CN101498002A - 金属的表面处理方法以及印制布线基板 - Google Patents
金属的表面处理方法以及印制布线基板 Download PDFInfo
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- CN101498002A CN101498002A CNA2009100071504A CN200910007150A CN101498002A CN 101498002 A CN101498002 A CN 101498002A CN A2009100071504 A CNA2009100071504 A CN A2009100071504A CN 200910007150 A CN200910007150 A CN 200910007150A CN 101498002 A CN101498002 A CN 101498002A
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- China
- Prior art keywords
- group
- surface treatment
- metal
- metallic surface
- treatment process
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 title claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 150000003839 salts Chemical class 0.000 claims abstract description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 9
- 125000005843 halogen group Chemical group 0.000 claims abstract description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 claims abstract description 5
- 125000002228 disulfide group Chemical group 0.000 claims abstract description 5
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000003118 aryl group Chemical group 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 3
- -1 carbonatoms alkyl Chemical group 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000012756 surface treatment agent Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000004381 surface treatment Methods 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910000765 intermetallic Inorganic materials 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 125000000304 alkynyl group Chemical group 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 125000004646 sulfenyl group Chemical group S(*)* 0.000 claims description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000001118 alkylidene group Chemical group 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 125000003968 arylidene group Chemical group [H]C(c)=* 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical group SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 claims 1
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 abstract 3
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 2
- 229910052799 carbon Inorganic materials 0.000 abstract 2
