CN101383272A - 等离子体反应器室中的具有晶片边缘气体注射的阴极衬套 - Google Patents
等离子体反应器室中的具有晶片边缘气体注射的阴极衬套 Download PDFInfo
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Abstract
本发明涉及用于等离子体反应器室的晶片支架,其中所述晶片支架具有与晶片边缘相邻且包围晶片边缘的晶片边缘气体注射器。
Description
相关申请的交叉引用
本申请要求Dan Katz等于2007年9月5日提交的名称为“CATHODE LINER WITH WAFER EDGE GAS INJECTION IN APLASMA REACTOR CHAMBER”的美国专利申请No.11/899,614以及Dan Katz等于2007年9月5日提交的名称为“A METHOD OFPROCESSING A WORKPIECE IN A PLASMA REACTOR WITHINDEPENDENT WAFER EDGE PROCESS GAS INJECTION”的美国专利申请No.11/899,613的优先权。
技术领域
本申请涉及一种用于处理例如半导体晶片的工件以制造集成电路的等离子体反应器室。本申请具体涉及,在这种反应器室中,在室顶以及晶片边缘处的独立的处理气体注射。
背景技术
在用于在半导体晶片上蚀刻硅或多晶硅薄膜的等离子体反应器室中,蚀刻速率需要在晶片上均匀分布。蚀刻速率在晶片上的非均匀分布表现为临界尺寸(CD)的非均匀性。临界尺寸可以是薄膜电路图案中一条普通的线的宽度。在蚀刻速率较高的晶片表面区域,CD较小;在蚀刻速率较高的区域,CD较大。
已发现,在处理气体从室顶注射的硅蚀刻室中,晶片边缘的CD与晶片表面的其它区域相比很小。这种小CD效应通常被局限在晶片表面外侧或周边(占晶片表面的1%)。此问题无法通过常规技术来解决。具体地,通过将气体分布分成在室顶的独立的内侧和外侧气体注射区,可以改善蚀刻均匀性,并且通过调节气体到内侧和外侧区的流率使均匀性最大化。然而,调节内侧和外侧气体注射区流率不能解决晶片表面外侧1%的小CD问题。具体而言,调节室顶处的内侧和外侧气体注射区流率,只能使晶片上除晶片边缘区域(宽度约为晶片直径的1%)以外的CD相当均匀。
因此,需要在不降低晶片其它区域获得的蚀刻速率分布均匀性的条件下,对晶片边缘外侧1%的CD进行独立控制。
发明内容
在等离子体反应器室中提供工件支架,用于在处理过程中支撑例如半导体晶片的工件。工件支架包括具有工件支撑表面的基座。基座周围覆盖处理环。该处理环与工件支撑表面的周围边界相邻。晶片边缘气体注射器由该处理环形成,并且具有气体注射开口,所述开口通常面向工件支撑表面上的工件位置。处理气体供给源与晶片边缘气体注射器耦合。
在一种实施方式中,晶片边缘气体注射器包括环隙式开口。在另一种实施方式中,衬套包围基座的一侧,并且具有位于处理环下方的顶表面。衬套内部的多条轴向通道穿过衬套延伸到衬套的顶表面。处理环与衬套之间限定了环形进料通道。多条轴向通道中的每一条都与环形进料通道耦合,并且晶片边缘气体注射器也与环形进料通道耦合。
在另一种实施方式中,衬套还包括底表面和底表面下方的基部,所述基部包括环形气室。所述多条轴向通道与该气室耦合。
附图说明
上文简要概括了本发明,通过参考图示于附图中的本发明的实施例,可以得到本发明的更具体的说明,从而获得并能够详细理解本发明的上述实施方式。但是注意,附图只图示了本发明的典型实施例,因此不应认为是对其范围的限定,因为本发明可以采用其他等效的实施方式。
图1示出了根据本发明一种实施方式的等离子体反应器;
图2示出了图1的反应器的阴极衬套的内部结构特征;
图3为沿图2的直线3-3的剖视图;
图4为沿图2的直线4-4的剖视图;
图5为一种实施方式的处理环和阴极衬套的部分详细图;
图6为与图5对应的侧视图;
图7示出了图1的反应器中的SiCl2径向分布图(在气体流过和不流过晶片边缘注射器缝隙的条件下);
图8示出了根据本发明的一种实施方式的方法;
图9示出了根据本发明的另一种实施方式的方法。
为了便于理解,在可能之处已经用相同的标号来标记各个图中共同的相同元件。附图中的图形都是示意性而不是按比例的。
