CN101506961B - 半导体树脂模塑用脱模膜 - Google Patents

半导体树脂模塑用脱模膜 Download PDF

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Publication number
CN101506961B
CN101506961B CN2007800306458A CN200780030645A CN101506961B CN 101506961 B CN101506961 B CN 101506961B CN 2007800306458 A CN2007800306458 A CN 2007800306458A CN 200780030645 A CN200780030645 A CN 200780030645A CN 101506961 B CN101506961 B CN 101506961B
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China
Prior art keywords
release film
mold release
mold
layer
resin
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Active
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CN2007800306458A
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English (en)
Chinese (zh)
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CN101506961A (zh
Inventor
奥屋珠生
有贺广志
樋口义明
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AGC Inc
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Asahi Glass Co Ltd
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Publication of CN101506961A publication Critical patent/CN101506961A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
CN2007800306458A 2006-08-18 2007-07-30 半导体树脂模塑用脱模膜 Active CN101506961B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006223565 2006-08-18
JP223565/2006 2006-08-18
PCT/JP2007/064915 WO2008020543A1 (fr) 2006-08-18 2007-07-30 Film de démoulage pour encapsulation de résine de semi-conducteurs

Publications (2)

Publication Number Publication Date
CN101506961A CN101506961A (zh) 2009-08-12
CN101506961B true CN101506961B (zh) 2011-01-05

Family

ID=39082069

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800306458A Active CN101506961B (zh) 2006-08-18 2007-07-30 半导体树脂模塑用脱模膜

Country Status (6)

Country Link
JP (1) JP5110440B2 (ko)
KR (1) KR101395520B1 (ko)
CN (1) CN101506961B (ko)
MY (1) MY151817A (ko)
TW (1) TWI428226B (ko)
WO (1) WO2008020543A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5476680B2 (ja) * 2008-05-29 2014-04-23 ダイキン工業株式会社 離型フィルム
SG172062A1 (en) * 2009-01-08 2011-07-28 Asahi Glass Co Ltd Mold-releasing film and method for manufacturing light emitting diode
JP5297233B2 (ja) * 2009-03-09 2013-09-25 三井化学株式会社 半導体封止プロセス用離型フィルム、およびそれを用いた樹脂封止半導体の製造方法
WO2012077571A1 (ja) * 2010-12-07 2012-06-14 東洋紡績株式会社 モールド工程用離型ポリエステルフィルム
JP5541468B2 (ja) * 2012-02-20 2014-07-09 信越ポリマー株式会社 離型用フィルム
JP5822810B2 (ja) * 2012-09-26 2015-11-24 信越ポリマー株式会社 離型用フィルム
JP5822811B2 (ja) * 2012-09-26 2015-11-24 信越ポリマー株式会社 離型用フィルム
JP2014179593A (ja) * 2013-02-15 2014-09-25 Nitto Denko Corp 半導体素子用封止シート、半導体装置及び半導体装置の製造方法
WO2014203872A1 (ja) * 2013-06-18 2014-12-24 積水化学工業株式会社 離型フィルム
KR101486052B1 (ko) * 2013-07-03 2015-01-23 고병수 반도체 패키지 제조용 몰드 이형시트 및 제조방법
CN104425290B (zh) * 2013-08-27 2017-08-08 硕正科技股份有限公司 应用于晶圆封装的离形元件
WO2015068807A1 (ja) * 2013-11-07 2015-05-14 旭硝子株式会社 離型フィルム、および半導体パッケージの製造方法
KR101698289B1 (ko) * 2013-11-07 2017-01-19 아사히 가라스 가부시키가이샤 이형 필름, 및 반도체 패키지의 제조 방법
DE112015001137T5 (de) * 2014-03-07 2016-11-24 Asahi Glass Company, Limited Formwerkzeugtrennfilm und Verfahren zur Herstellung eines eingekapselten Körpers
WO2016080309A1 (ja) * 2014-11-20 2016-05-26 旭硝子株式会社 離型フィルム、その製造方法および半導体パッケージの製造方法
DE102015208980A1 (de) * 2015-05-15 2016-11-17 Infiana Germany Gmbh & Co. Kg Eine evakuierbare Form für Faserverbundkunststoff-Bauteile
CN108602309B (zh) * 2016-02-01 2022-04-12 3M创新有限公司 阻挡复合物
JP6738672B2 (ja) * 2016-07-04 2020-08-12 倉敷紡績株式会社 離型フィルムおよび半導体パッケージの製造方法
CN106166863A (zh) * 2016-08-11 2016-11-30 苏州柯创电子材料有限公司 耐高温复合离型膜
JP6423399B2 (ja) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 樹脂成形方法、フィルム搬送装置および樹脂成形装置
JP6493628B2 (ja) * 2017-03-24 2019-04-03 住友ベークライト株式会社 モールド成形用離型フィルム及びモールド成形方法
CN111936283A (zh) * 2018-06-08 2020-11-13 仓敷纺绩株式会社 脱模膜及脱模膜的制造方法
JPWO2019244448A1 (ja) * 2018-06-22 2020-06-25 株式会社コバヤシ 離型フィルム及び離型フィルムの製造方法
CN112292263A (zh) 2018-06-22 2021-01-29 小林股份有限公司 离型膜以及离型膜的制造方法
MX2020013655A (es) * 2018-06-22 2021-03-02 Kobayashi & Co Ltd Pelicula de liberacion y metodo para fabricar la pelicula de liberacion.
CN110718474B (zh) * 2019-09-03 2022-08-16 富联裕展科技(深圳)有限公司 封装方法、离型件及其制作方法
KR102226153B1 (ko) 2019-11-18 2021-03-10 실리콘밸리(주) 거칠기 조절이 가능한 반도체 몰드용 이형필름 및 그 제조방법
JP7427480B2 (ja) 2020-03-09 2024-02-05 キオクシア株式会社 半導体装置
KR102280585B1 (ko) * 2021-01-15 2021-07-23 씰테크 주식회사 반도체 패키지용 이형 필름 및 그 제조 방법
KR102559027B1 (ko) 2021-07-02 2023-07-24 (주)제론텍 반도체 에폭시 몰드 컴파운드 공정용 내열 세퍼레이터 필름

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001310336A (ja) * 2000-04-28 2001-11-06 Asahi Glass Co Ltd 樹脂モールド成形用離型フィルム
JP2002361643A (ja) * 2001-06-01 2002-12-18 Hitachi Chem Co Ltd 半導体モールド用離型シート
JP2004079566A (ja) * 2002-08-09 2004-03-11 Hitachi Chem Co Ltd 半導体モールド用離型シート
TW200602182A (en) * 2004-05-27 2006-01-16 Mitsubishi Plastics Inc Mold releasing laminated film
JP2006049850A (ja) * 2004-06-29 2006-02-16 Asahi Glass Co Ltd 半導体チップ封止用離型フィルム

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2002-361643A 2002.12.18
JP特开2004-79566A 2004.03.11
JP特开2006-49850A 2006.02.16

Also Published As

Publication number Publication date
TW200815175A (en) 2008-04-01
KR20090042898A (ko) 2009-05-04
JPWO2008020543A1 (ja) 2010-01-07
TWI428226B (zh) 2014-03-01
MY151817A (en) 2014-07-14
WO2008020543A1 (fr) 2008-02-21
JP5110440B2 (ja) 2012-12-26
KR101395520B1 (ko) 2014-05-14
CN101506961A (zh) 2009-08-12

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Address after: Tokyo, Japan

Patentee after: AGC Corporation

Address before: Tokyo, Japan

Patentee before: Asahi Glass Co., Ltd.

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