CN101426959B - 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法 - Google Patents

电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法 Download PDF

Info

Publication number
CN101426959B
CN101426959B CN2007800145140A CN200780014514A CN101426959B CN 101426959 B CN101426959 B CN 101426959B CN 2007800145140 A CN2007800145140 A CN 2007800145140A CN 200780014514 A CN200780014514 A CN 200780014514A CN 101426959 B CN101426959 B CN 101426959B
Authority
CN
China
Prior art keywords
copper foil
electrolytic copper
electrolytic
mentioned
additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2007800145140A
Other languages
English (en)
Chinese (zh)
Other versions
CN101426959A (zh
Inventor
酒井久雄
高桥胜
松田光由
土桥诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of CN101426959A publication Critical patent/CN101426959A/zh
Application granted granted Critical
Publication of CN101426959B publication Critical patent/CN101426959B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
CN2007800145140A 2006-04-28 2007-04-26 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法 Active CN101426959B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006126720 2006-04-28
JP126720/2006 2006-04-28
JP2006252595 2006-09-19
JP252595/2006 2006-09-19
PCT/JP2007/059056 WO2007125994A1 (ja) 2006-04-28 2007-04-26 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法

Publications (2)

Publication Number Publication Date
CN101426959A CN101426959A (zh) 2009-05-06
CN101426959B true CN101426959B (zh) 2010-11-17

Family

ID=38655519

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800145140A Active CN101426959B (zh) 2006-04-28 2007-04-26 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法

Country Status (5)

Country Link
US (1) US9307639B2 (cg-RX-API-DMAC7.html)
KR (1) KR101154203B1 (cg-RX-API-DMAC7.html)
CN (1) CN101426959B (cg-RX-API-DMAC7.html)
TW (1) TW200745385A (cg-RX-API-DMAC7.html)
WO (1) WO2007125994A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955988A (zh) * 2013-01-31 2015-09-30 三井金属矿业株式会社 电解铜箔、该电解铜箔的制造方法及用该电解铜箔得到的表面处理铜箔

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5752301B2 (ja) * 2007-10-31 2015-07-22 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
JP5588607B2 (ja) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
JP5255349B2 (ja) * 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
JP4422790B1 (ja) * 2009-09-17 2010-02-24 宇部興産株式会社 フレキシブル金属積層体の製造方法
JP5598700B2 (ja) * 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 電解銅箔及びその製造方法
CN105386088B (zh) * 2010-07-01 2018-06-29 三井金属矿业株式会社 电解铜箔以及其制造方法
PH12013501057A1 (en) * 2010-11-22 2013-09-09 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil
JP5074611B2 (ja) * 2011-03-30 2012-11-14 Ｊｘ日鉱日石金属株式会社 二次電池負極集電体用電解銅箔及びその製造方法
KR20160138321A (ko) 2011-06-30 2016-12-02 후루카와 덴키 고교 가부시키가이샤 전해 동박, 상기 전해 동박의 제조 방법 및 상기 전해 동박을 집전체로 하는 리튬 이온 이차 전지
US8956688B2 (en) 2011-10-12 2015-02-17 Ut-Battelle, Llc Aqueous processing of composite lithium ion electrode material
US9347441B2 (en) * 2012-03-30 2016-05-24 Sabic Global Technologies B.V. Compressors including polymeric components
CN102703938B (zh) * 2012-06-07 2015-04-22 上海交通大学 硫酸铜电镀液的应力消除剂
CN104603333B (zh) * 2012-09-10 2017-11-10 Jx日矿日石金属株式会社 表面处理铜箔及使用其的积层板
WO2015016271A1 (ja) * 2013-08-01 2015-02-05 古河電気工業株式会社 プリント配線基板用銅箔
KR101500565B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
KR101500566B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
KR101633725B1 (ko) 2014-05-13 2016-06-27 (주)피엔티 합금박 제조 장치
JP2017014608A (ja) * 2015-07-06 2017-01-19 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池、プリント配線板並びに電磁波シールド材
WO2017090161A1 (ja) * 2015-11-26 2017-06-01 近藤　和夫 酸性銅めっき液、酸性銅めっき物および半導体デバイスの製造方法
KR101992840B1 (ko) 2017-06-20 2019-06-27 케이씨에프테크놀로지스 주식회사 울음과 찢김이 최소화된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조 방법
KR102433032B1 (ko) 2017-07-31 2022-08-16 에스케이넥실리스 주식회사 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP7450932B2 (ja) * 2018-12-10 2024-03-18 日本電解株式会社 電解銅箔及びその製造方法
CN110331421A (zh) * 2019-04-30 2019-10-15 江苏华威铜业有限公司 一种电解铜箔及其制造工艺
KR102772840B1 (ko) 2019-07-10 2025-02-27 주식회사 엘지에너지솔루션 금속 박막 보관장치 및 이를 이용한 금속 박막 보관방법
JP6667840B1 (ja) 2019-07-22 2020-03-18 テックス・テクノロジー株式会社 電解銅箔の製造方法
TWI705160B (zh) * 2019-12-09 2020-09-21 長春石油化學股份有限公司 電解銅箔、包含其的電極和覆銅積層板
JP7656555B2 (ja) * 2020-01-30 2025-04-03 三井金属鉱業株式会社 電解銅箔
KR102844898B1 (ko) 2020-04-27 2025-08-11 엘지이노텍 주식회사 회로기판, 센서 구동장치 및 이를 포함하는 카메라 모듈
CN111607810A (zh) * 2020-07-14 2020-09-01 安徽铜冠铜箔集团股份有限公司 一种超薄电解铜箔高效生产方法
CN112469194B (zh) * 2020-11-27 2022-08-05 广东嘉元科技股份有限公司 一种高密互联电路板用低轮廓电解铜箔
CN112680751A (zh) * 2020-12-08 2021-04-20 九江德福科技股份有限公司 一种高强度电子铜箔制备方法
CN112964495B (zh) * 2021-02-04 2024-07-09 赣州逸豪新材料股份有限公司 一种电解铜箔电解高温剥离抽样检测装置及其实施方法
KR102495997B1 (ko) * 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN113354445B (zh) * 2021-05-24 2022-04-15 常州大学 填充材料及制备方法、高延展性低轮廓电解铜箔制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1193360A (zh) * 1996-05-13 1998-09-16 三井金属矿业株式会社 高抗张强度电解铜箔及其制造方法
US6231742B1 (en) * 1997-05-30 2001-05-15 Fukuda Metal Foil & Powder Co., Ltd. Electrolytic Copper foil and process for producing the same
CN1380915A (zh) * 2000-05-18 2002-11-20 三井金属鉱业株式会社 制备电解铜箔的电解装置和该装置制得的电解铜箔

