CN101412910B - 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 - Google Patents
发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 Download PDFInfo
- Publication number
- CN101412910B CN101412910B CN2008101769788A CN200810176978A CN101412910B CN 101412910 B CN101412910 B CN 101412910B CN 2008101769788 A CN2008101769788 A CN 2008101769788A CN 200810176978 A CN200810176978 A CN 200810176978A CN 101412910 B CN101412910 B CN 101412910B
- Authority
- CN
- China
- Prior art keywords
- light
- emitting device
- emitting
- phosphor particles
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/22—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in calcium oxide, e.g. wollastonite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/597—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon oxynitride, e.g. SIALONS
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/77742—Silicates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
- C04B2235/3203—Lithium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3229—Cerium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/767—Hexagonal symmetry, e.g. beta-Si3N4, beta-Sialon, alpha-SiC or hexa-ferrites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-184440 | 2007-07-13 | ||
| JP2007184440 | 2007-07-13 | ||
| JP2007184440A JP2009019163A (ja) | 2007-07-13 | 2007-07-13 | 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101412910A CN101412910A (zh) | 2009-04-22 |
| CN101412910B true CN101412910B (zh) | 2013-01-09 |
Family
ID=40252342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101769788A Active CN101412910B (zh) | 2007-07-13 | 2008-07-10 | 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7808012B2 (enExample) |
| JP (1) | JP2009019163A (enExample) |
| CN (1) | CN101412910B (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007049114A (ja) | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| US20070052342A1 (en) * | 2005-09-01 | 2007-03-08 | Sharp Kabushiki Kaisha | Light-emitting device |
| JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
| JP5284006B2 (ja) * | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | 発光装置 |
| EP2474856A4 (en) * | 2009-08-31 | 2013-08-14 | Sharp Kk | LIQUID CRYSTAL DISPLAY |
| CN102656248B (zh) * | 2010-01-08 | 2014-07-16 | 夏普株式会社 | 荧光体、发光装置及使用它的液晶显示装置 |
| EP2540798A4 (en) * | 2010-02-26 | 2014-04-30 | Mitsubishi Chem Corp | Halophosphate Phosphorus and White Light Output Device |
| JP2011225696A (ja) * | 2010-04-19 | 2011-11-10 | Sharp Corp | 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置 |
| WO2012011444A1 (ja) * | 2010-07-20 | 2012-01-26 | 電気化学工業株式会社 | β型サイアロン、β型サイアロンの製造方法及び発光装置 |
| CN102376860A (zh) | 2010-08-05 | 2012-03-14 | 夏普株式会社 | 发光装置及其制造方法 |
| JP4974310B2 (ja) * | 2010-10-15 | 2012-07-11 | 三菱化学株式会社 | 白色発光装置及び照明器具 |
| US8742654B2 (en) * | 2011-02-25 | 2014-06-03 | Cree, Inc. | Solid state light emitting devices including nonhomogeneous luminophoric particle size layers |
| CN102683542B (zh) * | 2011-03-15 | 2014-12-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
| US8957438B2 (en) | 2011-04-07 | 2015-02-17 | Cree, Inc. | Methods of fabricating light emitting devices including multiple sequenced luminophoric layers |
| EP3270425A1 (en) * | 2011-04-22 | 2018-01-17 | Kabushiki Kaisha Toshiba | White light source and white light source system including the same |
| US8513900B2 (en) * | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
| CN102810618B (zh) * | 2011-06-02 | 2015-04-29 | 展晶科技(深圳)有限公司 | 半导体封装结构 |
| DE102011078402A1 (de) | 2011-06-30 | 2013-01-03 | Osram Ag | Konversionselement und Leuchtdiode mit einem solchen Konversionselement |
| KR101786097B1 (ko) * | 2011-07-14 | 2017-10-17 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
