CN101412910B - 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 - Google Patents

发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 Download PDF

Info

Publication number
CN101412910B
CN101412910B CN2008101769788A CN200810176978A CN101412910B CN 101412910 B CN101412910 B CN 101412910B CN 2008101769788 A CN2008101769788 A CN 2008101769788A CN 200810176978 A CN200810176978 A CN 200810176978A CN 101412910 B CN101412910 B CN 101412910B
Authority
CN
China
Prior art keywords
light
emitting device
emitting
phosphor particles
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008101769788A
Other languages
English (en)
Chinese (zh)
Other versions
CN101412910A (zh
Inventor
增田昌嗣
寺岛贤二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
GE Phosphors Technology LLC
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN101412910A publication Critical patent/CN101412910A/zh
Application granted granted Critical
Publication of CN101412910B publication Critical patent/CN101412910B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/16Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
    • C04B35/22Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in calcium oxide, e.g. wollastonite
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/581Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/597Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon oxynitride, e.g. SIALONS
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/77742Silicates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3201Alkali metal oxides or oxide-forming salts thereof
    • C04B2235/3203Lithium oxide or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3206Magnesium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3208Calcium oxide or oxide-forming salts thereof, e.g. lime
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3225Yttrium oxide or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C04B2235/3229Cerium oxides or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38Non-oxide ceramic constituents or additives
    • C04B2235/3852Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5418Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • C04B2235/767Hexagonal symmetry, e.g. beta-Si3N4, beta-Sialon, alpha-SiC or hexa-ferrites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • H10H20/8513Wavelength conversion materials having two or more wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8516Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
CN2008101769788A 2007-07-13 2008-07-10 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 Active CN101412910B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-184440 2007-07-13
JP2007184440 2007-07-13
JP2007184440A JP2009019163A (ja) 2007-07-13 2007-07-13 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置

Publications (2)

Publication Number Publication Date
CN101412910A CN101412910A (zh) 2009-04-22
CN101412910B true CN101412910B (zh) 2013-01-09

Family

ID=40252342

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101769788A Active CN101412910B (zh) 2007-07-13 2008-07-10 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置

Country Status (3)

