CN101491171B - 电路板设备、设有该电路板设备的电子设备及gnd连接方法 - Google Patents
电路板设备、设有该电路板设备的电子设备及gnd连接方法 Download PDFInfo
- Publication number
- CN101491171B CN101491171B CN200780027536.0A CN200780027536A CN101491171B CN 101491171 B CN101491171 B CN 101491171B CN 200780027536 A CN200780027536 A CN 200780027536A CN 101491171 B CN101491171 B CN 101491171B
- Authority
- CN
- China
- Prior art keywords
- printed panel
- metallic plate
- pair
- gnd
- installation surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006198386A JP4844883B2 (ja) | 2006-07-20 | 2006-07-20 | 電子機器及びプリント基板のgnd接続方法 |
JP198386/2006 | 2006-07-20 | ||
PCT/JP2007/064186 WO2008010518A1 (fr) | 2006-07-20 | 2007-07-18 | Dispositif de cartes à circuit imprimé, dispositif électronique muni du dispositif de cartes à circuit imprimé et procédé de connexion à la masse |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101491171A CN101491171A (zh) | 2009-07-22 |
CN101491171B true CN101491171B (zh) | 2012-02-08 |
Family
ID=38956850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780027536.0A Expired - Fee Related CN101491171B (zh) | 2006-07-20 | 2007-07-18 | 电路板设备、设有该电路板设备的电子设备及gnd连接方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8116099B2 (zh) |
EP (1) | EP2046107A4 (zh) |
JP (1) | JP4844883B2 (zh) |
CN (1) | CN101491171B (zh) |
WO (1) | WO2008010518A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8483785B2 (en) * | 2009-03-26 | 2013-07-09 | Kyocera Corporation | Mobile electronic device providing impact resistance to electronic component |
WO2010131578A1 (ja) * | 2009-05-12 | 2010-11-18 | 日本電気株式会社 | 光信号入出力器内蔵半導体装置及びそれを搭載した電子機器 |
TWI390280B (zh) * | 2009-05-27 | 2013-03-21 | Au Optronics Corp | 觸控面板顯示器與觸控顯示裝置 |
CN102223783A (zh) * | 2010-04-19 | 2011-10-19 | 鸿富锦精密工业(深圳)有限公司 | 屏蔽罩及具有屏蔽罩的电子装置 |
KR20110134200A (ko) * | 2010-06-08 | 2011-12-14 | 삼성전기주식회사 | 전자기 밴드갭 구조물을 포함하는 emi 노이즈 차폐 기판 |
CN102637447A (zh) * | 2011-02-14 | 2012-08-15 | 鸿富锦精密工业(深圳)有限公司 | 电子装置 |
IN2014DN10875A (zh) * | 2012-08-10 | 2015-09-11 | Ericsson Telefon Ab L M | |
US9583891B2 (en) * | 2015-06-10 | 2017-02-28 | Ad-Tech Medical Instrument Corp. | High-density electrical connector for plural multi-contact linear-array connections |
CN106163234B (zh) * | 2016-07-28 | 2017-08-25 | 广东欧珀移动通信有限公司 | 移动设备 |
ES2757810T3 (es) * | 2017-05-24 | 2020-04-30 | Guangdong Oppo Mobile Telecommunications Corp Ltd | Soporte para componente electrónico, montaje de componentes electrónicos y terminal móvil |
JP7218084B2 (ja) * | 2017-06-22 | 2023-02-06 | カシオ計算機株式会社 | 基板構造 |
JP2019009214A (ja) * | 2017-06-22 | 2019-01-17 | カシオ計算機株式会社 | 電子機器 |
DE212019000256U1 (de) * | 2018-03-30 | 2020-12-21 | Panasonic Intellectual Property Management Co., Ltd. | Kameraplatinenmodul, Kameraeinheit und Verbindungsstruktur für Objektivtubus-Sockelteil und Sensorplatte in einer Kameraeinheit |
CN111031654B (zh) * | 2018-10-09 | 2021-01-26 | 群光电子股份有限公司 | 多层电路板结构 |
JP7287579B2 (ja) * | 2020-10-19 | 2023-06-06 | 株式会社村田製作所 | 電子機器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5438482A (en) * | 1993-07-28 | 1995-08-01 | Kabushiki Kaisha Toshiba | Electronic apparatus having a shield structure |
US5659459A (en) * | 1992-05-20 | 1997-08-19 | Seiko Epson Corporation | Cartridge for electronic devices including grounding pads and conductive shielding to decrease the wavelength of emitted electromagnetic radiation |
JP2004071629A (ja) * | 2002-08-01 | 2004-03-04 | Toshiba Corp | シールド構造およびシールド構造を有する電子機器 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4203147A (en) * | 1973-08-02 | 1980-05-13 | A.R.D. Anstalt | Electrostatic shielding assembly for mounting electric circuit boards |