- 125000000101 thioether group Chemical group 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000003536 tetrazoles Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000013543 active substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- QPBYLOWPSRZOFX-UHFFFAOYSA-J tin(iv) iodide Chemical compound I[Sn](I)(I)I QPBYLOWPSRZOFX-UHFFFAOYSA-J 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- IYPXPGSELZFFMI-UHFFFAOYSA-N 1-phenyltetrazole Chemical compound C1=NN=NN1C1=CC=CC=C1 IYPXPGSELZFFMI-UHFFFAOYSA-N 0.000 description 1
- DIGCWYGXBRVXIW-UHFFFAOYSA-N 1-sulfanyltetrazole Chemical compound SN1C=NN=N1 DIGCWYGXBRVXIW-UHFFFAOYSA-N 0.000 description 1
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 1
- YMHOBZXQZVXHBM-UHFFFAOYSA-N 2,5-dimethoxy-4-bromophenethylamine Chemical compound COC1=CC(CCN)=C(OC)C=C1Br YMHOBZXQZVXHBM-UHFFFAOYSA-N 0.000 description 1
- JKFYKCYQEWQPTM-UHFFFAOYSA-N 2-azaniumyl-2-(4-fluorophenyl)acetate Chemical compound OC(=O)C(N)C1=CC=C(F)C=C1 JKFYKCYQEWQPTM-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical class C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- LCDBVKSDKGMGOX-UHFFFAOYSA-N 5-(2h-tetrazol-5-yldisulfanyl)-2h-tetrazole Chemical compound N=1N=NNC=1SSC1=NN=NN1 LCDBVKSDKGMGOX-UHFFFAOYSA-N 0.000 description 1
- KSCMYJXTGSEZEI-UHFFFAOYSA-N 5-[2-(2h-tetrazol-5-yl)ethyl]-2h-tetrazole Chemical compound N1=NNN=C1CCC=1N=NNN=1 KSCMYJXTGSEZEI-UHFFFAOYSA-N 0.000 description 1
- PMZBHPUNQNKBOA-UHFFFAOYSA-N 5-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=CC(C(O)=O)=CC(C(O)=O)=C1 PMZBHPUNQNKBOA-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 229910021503 Cobalt(II) hydroxide Inorganic materials 0.000 description 1
- 229910021584 Cobalt(II) iodide Inorganic materials 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 229910003767 Gold(III) bromide Inorganic materials 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- HGPLKKVQTVJBHF-UHFFFAOYSA-K I(=O)(=O)[O-].[Rh+3].I(=O)(=O)[O-].I(=O)(=O)[O-] Chemical compound I(=O)(=O)[O-].[Rh+3].I(=O)(=O)[O-].I(=O)(=O)[O-] HGPLKKVQTVJBHF-UHFFFAOYSA-K 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021588 Nickel(II) iodide Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910021612 Silver iodide Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910021623 Tin(IV) bromide Inorganic materials 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 241000545067 Venus Species 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- JZJKVPXMDKHJCD-UHFFFAOYSA-N [Ag].C(CO)(=O)NC(=O)N Chemical compound [Ag].C(CO)(=O)NC(=O)N JZJKVPXMDKHJCD-UHFFFAOYSA-N 0.000 description 1
- XXVRGGCHZUCJCX-UHFFFAOYSA-N [Cl].[Rh] Chemical compound [Cl].[Rh] XXVRGGCHZUCJCX-UHFFFAOYSA-N 0.000 description 1