Country Link
US (1) US7808012B2 (enExample)
JP (1) JP2009019163A (enExample)
CN (1) CN101412910B (enExample)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
EP2474856A4 (en) * 2009-08-31 2013-08-14 Sharp Kk LIQUID CRYSTAL DISPLAY
CN102656248B (zh) * 2010-01-08 2014-07-16 夏普株式会社 荧光体、发光装置及使用它的液晶显示装置
EP2540798A4 (en) * 2010-02-26 2014-04-30 Mitsubishi Chem Corp Halophosphate Phosphorus and White Light Output Device
JP2011225696A (ja) * 2010-04-19 2011-11-10 Sharp Corp 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置
WO2012011444A1 (ja) * 2010-07-20 2012-01-26 電気化学工業株式会社 β型サイアロン、β型サイアロンの製造方法及び発光装置
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
JP4974310B2 (ja) * 2010-10-15 2012-07-11 三菱化学株式会社 白色発光装置及び照明器具
US8742654B2 (en) * 2011-02-25 2014-06-03 Cree, Inc. Solid state light emitting devices including nonhomogeneous luminophoric particle size layers
CN102683542B (zh) * 2011-03-15 2014-12-10 展晶科技(深圳)有限公司 Led封装结构
US8957438B2 (en) 2011-04-07 2015-02-17 Cree, Inc. Methods of fabricating light emitting devices including multiple sequenced luminophoric layers
EP3270425A1 (en) * 2011-04-22 2018-01-17 Kabushiki Kaisha Toshiba White light source and white light source system including the same
US8513900B2 (en) * 2011-05-12 2013-08-20 Ledengin, Inc. Apparatus for tuning of emitter with multiple LEDs to a single color bin
CN102810618B (zh) * 2011-06-02 2015-04-29 展晶科技(深圳)有限公司 半导体封装结构
DE102011078402A1 (de) 2011-06-30 2013-01-03 Osram Ag Konversionselement und Leuchtdiode mit einem solchen Konversionselement
KR101786097B1 (ko) * 2011-07-14 2017-10-17 엘지이노텍 주식회사 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법
TWI505515B (zh) * 2011-08-19 2015-10-21 Epistar Corp 發光裝置及其製造方法
JP5866870B2 (ja) * 2011-08-26 2016-02-24 三菱化学株式会社 発光装置
CN102956800B (zh) * 2011-08-31 2016-08-03 晶元光电股份有限公司 波长转换结构及其制造方法以及发光装置
US9082993B2 (en) * 2011-09-06 2015-07-14 Ezeddin Mohajerani Organic light emitting diodes having increased illumination
JP2013106550A (ja) * 2011-11-18 2013-06-06 Sharp Corp 植物育成用照明装置
JP5916412B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP5916411B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP5937837B2 (ja) * 2012-02-09 2016-06-22 デンカ株式会社 蛍光体及び発光装置
JP5697765B2 (ja) * 2012-02-09 2015-04-08 電気化学工業株式会社 蛍光体及び発光装置
JP2015083618A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
JP5901987B2 (ja) * 2012-02-09 2016-04-13 デンカ株式会社 蛍光体及び発光装置
JP2013163732A (ja) * 2012-02-09 2013-08-22 Denki Kagaku Kogyo Kk 蛍光体及び発光装置
EP2823017B1 (en) * 2012-03-06 2017-04-19 Nitto Denko Corporation Ceramic body for light emitting devices
JP2013191385A (ja) * 2012-03-13 2013-09-26 Toshiba Lighting & Technology Corp 照明装置
CN104871323B (zh) * 2012-12-28 2018-07-13 夏普株式会社 发光装置
JP2014165225A (ja) * 2013-02-21 2014-09-08 Toshiba Lighting & Technology Corp 発光モジュールおよび照明装置
JP2014203932A (ja) 2013-04-03 2014-10-27 株式会社東芝 発光装置
CN104465936B (zh) * 2013-09-13 2017-05-24 展晶科技(深圳)有限公司 发光二极管
JP5620562B1 (ja) * 2013-10-23 2014-11-05 株式会社光波 単結晶蛍光体及び発光装置
JP6394742B2 (ja) * 2014-03-14 2018-09-26 日亜化学工業株式会社 発光装置の製造方法
TWI528601B (zh) * 2014-04-30 2016-04-01 新世紀光電股份有限公司 封裝方法及封裝結構
KR20150145798A (ko) * 2014-06-19 2015-12-31 삼성디스플레이 주식회사 백라이트 어셈블리 및 그를 포함하는 표시장치
KR101467808B1 (ko) * 2014-07-14 2014-12-03 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
US9530943B2 (en) 2015-02-27 2016-12-27 Ledengin, Inc. LED emitter packages with high CRI
JP6354626B2 (ja) * 2015-03-09 2018-07-11 豊田合成株式会社 発光装置の製造方法
US10752836B2 (en) 2015-05-07 2020-08-25 Osram Oled Gmbh Phosphor
WO2017077739A1 (ja) * 2015-11-04 2017-05-11 シャープ株式会社 発光体、発光装置、照明装置、および発光体の製造方法
WO2017134994A1 (ja) * 2016-02-02 2017-08-10 シチズン電子株式会社 発光装置およびその製造方法
CN109073801A (zh) * 2016-04-25 2018-12-21 日本特殊陶业株式会社 波长转换构件、其制造方法及发光装置
US10886437B2 (en) * 2016-11-03 2021-01-05 Lumileds Llc Devices and structures bonded by inorganic coating
US10219345B2 (en) 2016-11-10 2019-02-26 Ledengin, Inc. Tunable LED emitter with continuous spectrum
JP2018137321A (ja) * 2017-02-21 2018-08-30 シャープ株式会社 発光装置および画像表示装置
CN108807699B (zh) * 2017-04-26 2021-02-02 张家港康得新光电材料有限公司 透明显示膜
JP7280866B2 (ja) * 2018-03-29 2023-05-24 デンカ株式会社 α型サイアロン蛍光体及び発光装置
EP4293733B1 (en) 2022-01-20 2025-10-01 Mitsubishi Chemical Corporation Phosphor, light-emitting device, illumination device, image display device, and indicator lamp for vehicle
KR102599818B1 (ko) 2022-01-20 2023-11-08 미쯔비시 케미컬 주식회사 형광체, 발광 장치, 조명 장치, 화상 표시 장치 및 차량용 표시등
JP2024169041A (ja) * 2023-05-25 2024-12-05 日亜化学工業株式会社 発光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1874019A (zh) * 2005-05-30 2006-12-06 夏普株式会社 发光器件及其制造方法
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9709998B1 (pt) 1996-06-26 2010-04-20 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
US6686691B1 (en) 1999-09-27 2004-02-03 Lumileds Lighting, U.S., Llc Tri-color, white light LED lamps
JP2003121838A (ja) 2001-08-06 2003-04-23 Toray Ind Inc 液晶表示装置
JP2003321675A (ja) 2002-04-26 2003-11-14 Nichia Chem Ind Ltd 窒化物蛍光体及びその製造方法
JP2004210921A (ja) 2002-12-27 2004-07-29 Nichia Chem Ind Ltd オキシ窒化物蛍光体及びその製造方法並びにそれを用いた発光装置
JP4124684B2 (ja) 2003-03-25 2008-07-23 セイコーインスツル株式会社 半透過型液晶表示装置
JP2005091480A (ja) 2003-09-12 2005-04-07 Nitto Denko Corp 異方性フィルムの製造方法
JP2005244075A (ja) * 2004-02-27 2005-09-08 Matsushita Electric Works Ltd 発光装置
JP4451178B2 (ja) * 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
US8417215B2 (en) * 2004-07-28 2013-04-09 Koninklijke Philips Electronics N.V. Method for positioning of wireless medical devices with short-range radio frequency technology
JP4674348B2 (ja) * 2004-09-22 2011-04-20 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
JP2007049114A (ja) * 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
JP4817728B2 (ja) * 2005-06-29 2011-11-16 株式会社東芝 超音波診断装置
JP4832995B2 (ja) * 2005-09-01 2011-12-07 シャープ株式会社 発光装置
JP4769132B2 (ja) * 2005-11-30 2011-09-07 シャープ株式会社 発光装置
EP2682446A3 (en) * 2006-06-27 2014-03-26 Mitsubishi Chemical Corporation Illuminating device
JP5367218B2 (ja) * 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
JP2008300544A (ja) * 2007-05-30 2008-12-11 Sharp Corp 発光装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置
CN1874019A (zh) * 2005-05-30 2006-12-06 夏普株式会社 发光器件及其制造方法

