TW200602182A - Mold releasing laminated film - Google Patents

Mold releasing laminated film

Info

Publication number
TW200602182A
TW200602182A TW094117420A TW94117420A TW200602182A TW 200602182 A TW200602182 A TW 200602182A TW 094117420 A TW094117420 A TW 094117420A TW 94117420 A TW94117420 A TW 94117420A TW 200602182 A TW200602182 A TW 200602182A
Authority
TW
Taiwan
Prior art keywords
laminated film
mold releasing
releasing laminated
layer consisting
modified polyolefin
Prior art date
Application number
TW094117420A
Other languages
Chinese (zh)
Inventor
Yoshihiko Nishio
Jyun Nishioka
Shigeki Nishimura
Osamu Kakishita
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004158052A external-priority patent/JP2005014598A/en
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Publication of TW200602182A publication Critical patent/TW200602182A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]

Abstract

Mold releasing laminated film comprising a layer consisting of modified polyolefin resin, and a layer consisting of adhesive fluorocarbon resin which is laminated at least one surface of the layer consisting of modified polyolefin resin is provided. The mold releasing laminated film of the present invention has a surface property of fluorocarbon resin, difficulty in delamination, good workability and economical efficiency. And the mold releasing laminated film of the present invention can easily follow stair-like shapes of multilayer board in time of press molding.
TW094117420A 2004-05-27 2005-05-27 Mold releasing laminated film TW200602182A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004158052A JP2005014598A (en) 2003-05-30 2004-05-27 Release laminated film
JP2004170306 2004-06-08

Publications (1)

Publication Number Publication Date
TW200602182A true TW200602182A (en) 2006-01-16

Family

ID=35450738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117420A TW200602182A (en) 2004-05-27 2005-05-27 Mold releasing laminated film

Country Status (4)

Country Link
JP (1) JPWO2005115751A1 (en)
KR (1) KR20070034527A (en)
TW (1) TW200602182A (en)
WO (1) WO2005115751A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101415546A (en) 2006-04-05 2009-04-22 旭硝子株式会社 Mold release film, mold release cushion material, and process for manufacturing printed board
WO2008020543A1 (en) * 2006-08-18 2008-02-21 Asahi Glass Company, Limited Mold release film for the resin encapsulation of semiconductors
EP2222464A2 (en) * 2007-12-21 2010-09-01 3M Innovative Properties Company Fluoropolymer multi-layer articles
JP5476680B2 (en) * 2008-05-29 2014-04-23 ダイキン工業株式会社 Release film
KR101049934B1 (en) * 2008-11-03 2011-07-15 (주)상아프론테크 Method for producing release film used to mold semiconductor package with resin and release film made by this method
CN102815053B (en) * 2011-06-07 2015-07-15 杜邦公司 Solar cell back panel with improved cohesive property on packing materials
KR20150001766A (en) * 2012-04-12 2015-01-06 생-고뱅 퍼포먼스 플라스틱스 코포레이션 Method of manufacturing light emitting device
KR101370594B1 (en) * 2013-04-16 2014-03-05 유한회사 한국 타코닉 Method of preventing pollution for dry roller used in papermachine
JP6025694B2 (en) 2013-11-22 2016-11-16 富士フイルム株式会社 Film and manufacturing method thereof, transparent conductive film and touch panel
JP7173045B2 (en) * 2017-12-11 2022-11-16 三菱ケミカル株式会社 Laminate films, release films and laminates

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216137A (en) * 1985-07-16 1987-01-24 三菱油化株式会社 Multiple laminate
JP3131599B2 (en) * 1990-10-25 2001-02-05 三菱化学株式会社 Manufacturing method of laminate
JPH08281884A (en) * 1995-04-19 1996-10-29 Mitsubishi Chem Corp Laminate
JPH1058618A (en) * 1996-06-11 1998-03-03 Mitsubishi Chem Corp Plastic coextrusion multi-layer laminated sheet and manufacture of molded item employing this
JP2000015754A (en) * 1998-07-07 2000-01-18 Mitsubishi Chemicals Corp Resin laminate
JP2001138338A (en) * 1999-08-31 2001-05-22 Mitsubishi Plastics Ind Ltd Laminated film for mold release
JP3935314B2 (en) * 2000-10-18 2007-06-20 三菱樹脂株式会社 Fluoropolymer laminated film for transfer
JP4138334B2 (en) * 2002-02-27 2008-08-27 三菱樹脂株式会社 Fluorine-based laminated film
JP3791458B2 (en) * 2002-05-23 2006-06-28 旭硝子株式会社 Release film
JP4151370B2 (en) * 2002-10-07 2008-09-17 東レ株式会社 Release film
JP2005014598A (en) * 2003-05-30 2005-01-20 Mitsubishi Plastics Ind Ltd Release laminated film

Also Published As

Publication number Publication date
KR20070034527A (en) 2007-03-28
WO2005115751A1 (en) 2005-12-08
JPWO2005115751A1 (en) 2008-03-27

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