| TWI505515B (zh) * | 2011-08-19 | 2015-10-21 | Epistar Corp | 發光裝置及其製造方法 |
| JP5866870B2 (ja) * | 2011-08-26 | 2016-02-24 | 三菱化学株式会社 | 発光装置 |
| CN102956800B (zh) * | 2011-08-31 | 2016-08-03 | 晶元光电股份有限公司 | 波长转换结构及其制造方法以及发光装置 |
| US9082993B2 (en) * | 2011-09-06 | 2015-07-14 | Ezeddin Mohajerani | Organic light emitting diodes having increased illumination |
| JP2013106550A (ja) * | 2011-11-18 | 2013-06-06 | Sharp Corp | 植物育成用照明装置 |
| JP5916412B2 (ja) * | 2012-02-09 | 2016-05-11 | デンカ株式会社 | 蛍光体及び発光装置 |
| JP5916411B2 (ja) * | 2012-02-09 | 2016-05-11 | デンカ株式会社 | 蛍光体及び発光装置 |
| JP5937837B2 (ja) * | 2012-02-09 | 2016-06-22 | デンカ株式会社 | 蛍光体及び発光装置 |
| JP5697765B2 (ja) * | 2012-02-09 | 2015-04-08 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
| JP2015083618A (ja) * | 2012-02-09 | 2015-04-30 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
| JP5901987B2 (ja) * | 2012-02-09 | 2016-04-13 | デンカ株式会社 | 蛍光体及び発光装置 |
| JP2013163732A (ja) * | 2012-02-09 | 2013-08-22 | Denki Kagaku Kogyo Kk | 蛍光体及び発光装置 |
| EP2823017B1 (en) * | 2012-03-06 | 2017-04-19 | Nitto Denko Corporation | Ceramic body for light emitting devices |
| JP2013191385A (ja) * | 2012-03-13 | 2013-09-26 | Toshiba Lighting & Technology Corp | 照明装置 |
| CN104871323B (zh) * | 2012-12-28 | 2018-07-13 | 夏普株式会社 | 发光装置 |
| JP2014165225A (ja) * | 2013-02-21 | 2014-09-08 | Toshiba Lighting & Technology Corp | 発光モジュールおよび照明装置 |
| JP2014203932A (ja) | 2013-04-03 | 2014-10-27 | 株式会社東芝 | 発光装置 |
| CN104465936B (zh) * | 2013-09-13 | 2017-05-24 | 展晶科技(深圳)有限公司 | 发光二极管 |
| JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
| JP6394742B2 (ja) * | 2014-03-14 | 2018-09-26 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| TWI528601B (zh) * | 2014-04-30 | 2016-04-01 | 新世紀光電股份有限公司 | 封裝方法及封裝結構 |
| KR20150145798A (ko) * | 2014-06-19 | 2015-12-31 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 그를 포함하는 표시장치 |
| KR101467808B1 (ko) * | 2014-07-14 | 2014-12-03 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
| US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
| JP6354626B2 (ja) * | 2015-03-09 | 2018-07-11 | 豊田合成株式会社 | 発光装置の製造方法 |
| US10752836B2 (en) | 2015-05-07 | 2020-08-25 | Osram Oled Gmbh | Phosphor |
| WO2017077739A1 (ja) * | 2015-11-04 | 2017-05-11 | シャープ株式会社 | 発光体、発光装置、照明装置、および発光体の製造方法 |
| WO2017134994A1 (ja) * | 2016-02-02 | 2017-08-10 | シチズン電子株式会社 | 発光装置およびその製造方法 |
| CN109073801A (zh) * | 2016-04-25 | 2018-12-21 | 日本特殊陶业株式会社 | 波长转换构件、其制造方法及发光装置 |
| US10886437B2 (en) * | 2016-11-03 | 2021-01-05 | Lumileds Llc | Devices and structures bonded by inorganic coating |
| US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
| JP2018137321A (ja) * | 2017-02-21 | 2018-08-30 | シャープ株式会社 | 発光装置および画像表示装置 |
| CN108807699B (zh) * | 2017-04-26 | 2021-02-02 | 张家港康得新光电材料有限公司 | 透明显示膜 |
| JP7280866B2 (ja) * | 2018-03-29 | 2023-05-24 | デンカ株式会社 | α型サイアロン蛍光体及び発光装置 |
| EP4293733B1 (en) | 2022-01-20 | 2025-10-01 | Mitsubishi Chemical Corporation | Phosphor, light-emitting device, illumination device, image display device, and indicator lamp for vehicle |
| KR102599818B1 (ko) | 2022-01-20 | 2023-11-08 | 미쯔비시 케미컬 주식회사 | 형광체, 발광 장치, 조명 장치, 화상 표시 장치 및 차량용 표시등 |
| JP2024169041A (ja) * | 2023-05-25 | 2024-12-05 | 日亜化学工業株式会社 | 発光装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1874019A (zh) * | 2005-05-30 | 2006-12-06 | 夏普株式会社 | 发光器件及其制造方法 |
| CN1881629A (zh) * | 2005-03-18 | 2006-12-20 | 株式会社藤仓 | 发光器件和照明装置 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR9709998B1 (pt) | 1996-06-26 | 2010-04-20 | elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência | |
| US6686691B1 (en) | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
| JP2003121838A (ja) | 2001-08-06 | 2003-04-23 | Toray Ind Inc | 液晶表示装置 |
| JP2003321675A (ja) | 2002-04-26 | 2003-11-14 | Nichia Chem Ind Ltd | 窒化物蛍光体及びその製造方法 |