Also Published As

Publication number Publication date
US7808012B2 (en) 2010-10-05
US20090014741A1 (en) 2009-01-15
JP2009019163A (ja) 2009-01-29
CN101412910A (zh) 2009-04-22

Similar Documents

Publication Publication Date Title
CN101412910B (zh) 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置
CN101019241B (zh) 用于白光发光二极管(led)的新颖磷光体系统
TWI420710B (zh) White light and its use of white light-emitting diode lighting device
TWI655789B (zh) 發光裝置
JP4932248B2 (ja) 黄色発光蛍光体、それを用いた白色発光素子、およびそれを用いた照明装置
US20070090381A1 (en) Semiconductor light emitting device
JP2021068918A (ja) 白色光源
US8350463B2 (en) Alpha-sialon phosphor
CN101184823B (zh) 包括补偿彩色缺陷的发光材料的照明系统
CN103311413A (zh) 白色发光装置
CN102017044A (zh) 用于发白光二极管(led)的多芯片激发系统
JP2003535477A (ja) Ledベースの白色に発光する照明ユニット
JP2007180483A (ja) 発光装置
CN102473815A (zh) 发光装置
TWI325441B (en) Green phosphor of thiogallate, red phosphor of alkaline earth sulfide and white light emitting device thereof
CN110305661A (zh) 红色氮化物萤光体及其发光装置
TWI322514B (enExample)
CN100543361C (zh) 发光装置
EP3900058B1 (en) Cyan phosphor-converted led module
US7998365B2 (en) Thiogallate phosphor and white light emitting device employing the same
KR101116855B1 (ko) 혼합 형광체, 및 이를 활용한 고연색성 발광 패키지
CN101207168B (zh) 白光发光装置
KR101430585B1 (ko) Rare earth가 첨가된 oxy-fluoride계 형광체 및 상기 형광체가 적용된 백색 발광소자
TW201910485A (zh) 螢光材料與發光裝置
KR100906923B1 (ko) 형광체, 코팅 형광체 조성물, 형광체 제조방법 및 발광소자

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160715

Address after: American New York

Patentee after: GE Phosphor Technology Limited Liability Company

Address before: Japan Osaka

Patentee before: Sharp Corporation

TR01 Transfer of patent right

Effective date of registration: 20201109

Address after: Tokyo, Japan

Patentee after: DENKA Co.,Ltd.

Patentee after: GE PHOSPHORS TECHNOLOGY, LLC

Address before: New York State, USA

Patentee before: GE PHOSPHORS TECHNOLOGY, LLC

TR01 Transfer of patent right