- VJVWNPYNKXNTJV-UHFFFAOYSA-K [Ru+3].I(=O)(=O)[O-].I(=O)(=O)[O-].I(=O)(=O)[O-] Chemical compound [Ru+3].I(=O)(=O)[O-].I(=O)(=O)[O-].I(=O)(=O)[O-] VJVWNPYNKXNTJV-UHFFFAOYSA-K 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- VDPGUPNNQSCNFY-UHFFFAOYSA-K chromium(3+) triiodate Chemical compound I(=O)(=O)[O-].[Cr+3].I(=O)(=O)[O-].I(=O)(=O)[O-] VDPGUPNNQSCNFY-UHFFFAOYSA-K 0.000 description 1
- LAIOKZCTQAIQDM-UHFFFAOYSA-H chromium(3+);diphosphate;heptahydrate Chemical compound O.O.O.O.O.O.O.[Cr+3].[Cr+3].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LAIOKZCTQAIQDM-UHFFFAOYSA-H 0.000 description 1
- WYYQVWLEPYFFLP-UHFFFAOYSA-K chromium(3+);triacetate Chemical compound [Cr+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WYYQVWLEPYFFLP-UHFFFAOYSA-K 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- UZDWIWGMKWZEPE-UHFFFAOYSA-K chromium(iii) bromide Chemical compound [Cr+3].[Br-].[Br-].[Br-] UZDWIWGMKWZEPE-UHFFFAOYSA-K 0.000 description 1
- VQWFNAGFNGABOH-UHFFFAOYSA-K chromium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Cr+3] VQWFNAGFNGABOH-UHFFFAOYSA-K 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- AVWLPUQJODERGA-UHFFFAOYSA-L cobalt(2+);diiodide Chemical compound [Co+2].[I-].[I-] AVWLPUQJODERGA-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- BZRRQSJJPUGBAA-UHFFFAOYSA-L cobalt(ii) bromide Chemical compound Br[Co]Br BZRRQSJJPUGBAA-UHFFFAOYSA-L 0.000 description 1
- PFQLIVQUKOIJJD-UHFFFAOYSA-L cobalt(ii) formate Chemical compound [Co+2].[O-]C=O.[O-]C=O PFQLIVQUKOIJJD-UHFFFAOYSA-L 0.000 description 1
- ASKVAEGIVYSGNY-UHFFFAOYSA-L cobalt(ii) hydroxide Chemical compound [OH-].[OH-].[Co+2] ASKVAEGIVYSGNY-UHFFFAOYSA-L 0.000 description 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- 229960000355 copper sulfate Drugs 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- HYFPVPNWNRFTMP-UHFFFAOYSA-N formic acid;manganese Chemical compound [Mn].OC=O HYFPVPNWNRFTMP-UHFFFAOYSA-N 0.000 description 1
- PTSNAAXZLFGCNO-UHFFFAOYSA-N formic acid;tin Chemical compound [Sn].OC=O PTSNAAXZLFGCNO-UHFFFAOYSA-N 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- JCDVTZPJEWWGHU-UHFFFAOYSA-N gold sulfurous acid Chemical compound [Au].S(O)(O)=O JCDVTZPJEWWGHU-UHFFFAOYSA-N 0.000 description 1
- OVWPJGBVJCTEBJ-UHFFFAOYSA-K gold tribromide Chemical compound Br[Au](Br)Br OVWPJGBVJCTEBJ-UHFFFAOYSA-K 0.000 description 1
- 229940014053 gold tribromide Drugs 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 229940076131 gold trichloride Drugs 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- 229910021505 gold(III) hydroxide Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- HEJPGFRXUXOTGM-UHFFFAOYSA-K iron(3+);triiodide Chemical compound [Fe+3].[I-].[I-].[I-] HEJPGFRXUXOTGM-UHFFFAOYSA-K 0.000 description 1
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 description 1
- IPJKJLXEVHOKSE-UHFFFAOYSA-L manganese dihydroxide Chemical compound [OH-].[OH-].[Mn+2] IPJKJLXEVHOKSE-UHFFFAOYSA-L 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- CNFDGXZLMLFIJV-UHFFFAOYSA-L manganese(II) chloride tetrahydrate Chemical compound O.O.O.O.[Cl-].[Cl-].[Mn+2] CNFDGXZLMLFIJV-UHFFFAOYSA-L 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 description 1
- AIYYMMQIMJOTBM-UHFFFAOYSA-L nickel(ii) acetate Chemical compound [Ni+2].CC([O-])=O.CC([O-])=O AIYYMMQIMJOTBM-UHFFFAOYSA-L 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- NXJCBFBQEVOTOW-UHFFFAOYSA-L palladium(2+);dihydroxide Chemical compound O[Pd]O NXJCBFBQEVOTOW-UHFFFAOYSA-L 0.000 description 1
- RFLFDJSIZCCYIP-UHFFFAOYSA-L palladium(2+);sulfate Chemical compound [Pd+2].[O-]S([O-])(=O)=O RFLFDJSIZCCYIP-UHFFFAOYSA-L 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- ZNFFXFIEWVNCJO-UHFFFAOYSA-N pyrrolidine-2,5-dione;silver Chemical compound [Ag].O=C1CCC(=O)N1 ZNFFXFIEWVNCJO-UHFFFAOYSA-N 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- KTEDZFORYFITAF-UHFFFAOYSA-K rhodium(3+);trihydroxide Chemical compound [OH-].[OH-].[OH-].[Rh+3] KTEDZFORYFITAF-UHFFFAOYSA-K 0.000 description 1
- YWFDDXXMOPZFFM-UHFFFAOYSA-H rhodium(3+);trisulfate Chemical compound [Rh+3].[Rh+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O YWFDDXXMOPZFFM-UHFFFAOYSA-H 0.000 description 1
- SONJTKJMTWTJCT-UHFFFAOYSA-K rhodium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Rh+3] SONJTKJMTWTJCT-UHFFFAOYSA-K 0.000 description 1
- MAZOHJVAXBNBPX-UHFFFAOYSA-N ruthenium hydrochloride Chemical compound Cl.[Ru] MAZOHJVAXBNBPX-UHFFFAOYSA-N 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- DKNJHLHLMWHWOI-UHFFFAOYSA-L ruthenium(2+);sulfate Chemical compound [Ru+2].[O-]S([O-])(=O)=O DKNJHLHLMWHWOI-UHFFFAOYSA-L 0.000 description 1
- VDRDGQXTSLSKKY-UHFFFAOYSA-K ruthenium(3+);trihydroxide Chemical compound [OH-].[OH-].[OH-].[Ru+3] VDRDGQXTSLSKKY-UHFFFAOYSA-K 0.000 description 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- ADZWSOLPGZMUMY-UHFFFAOYSA-M silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 229940045105 silver iodide Drugs 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 description 1
- UKHWJBVVWVYFEY-UHFFFAOYSA-M silver;hydroxide Chemical compound [OH-].[Ag+] UKHWJBVVWVYFEY-UHFFFAOYSA-M 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- VMDSWYDTKFSTQH-UHFFFAOYSA-N sodium;gold(1+);dicyanide Chemical compound [Na+].[Au+].N#[C-].N#[C-] VMDSWYDTKFSTQH-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 235000012976 tarts Nutrition 0.000 description 1
- LTSUHJWLSNQKIP-UHFFFAOYSA-J tin(iv) bromide Chemical compound Br[Sn](Br)(Br)Br LTSUHJWLSNQKIP-UHFFFAOYSA-J 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- ALHBQZRUBQFZQV-UHFFFAOYSA-N tin;tetrahydrate Chemical compound O.O.O.O.[Sn] ALHBQZRUBQFZQV-UHFFFAOYSA-N 0.000 description 1
- YJGJRYWNNHUESM-UHFFFAOYSA-J triacetyloxystannyl acetate Chemical compound [Sn+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O YJGJRYWNNHUESM-UHFFFAOYSA-J 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- GCZKMPJFYKFENV-UHFFFAOYSA-K triiodogold Chemical compound I[Au](I)I GCZKMPJFYKFENV-UHFFFAOYSA-K 0.000 description 1
- UCGZDNYYMDPSRK-UHFFFAOYSA-L trisodium;gold;hydroxy-oxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Na+].[Na+].[Na+].[Au].OS([S-])(=O)=O.OS([S-])(=O)=O UCGZDNYYMDPSRK-UHFFFAOYSA-L 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D257/00—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms
- C07D257/02—Heterocyclic compounds containing rings having four nitrogen atoms as the only ring hetero atoms not condensed with other rings
- C07D257/04—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
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- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
本发明提供一种金属的表面处理方法以及用该方法进行了表面处理的印制布线基板，所述金属的表面处理方法，通过将含有下述通式所示的四唑衍生物和/或其盐的金属表面处理剂赋予到金属表面，使得金属表面的耐热性、耐湿性、与树脂的粘结性、焊料润湿性提高，式中，R1、R2各自独立地表示氢原子，卤原子，碳原子数10以下的烷基、链烯基、链炔基、芳基、芳烷基、苄基，或在这些基团上加成卤原子、羟基、羧基、氨基、巯基而成的基团，或者，氨基，巯基，羟基，羧基；R3表示键或者碳原子数10以下的亚烷基、亚链烯基、亚链炔基、亚芳基、亚芳烷基，或者在这些基团上加成卤原子、羟基、羧基、氨基、巯基、偶氮基、硫基、二硫基而成的基团，或者偶氮基－N＝N－，硫基－S－，二硫基－S－S－。
Description
本申请是申请日为2005年1月21日，申请号为200580003987.1，发明名称为“金属的表面处理剂”的中国专利申请的分案申请。
技术领域
本发明涉及金属的表面处理剂。
背景技术
作为铜和铜合金的变色防止剂，三唑及其衍生物是有名的。作为将这些化合物供给到电子材料用的物质，包括本申请人提出的含有5-甲基-1H-苯并三唑、5，6-二甲基-1H-苯并三唑、2-巯基嘧啶的酸性的铜变色防止液等(专利文献1(特开平4-160173号公报))。上述化合物的耐湿性优异，可以有效防止被处理物保管时的铜的变色，但是由于耐热性差，当进行加热时，存在铜被氧化、氧化膜剥离的问题。解决该问题的方法是，本申请人申请的专利文献2(日本专利第3373356号公报)的，向作为铜的阻聚剂而起作用的，分子内含有氮或硫或它们两者的多环状物溶液中，添加不比铜活泼的金属或其盐而成的铜变色防止液。但是，该表面处理剂，不是抑制加热时的铜的氧化，而是为了使生成的氧化被膜不剥离。