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
JP3053440B2 (ja) * 1996-08-23 2000-06-19 グールド エレクトロニクス インコーポレイテッド 高性能の可撓性積層体
JP4419161B2 (ja) 1999-10-27 2010-02-24 Ｄｏｗａホールディングス株式会社 電解銅箔の製造方法
CN1301046C (zh) * 2002-05-13 2007-02-14 三井金属鉱业株式会社 膜上芯片用软性印刷线路板
JP4120806B2 (ja) 2002-10-25 2008-07-16 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
ES2348207T3 (es) * 2002-12-18 2010-12-01 NIPPON MINING & METALS CO., LTD. Solución electrolítica de cobre y lámina de cobre electrolítico producida a partir de la misma.
US20060191798A1 (en) * 2003-04-03 2006-08-31 Fukuda Metal Foil & Powder Co., Ltd. Electrolytic copper foil with low roughness surface and process for producing the same
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1193360A (zh) * 1996-05-13 1998-09-16 三井金属矿业株式会社 高抗张强度电解铜箔及其制造方法
US6231742B1 (en) * 1997-05-30 2001-05-15 Fukuda Metal Foil & Powder Co., Ltd. Electrolytic Copper foil and process for producing the same
CN1380915A (zh) * 2000-05-18 2002-11-20 三井金属鉱业株式会社 制备电解铜箔的电解装置和该装置制得的电解铜箔

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
全文.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955988A (zh) * 2013-01-31 2015-09-30 三井金属矿业株式会社 电解铜箔、该电解铜箔的制造方法及用该电解铜箔得到的表面处理铜箔

Also Published As

Publication number Publication date
TW200745385A (en) 2007-12-16
US20090095515A1 (en) 2009-04-16
TWI359212B (cg-RX-API-DMAC7.html) 2012-03-01
KR101154203B1 (ko) 2012-06-18
WO2007125994A1 (ja) 2007-11-08
CN101426959A (zh) 2009-05-06
KR20090026128A (ko) 2009-03-11
US9307639B2 (en) 2016-04-05

Similar Documents

Publication Publication Date Title
CN101426959B (zh) 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP5255229B2 (ja) 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
JP5588607B2 (ja) 電解銅箔及びその電解銅箔の製造方法
TWI245082B (en) Electrolyte solution for manufacturing electrolytic copper foil and electrolytic copper foil manufacturing method using the same
JP5752301B2 (ja) 電解銅箔及びその電解銅箔の製造方法
TWI434965B (zh) A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
CN103348041B (zh) 电解铜合金箔、其制备方法、制备中所用的电解液、使用该电解铜合金箔的二次电池用负极集电体、二次电池及其电极
KR101050016B1 (ko) 전해 동박의 제조 방법, 이 제조 방법으로 얻어지는 전해동박, 이 전해 동박을 이용하여 얻어지는 표면 처리 동박,및 전해 동박 또는 표면 처리 동박을 이용하여 얻어지는동박 적층판
KR20070117465A (ko) 표면 처리 전해 동박 및 그 제조 방법, 및 회로 기판
US8329315B2 (en) Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method
CN101851769A (zh) 电解铜箔及其制造方法、表面处理电解铜箔、覆铜层压板及印刷电路板
JP5301886B2 (ja) 電解銅箔及びその電解銅箔の製造方法
KR20040073376A (ko) 미세 패턴 프린트 배선용 동박과 그 제조방법
CN103221583A (zh) 表面处理铜箔
CN1989793A (zh) 表面处理铜箔及采用该表面处理铜箔制造的挠性镀铜膜层压板以及薄膜状载体带
JP5441945B2 (ja) ベリーロープロファイル銅箔を担体とした極く薄い銅箔及びその製法。
TW201428112A (zh) 電解銅箔、包含該箔的電氣組件和電池及其製備方法
JP4065004B2 (ja) 電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板
JP3756852B2 (ja) 電解銅箔の製造方法
JP3910623B1 (ja) 電解銅箔の製造方法及びその製造方法で得られた電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板
CN102233699B (zh) 以超低棱线铜箔为载体的极薄铜箔及其制造方法
JPS63310990A (ja) 電解銅箔の製造方法
JP4360635B2 (ja) 銅メタライズドフィルムの製造方法及びその製造方法で製造された銅メタライズドフィルム。
JP2007131909A (ja) 電解銅箔の製造に用いられる銅電解液及び該銅電解液を用いて得られた電解銅箔
CN101297067A (zh) 电解铜箔的制造方法、该制造方法得到的电解铜箔、使用该电解铜箔得到的表面处理铜箔以及使用该电解铜箔或该表面处理铜箔得到的覆铜层压板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant