置在該透光基板上並與第一電極電連接之發光二極體。所述承載座承載所述發光部，所述承載座由透光材料構成，其上設有與所述第一電極電連接之第二電極。
上述之發光二極體照明裝置中，發光二極體發出之光線可從發光二極體照明裝置之正面射出，並且還可以穿過透光基板以及承載座從背面和側面射出，從而實現了多角度發光。
100‧‧‧發光二極體照明裝置
10‧‧‧發光部
20‧‧‧承載座
11‧‧‧透光基板
12‧‧‧發光二極體
13‧‧‧第一電極
14‧‧‧第一螢光層
131‧‧‧固定部
132‧‧‧第一連接部
133‧‧‧第二連接部
21‧‧‧透光底壁
22‧‧‧透光側壁
23‧‧‧凹槽
24‧‧‧第二螢光層
25‧‧‧第二電極
251‧‧‧水平延伸部
252‧‧‧垂直延伸部
圖1為本發明實施方式中之發光二極體照明裝置之結構示意圖。
圖2為圖1中之發光二極體照明裝置之分解結構示意圖。
圖3為圖2中之發光二極體照明裝置之發光部之俯視圖。
圖4為圖2中之發光二極體照明裝置之承載座之俯視圖。
圖5為圖4中之承載座之沿VI-VI方向之截面圖。
以下將結合附圖對本發明作進一步之詳細說明。
請參閱圖1以及圖2，本發明實施方式提供之一種發光二極體照明裝置100包括一發光部10以及承載該發光部10之一承載座20。
所述發光部10包括一透光基板11、設置在該透光基板11上之若干間隔設置之發光二極體12、分別設置在該透光基板11相對兩端之第一電極13以及覆蓋發光二極體12之第一螢光層14。
請接著參閱圖3，所述透光基板11為縱長板狀結構，其由玻璃、塑膠等透光材料構成。所述發光二極體12呈直線排列設置在透光基板11之遠離承載座20之上表面上，各發光二極體12之間相互串聯，並且兩端之發光二極體12分別與第一電極13電連接。
所述第一電極13分別設置在透光基板11之相對兩端，其包括一方形之固定部131、由該固定部131之底部延伸形成之第一連接部132以及由該固定部131之頂部延伸形成之第二連接部133。該固定部131固定在透光基板11之上表面。該第一連接部132及第二連接部133之延伸方向相反，且其末端均超出固定部之邊緣並分別 位於固定部之相對兩側。具體之，該第一連接部132貼附在所述透光基板11上表面並朝向發光二極體12水平延伸，用於與發光二極體12電連接。該第二連接部133朝向遠離發光二極體12方向水平延伸，用於與所述承載座20電連接。所述固定部131之外側面與所述透光基板11之兩端之端面齊平。
所述第一螢光層14覆蓋所述發光二極體12以及透光基板11表面，其為一透明結構，材質可為矽、玻璃、環氧樹脂等。螢光粉材質可選自石榴石、矽酸鹽、氮化物、氮氧化物、磷化物、硫化物中之一或幾種組合之化合物。
請接著參閱圖4以及圖5，所述承載座20為透光材料構成，其包括一縱長板狀結構之透光底壁21以及由該透光底壁21之四個側邊垂直向上延伸之透光側壁22。該透光底壁21和該透光側壁22共同圍成一凹槽23，該凹槽23之大小與所述發光部10之透光基板11之大小大致相當，其用於收容所述透光基板11。該凹槽23之內表面塗覆有第二螢光層24。
所述承載座20與所述透光基板11上之第一電極13相對應之兩透光側壁22上分別設置有第二電極25。該第二電極25包括設置在透光側壁22頂部之水平延伸部251以及由該水平延伸部251沿透光側壁22外表面垂直向下延伸之垂直延伸部252。該第二電極25之水平延伸部251用於與第一電極13電連接，垂直延伸部252用於與外部電源電連接。
在組裝時，首先將發光部10之透光基板11收容於承載座20之凹槽23中，此時，第一電極13之第二連接部133覆蓋在第二電極25之水平延伸部251上，然後焊接第一電極13之第二連接部133與第二 電極25之水平延伸部251，從而將發光部10固定於承載座20中。
在使用時，發光二極體12發出之光線可從發光二極體照明裝置100之正面射出，並且發光二極體12發出之光線還可以穿過透光基板11以及承載座20之透光底壁21從背面射出，也可以穿過透光基板11以及承載座20之透光側壁22從側面射出，從而實現了多角度發光。另外，發光二極體12正向發出之光線主要激發第一螢光層14，而背向以及側向發出之光線主要激發塗覆在凹槽23之內表面之第二螢光層24，因此藉由選擇不同之螢光粉材料，可以實現發光二極體照明裝置100正向光線與背向以及側向光線之顏色不同，可以滿足不同之實際需要。
另外，本領域技術人員還可在本發明精神內做其他變化，當然，這些依據本發明精神所做之變化，都應包含在本發明所要求保護之範圍之內。

Claims (6)

  1. 一種發光二極體照明裝置，其包括發光部以及承載座，其改進在於：所述發光部包括透光基板、分別設置在該透光基板兩端之第一電極以及設置在該透光基板上並與第一電極電連接之發光二極體，所述承載座承載所述發光部，所述承載座由透光材料構成，承載座上設有與所述第一電極電連接之第二電極，所述承載座由透光底壁及由該透光底壁朝向發光部延伸之透光側壁構成，所述透光底壁和透光側壁共同圍成一凹槽，所述透光基板收容於該凹槽中。
  2. 如申請專利範圍第1項所述之發光二極體照明裝置，其中：所述第二電極包括設置在透光側壁頂部之水平延伸部及由該水平延伸部沿透光側壁外表面垂直向下延伸之垂直延伸部，所述水平延伸部用於與所述透光基板之第一電極電連接，所述垂直延伸部用於與外部電源電連接。
  3. 如申請專利範圍第2項所述之發光二極體照明裝置，其中：所述第一電極包括固定在透光基板表面之固定部以及從固定部之底部延伸之第一連接部和從固定部頂部延伸之第二連接部，該第一連接部及第二連接部之延伸方向相反，且末端均超出固定部之邊緣，該第一連接部朝向發光二極體水平延伸，以與發光二極體電連接，該第二連接部朝向遠離發光二極體方向延伸，並覆蓋在所述第二電極之水平延伸部上，與該水平延伸部焊接。
  4. 如申請專利範圍第1項所述之發光二極體照明裝置，其中：所述發光二極體照明裝置還包括覆蓋所述發光二極體之第一螢光層，所述透光底壁和透光側壁構成之凹槽之內表面塗覆有第二螢光層。
  5. 如申請專利範圍第4項所述之發光二極體照明裝置，其中：所述第一螢光 層和所述第二螢光層中含有不同之螢光粉。
  6. 如申請專利範圍第1項所述之發光二極體照明裝置，其中：所述透光基板為縱長板狀結構，所述發光二極體呈直線排列設置在該透光基板上，各發光二極體之間相互串聯，並且兩端之發光二極體分別與第一電極電連接。
TW101131076A 2012-08-17 2012-08-27 發光二極體照明裝置 TWI469316B (zh)

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CN104048204A (zh) * 2014-07-10 2014-09-17 宋勇飞 Led光源及其制造方法
US11125412B2 (en) 2014-12-01 2021-09-21 Current Lighting Solutions, Llc Lighting device with efficient light-spreading lens system

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