作为抑制加热时的铜的氧化、提高焊料润湿性的物质，有2位改性苯并咪唑(专利文献3(日本专利第2575242号公报)、专利文献4(日本专利第2686168号公报))、咪唑衍生物(专利文献5(特开平4-206681号公报)、专利文献6(特开平7-243053号公报))等。但是，由于它们是十分之几微米～几微米左右的厚的被膜，所以树脂粘结性低。作为解决该问题的表面处理剂，非专利文献1(公开技法No.2003-502332)提出了巯基苯并噁唑衍生物、巯基苯并噻唑衍生物。
另一方面，也提出了含有四唑化合物的表面处理剂。例如在专利文献7(日本专利第3141145号公报)中提出了四唑类化合物，在专利文献8(特开2000-282033号公报)中提出了含有四唑类化合物和硫代二唑类化合物的表面活性剂，另外，在专利文献9(特开2003-3283号公报)中提出了利用含有过氧化氢、无机酸、四唑化合物、银离子和卤素离子的表面活性剂来对铜表面进行粗面化，提高与树脂的粘结性。进而，本申请人也提出了含有四唑化合物和卤素化合物的表面处理剂(专利文献10(特愿2003-290346号公报))。
专利文献1：特开平4-160173号公报
专利文献2：日本专利第3373356号公报
专利文献3：日本专利第2575242号公报
专利文献4：日本专利第2686168号公报
专利文献5：特开平4-206681号公报
专利文献6：特开平7-243053号公报
专利文献7：日本专利第3141145号公报
专利文献8：特开2000-282033号公报
专利文献9：特开2003-3283号公报
专利文献10：特愿2003-290346号公报
非专利文献1：公开技法No.2003-502332
发明内容
本发明的目的在于提供一种表面处理剂，该表面处理剂可进一步提高耐热性、树脂粘结性、焊料润湿性。
本发明者们进行了深入研究，结果发现利用特定的四唑衍生物进行表面处理是有效的，从而实现了本发明。
即，本发明涉及
(1)一种金属的表面处理剂，其特征在于，含有下述通式所示的四唑衍生物和/或其盐，
式中，R1、R2各自独立地表示氢原子，卤原子，碳原子数10以下的烷基、链烯基、链炔基、芳基、芳烷基、苄基，或在这些基团上加成卤原子、羟基、羧基、氨基、巯基而成的基团，或者，氨基，巯基，羟基，羧基；R3表示键或者碳原子数10以下的亚烷基、亚链烯基、亚链炔基、亚芳基、亚芳烷基，或者在这些基团上加成卤原子、羟基、羧基、氨基、巯基、偶氮基、硫基、二硫基而成的基团，或者偶氮基(-N＝N-)，硫基(-S-)，二硫基(-S-S-))。
(2)如上述(1)所述的金属的表面活性剂，其特征在于，进一步含有金属或金属化合物。
具体实施方式
本发明的金属表面处理剂，以上述通式所示的四唑衍生物和/或其盐为有效成分，作为优选的金属表面处理剂，可以列举出例如，下述的化合物及其盐。作为盐，没有特别的限制，但是优选碱金属盐、碱土类金属盐、铵盐、胺盐。
5，5’-双-1H-四唑、5，5’-双-1-甲基四唑、5，5’-双-1-苯基四唑、5，5’-双-1-巯基四唑、5，5’-双-1-氯四唑、5，5’-亚乙基双-1H-四唑、5，5’-亚乙基双-1-甲基四唑、5，5’-亚乙基双-1-苯基四唑、5，5’-亚乙基双-1-巯基四唑、5，5’-亚乙基双-1-氯四唑、5，5’-偶氮双-1H-四唑、5，5’-偶氮双-1-甲基四唑、5，5’-偶氮双-1-苯基四唑、5，5’-偶氮双-1-巯基四唑、5，5’-偶氮双-1-氯四唑、5，5’-二硫基双-1H-四唑、5，5’-二硫基双-1-甲基四唑、5，5’-二硫基双-1-苯基四唑、5，5’-二硫基双-1-巯基四唑、5，5’-二硫基双-1-氯四唑等。
这些四唑衍生物，可以以2种以上的混合物的形式使用，在本发明的表面活性剂中，可以含有0.05～100g/L、优选含有0.1～50g/L。
当小于0.05g/L时，成膜性低，不能获得良好的特性。即使超过100g/L，也由于透过等而引起液体的损失增加，因此是不利的。
另外，通过在本发明的表面处理剂中、除了上述四唑衍生物之外，还添加金属或金属化合物，可以更进一步提高效果，作为这样的金属或金属化合物，优选列举出，锌、锰、铬、锡、铁、镍、钴、铜、金、银、铂、钯、铑、钌或其化合物。这些金属或金属化合物，可以用作2种以上的混合物，在本发明的表面处理剂中，含有1mg/L～100g/L、优选含有10mg/L～20g/L。
当小于1mg/L时，耐热性、树脂粘结性、焊料润湿性提高效果很低。即使大于100g/L，也由于透过等而引起液体的损失增加，因此是不利的。
作为上述金属化合物，可以列举出例如，下述的化合物。
作为锌的化合物，可以列举出，氢氧化锌、氧化锌、甲酸锌、乙酸锌、氯化锌、硫化锌、磷酸锌；作为锰的化合物，可以列举出，氢氧化锰、氧化锰、氯化锰、硫酸锰、甲酸锰、乙酸锰；作为铬的化合物，可以列举出，氢氧化铬、氧化铬、铬酸、重铬酸、氯化铬、硫酸铬、磷酸铬、乙酸铬、溴化铬、碘化铬。
作为锡的化合物，可以列举出，氢氧化锡、氧化锡、甲酸锡、乙酸锡、氯化锡、溴化锡、碘化锡，作为铁的化合物，可以列举出，氢氧化铁、氧化铁、甲酸铁、乙酸铁、氯化铁、溴化铁、碘化铁，作为镍的化合物，可以列举出，氢氧化镍、氧化镍、氯化镍、甲酸镍、乙酸镍、溴化镍、碘化镍，作为钴的化合物，可以列举出，氢氧化钴、氧化钴、氯化钴、甲酸钴、乙酸钴、溴化钴、碘化钴。
作为铜的化合物，可以列举出，氢氧化铜、氧化铜、氯化铜、硫酸铜、磷酸铜、碳酸铜、甲酸铜、乙酸铜、草酸铜、溴化铜、碘化铜，作为金的化合物，可以列举出，氯化金、氯金酸、溴化金、碘化金、亚硫酸金、硫代硫酸金、氰化金、氰化金钾、氰化金钠，作为银的化合物，可以列举出，氢氧化银、氧化银、硝酸银、碘化银、溴化银、琥珀酰亚胺银、乙内酰脲银、氰化银、氰化银钾、氰化银钠，作为铂的化合物，可以列举出，氯化铂、氯铂酸。