| JP2004210921A (ja) | 2002-12-27 | 2004-07-29 | Nichia Chem Ind Ltd | オキシ窒化物蛍光体及びその製造方法並びにそれを用いた発光装置 |
| JP4124684B2 (ja) | 2003-03-25 | 2008-07-23 | セイコーインスツル株式会社 | 半透過型液晶表示装置 |
| JP2005091480A (ja) | 2003-09-12 | 2005-04-07 | Nitto Denko Corp | 異方性フィルムの製造方法 |
| JP2005244075A (ja) * | 2004-02-27 | 2005-09-08 | Matsushita Electric Works Ltd | 発光装置 |
| JP4451178B2 (ja) * | 2004-03-25 | 2010-04-14 | スタンレー電気株式会社 | 発光デバイス |
| JP4128564B2 (ja) * | 2004-04-27 | 2008-07-30 | 松下電器産業株式会社 | 発光装置 |
| US8417215B2 (en) * | 2004-07-28 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Method for positioning of wireless medical devices with short-range radio frequency technology |
| JP4674348B2 (ja) * | 2004-09-22 | 2011-04-20 | 独立行政法人物質・材料研究機構 | 蛍光体とその製造方法および発光器具 |
| JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| JP4817728B2 (ja) * | 2005-06-29 | 2011-11-16 | 株式会社東芝 | 超音波診断装置 |
| JP4832995B2 (ja) * | 2005-09-01 | 2011-12-07 | シャープ株式会社 | 発光装置 |
| JP4769132B2 (ja) * | 2005-11-30 | 2011-09-07 | シャープ株式会社 | 発光装置 |
| EP2682446A3 (en) * | 2006-06-27 | 2014-03-26 | Mitsubishi Chemical Corporation | Illuminating device |
| JP5367218B2 (ja) * | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
| JP2008300544A (ja) * | 2007-05-30 | 2008-12-11 | Sharp Corp | 発光装置およびその製造方法 |
-
2007
- 2007-07-13 JP JP2007184440A patent/JP2009019163A/ja active Pending
-
2008
- 2008-07-10 CN CN2008101769788A patent/CN101412910B/zh active Active
- 2008-07-11 US US12/171,946 patent/US7808012B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1881629A (zh) * | 2005-03-18 | 2006-12-20 | 株式会社藤仓 | 发光器件和照明装置 |
| CN1874019A (zh) * | 2005-05-30 | 2006-12-06 | 夏普株式会社 | 发光器件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7808012B2 (en) | 2010-10-05 |
| US20090014741A1 (en) | 2009-01-15 |
| JP2009019163A (ja) | 2009-01-29 |
| CN101412910A (zh) | 2009-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101412910B (zh) | 发光装置用荧光体粒子集合体、发光装置、及液晶显示用背光装置 | |
| CN101019241B (zh) | 用于白光发光二极管(led)的新颖磷光体系统 | |
| TWI420710B (zh) | White light and its use of white light-emitting diode lighting device | |
| TWI655789B (zh) | 發光裝置 | |
| JP4932248B2 (ja) | 黄色発光蛍光体、それを用いた白色発光素子、およびそれを用いた照明装置 | |
| US20070090381A1 (en) | Semiconductor light emitting device | |
| JP2021068918A (ja) | 白色光源 | |
| US8350463B2 (en) | Alpha-sialon phosphor | |
| CN101184823B (zh) | 包括补偿彩色缺陷的发光材料的照明系统 | |
| CN103311413A (zh) | 白色发光装置 | |
| CN102017044A (zh) | 用于发白光二极管(led)的多芯片激发系统 | |
| JP2003535477A (ja) | Ledベースの白色に発光する照明ユニット | |
| JP2007180483A (ja) | 発光装置 | |
| CN102473815A (zh) | 发光装置 | |
| TWI325441B (en) | Green phosphor of thiogallate, red phosphor of alkaline earth sulfide and white light emitting device thereof | |
| CN110305661A (zh) | 红色氮化物萤光体及其发光装置 | |
| TWI322514B (enExample) | ||
| CN100543361C (zh) | 发光装置 | |
| EP3900058B1 (en) | Cyan phosphor-converted led module | |
| US7998365B2 (en) | Thiogallate phosphor and white light emitting device employing the same | |
| KR101116855B1 (ko) | 혼합 형광체, 및 이를 활용한 고연색성 발광 패키지 | |
| CN101207168B (zh) | 白光发光装置 | |
| KR101430585B1 (ko) | Rare earth가 첨가된 oxy-fluoride계 형광체 및 상기 형광체가 적용된 백색 발광소자 | |
| TW201910485A (zh) | 螢光材料與發光裝置 | |
| KR100906923B1 (ko) | 형광체, 코팅 형광체 조성물, 형광체 제조방법 및 발광소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160715 Address after: American New York Patentee after: GE Phosphor Technology Limited Liability Company Address before: Japan Osaka Patentee before: Sharp Corporation |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20201109 Address after: Tokyo, Japan Patentee after: DENKA Co.,Ltd. Patentee after: GE PHOSPHORS TECHNOLOGY, LLC Address before: New York State, USA Patentee before: GE PHOSPHORS TECHNOLOGY, LLC |
|
| TR01 | Transfer of patent right |