US4399487A (en) * | 1980-09-12 | 1983-08-16 | Siemens Ag | Insulated plug-in module |
US4658334A (en) * | 1986-03-19 | 1987-04-14 | Rca Corporation | RF signal shielding enclosure of electronic systems |
JPS6355483A (ja) * | 1986-08-25 | 1988-03-09 | Furuno Electric Co Ltd | Ppiソナ− |
US5265265A (en) * | 1990-02-09 | 1993-11-23 | Seiko Epson Corporation | Wristwatch radio communication device having an improved noise shielding structure |
US5053924A (en) * | 1990-03-30 | 1991-10-01 | Motorola, Inc. | Electromagnetic shield for electrical circuit |
FI88244C (fi) * | 1990-12-13 | 1993-04-13 | Nokia Mobile Phones Ltd | Jordad mellanstomme foer kretsskivor |
JP2825670B2 (ja) * | 1990-12-14 | 1998-11-18 | 富士通株式会社 | 高周波回路装置のシールド構造 |
JPH05114792A (ja) | 1991-10-23 | 1993-05-07 | Samitsukusu:Kk | メモリーカードケース |
JPH0629684A (ja) * | 1992-07-08 | 1994-02-04 | Fujitsu Ltd | シールド筐体 |
JPH07270457A (ja) * | 1994-04-01 | 1995-10-20 | Seiko Epson Corp | デジタルマルチメータ |
JP3128182B2 (ja) | 1994-07-29 | 2001-01-29 | 松下電器産業株式会社 | 電子機器装置 |
US5566053A (en) * | 1995-10-11 | 1996-10-15 | Chou; Jonie | Electric receptacle assembly |
JP2734439B2 (ja) * | 1995-12-29 | 1998-03-30 | 日本電気株式会社 | プリント基板のシールド構造 |
US6058024A (en) * | 1997-07-17 | 2000-05-02 | Tektronix, Inc. | Electronic instrument with electromagnetic interference shield and method of manufacturing |
JPH11145650A (ja) | 1997-11-07 | 1999-05-28 | Nec Saitama Ltd | プリント基板固定構造 |
JPH11177278A (ja) * | 1997-12-09 | 1999-07-02 | Hitachi Cable Ltd | 論理機能付き光送受信モジュール |
JPH11307968A (ja) | 1998-04-20 | 1999-11-05 | Matsushita Electric Ind Co Ltd | 電子制御装置の放熱構造 |
JP2000181362A (ja) * | 1998-12-17 | 2000-06-30 | Alps Electric Co Ltd | 液晶表示装置 |
US6213651B1 (en) * | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
JP3270028B2 (ja) * | 1999-09-10 | 2002-04-02 | 株式会社ソニー・コンピュータエンタテインメント | 電磁シールド板、電磁シールド構造体及びエンタテインメント装置 |
JP2003115564A (ja) * | 2001-10-03 | 2003-04-18 | Murata Mfg Co Ltd | 電子回路装置 |
JP4037810B2 (ja) * | 2003-09-05 | 2008-01-23 | Necアクセステクニカ株式会社 | 小型無線装置及びその実装方法 |
JP4448954B2 (ja) | 2004-12-22 | 2010-04-14 | 晃雄 金田 | 入浴用タオル、垢すりおよび清掃具 |
JP4511408B2 (ja) * | 2005-04-18 | 2010-07-28 | 富士通株式会社 | 表示モジュールおよび携帯端末装置 |
-
2006
- 2006-07-20 JP JP2006198386A patent/JP4844883B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-18 CN CN200780027536.0A patent/CN101491171B/zh not_active Expired - Fee Related
- 2007-07-18 WO PCT/JP2007/064186 patent/WO2008010518A1/ja active Application Filing
- 2007-07-18 EP EP07790940A patent/EP2046107A4/en not_active Withdrawn
- 2007-07-18 US US12/374,358 patent/US8116099B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5659459A (en) * | 1992-05-20 | 1997-08-19 | Seiko Epson Corporation | Cartridge for electronic devices including grounding pads and conductive shielding to decrease the wavelength of emitted electromagnetic radiation |
US5438482A (en) * | 1993-07-28 | 1995-08-01 | Kabushiki Kaisha Toshiba | Electronic apparatus having a shield structure |
JP2004071629A (ja) * | 2002-08-01 | 2004-03-04 | Toshiba Corp | シールド構造およびシールド構造を有する電子機器 |
Also Published As
Publication number | Publication date |
---|---|
CN101491171A (zh) | 2009-07-22 |
JP4844883B2 (ja) | 2011-12-28 |
JP2008028106A (ja) | 2008-02-07 |
US8116099B2 (en) | 2012-02-14 |
EP2046107A1 (en) | 2009-04-08 |
US20100014267A1 (en) | 2010-01-21 |
WO2008010518A1 (fr) | 2008-01-24 |
EP2046107A4 (en) | 2009-12-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141126 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141126 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120208 Termination date: 20170718 |
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CF01 | Termination of patent right due to non-payment of annual fee |