作为钯的化合物，可以列举出，氢氧化钯、氧化钯、氯化钯、氯钯酸、碘化钯、硫酸钯，作为铑的化合物，可以列举出，氢氧化铑、氧化铑、氯化铑、氯铑酸、碘化铑、硫酸铑，作为钌的化合物，可以列举出，氢氧化钌、氧化钌、氯化钌、氯钌酸、碘化钌、硫酸钌等。
本发明的表面处理剂，以将上述四唑衍生物、或向其中进一步添加的金属或金属化合物为有效成分的溶液的形式供给。溶液优选水溶液。
本发明的表面处理剂，其pH为1～14，优选为2～12。当在该范围之外时，成膜性低，不能获得良好的特性。
另外，使用本发明的表面处理剂，对金属进行表面处理的温度为5～90℃，优选为10～70℃。当为低于5℃的低温时，成膜性很低，不能获得良好的特性。另外，即使超过90℃，也由于操作性恶化，所以是不利的。
作为表面处理方法，可以使用一般的处理方法，例如用浸渍处理、刷涂等赋予到表面上后，使溶剂挥发的方法，但是不仅限于此，只要所用方法能在表面均匀地附着表面处理剂即可。
另外，表面处理时间为0.1～300秒，优选为10～120秒。当为0.1秒以下时，成膜性很低，不能获得良好的特性。即使处理时间延长为大于300秒，也没有特别的优势。
本发明的表面处理剂，被赋予到金属表面，可以提高其耐热性、耐湿性、与树脂的粘结性、焊料润湿性。作为可以用本发明的表面处理剂进行处理的金属，没有特别的限制，可以处理铜、银、金、铁、镍、锡或它们的合金表面，特别优选的是铜或铜合金。
实施例
下面，通过实施例来更具体地对本发明进行说明。
向下表所示的表面处理剂的水溶液中，浸渍100mm×100mm、厚70μm的压延铜生箔，进行表面处理，然后切断成适当尺寸，作为试验片，进行下述试验。
焊料润湿性试验，是将印制布线板浸渍到表面处理剂溶液中，进行表面处理后，进行试验。
表面处理的结果，用下述基准进行评价。
外观：
没有处理不均等的外观不良的情况记作○，存在外观不良的情况记作×。
耐湿性：
通过目视来观察在40℃、湿度90％的环境下，放置96小时后的铜箔表面有无变色，没有变色的记作○，变色的记作×。
耐热性：
通过目视来观察在烘箱中在170℃、加热1小时后的铜箔有无变色，没有变色的记作○，变色的记作×。
树脂粘结性1：
与环氧模塑树脂的粘结性(剪切强度)为10kgf/cm2以上的记作○，小于10kgf/cm2的记作×。
树脂粘结性2：
与聚酰亚胺覆盖膜的粘结性(90度剥离强度)为0.5kgf/cm2以上的记作○，小于0.5kgf/cm2的记作×。
焊料润湿性：
将在40℃、湿度90％的环境下放置96小时后，再在175℃加热6小时之后的印制布线板(铜电路宽0.8)，进行热后钎焊剂(R型)处理，然后在铜电路部位搭载φ0.6mm的锡铅共晶焊料球，再次使之软熔后，焊料润湿长度为3mm以上的情况记作○，为2mm以上的情况记作△，小于2mm的情况记作×。
工业可利用性
根据本发明的表面处理剂，可以提高金属的耐湿性、耐热性、树脂粘结性、焊料润湿性。
Claims (7)
1.一种金属的表面处理方法，其特征在于，通过将含有下述通式所示的四唑衍生物和/或其盐的金属表面处理剂赋予到金属表面，使得金属表面的耐热性、耐湿性、与树脂的粘结性、焊料润湿性提高，
式中，R1、R2各自独立地表示氢原子，卤原子，碳原子数10以下的烷基、链烯基、链炔基、芳基、芳烷基、苄基，或在这些基团上加成卤原子、羟基、羧基、氨基、巯基而成的基团，或者，氨基，巯基，羟基，羧基；R3表示键或者碳原子数10以下的亚烷基、亚链烯基、亚链炔基、亚芳基、亚芳烷基，或者在这些基团上加成卤原子、羟基、羧基、氨基、巯基、偶氮基、硫基、二硫基而成的基团，或者偶氮基-N＝N-，硫基-S-，二硫基-S-S-。
2.如权利要求1所述的金属的表面处理方法，其特征在于，表面处理温度是5～90℃，表面处理时间是0.1～300秒。
3.如权利要求1所述的金属的表面处理方法，其特征在于，金属的表面处理剂进一步含有金属或金属化合物。
4.如权利要求1所述的金属的表面处理方法，其特征在于，被表面处理的金属是铜、银、金、铁、镍、锡或它们的合金。
5.如权利要求4所述的金属的表面处理方法，其特征在于，被表面处理的金属是铜或铜合金。
6.如权利要求1所述的金属的表面处理方法，其特征在于，四唑衍生物的盐是碱金属盐、碱土类金属盐或胺盐。
7.用权利要求1～6任一项所述的金属表面处理方法进行了表面处理的印制布线基板。
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| CN1914356A (zh) | 2007-02-14 |
| JPWO2005075706A1 (ja) | 2007-10-11 |
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| HK1098516A1 (en) | 2007-07-20 |
| TWI274793B (en) | 2007-03-01 |
| KR20060121989A (ko) | 2006-11-29 |
| CN1914356B (zh) | 2010-05-05 |
| CN101498002B (zh) | 2011-06-22 |
| US20070157845A1 (en) | 2007-07-12 |
| TW200536957A (en) | 2005-11-16 |
| JP4721904B2 (ja) | 2011-07-13 |
| US7393395B2 (en) | 2008-07-01 |
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