具体实施方式
参见图1,等离子体反应器包括由柱形侧壁108、室顶110和室底115封闭的真空室100。晶片支架125在晶片处理过程中支撑半导体晶片130。晶片支架125包括阴极电极135(也用作静电卡盘(ESC)电极)。支架125包括将电极135与晶片130隔开的绝缘层137以及将电极135与下方的晶片支架125部件隔开的绝缘层139。上绝缘层137具有顶部晶片支撑表面137a。反应器还包括室顶110上方的感应耦合源功率施加器或线圈天线140。RF等离子体源功率发生器145通过RF阻抗匹配150与线圈天线140耦合。RF等离子体偏置功率发生器155通过RF阻抗匹配160与阴极电极135耦合。DC卡紧电压源161通过控制开关162与ESC电极135连接。绝缘电容器163将来自电压源161的DC电流与RF偏置功率发生器155阻隔。
通过室顶110上的气体分布注射器165将处理气体输送到室内部。注射器165由内区注射器170和外区注射器175组成。内区注射器170和外区注射器175可以以多个注射孔或缝隙形式实现。内区注射器170的定向可将处理气体导向室的中心区域。外区注射器175的定向可将处理气体导向室的周边区域。内区注射器170通过阀180与气体分布板185耦合。外区注射器通过阀190与气体分布板185耦合。不同的处理气体供给源101、102、103、104、105将不同的处理气体供给至气体分布板185。如图1中所示,在一种实施方式中,每个气体供给源可以通过独立的阀195分别与内阀和外阀180、190相连。在图1的实施方式中,气体供给源101包含氟化烃气体,例如CH2F2或CHF3,气体供给源102包含溴化氢气体,气体供给源103包含氯气,气体供给源104包含氩气,气体供给源105包含氧气。这里的气体仅为示例。可以使用任何合适的处理气体。
晶片支架125被环形阴极衬套200包围。阴极衬套200可由工艺相容材料(例如,石英)形成。处理环205覆盖阴极衬套200的顶部,并且覆盖晶片支撑表面137a的周边部分。处理环205由工艺相容材料(例如石英)形成。晶片支架125可包含与等离子体处理不相容的材料,例如金属,并且衬套200和环205将晶片支架125与等离子体隔离。处理环205的径向内侧边缘205a与晶片130的边缘相邻。在一种实施方式中,处理环可提供改善的RF电场分布。
硅或多晶硅蚀刻工艺采用例如HBr和Cl2的蚀刻气体来蚀刻硅材料,并且使用例如CH2F2或CHF3的聚合物质来改善蚀刻形态。在与蚀刻反应竞争的聚合物沉积反应中,聚合物沉积在具有大深宽比的开口的侧壁上。
图1的反应器存在对晶片边缘的临界尺寸(CD)控制较差的问题。通常,CD为电路图案中的选定线的宽度。晶片边缘的CD往往比晶片130的其它位置的CD小。小CD的问题往往发生在晶片130的边缘的环形区,该环形区的宽度(从晶片边缘向内延伸)约为晶片直径的1%(此窄区在下文中被称为晶片边缘区130a,如图5所示,将在下文中讨论)。在晶片130的其余区域,通过调节阀180和190以使流向内侧和外侧气体室顶注射器170、175的处理气体流率之比达到最优,可使上述问题最小化或避免上述问题。然而,这种优化调节不能解决晶片边缘区130a处的CD控制差的问题。晶片边缘区130a处的小CD表明蚀刻速率在晶片边缘区比其它区域高。
已发现,与晶片的其它部分上的气流速度相比,晶片边缘区130a上的气流速度极低。例如,在某些应用中,尽管晶片表面的主要部分上的气流速度为约10-20m/s,但晶片边缘区上的气流速度接近于0。如果晶片边缘区上的气流停滞,则气体在晶片边缘区上的停留时间极长,相应地导致处理气体物质高度解离。这种高度解离会增加晶片边缘区的高反应性物质的浓度。这种高反应性物质可包括自由基或中性基,它们或者(a)蚀刻极快或者(b)抑制聚合物沉积。通过上述解离生成的高反应性蚀刻物质可例如包括原子化HBr和/或原子化Cl2。结果得到更高的蚀刻速率和相应的更小的CD。
在一种实施方式中,在晶片边缘注射新的气体以解决晶片边缘处的蚀刻速率的非均匀性。这种新的气体可以是惰性气体,例如氩气。在一种实施方式中,新气体的注射增大了晶片边缘区上的气流速度,并减少了晶片边缘区上的处理气体停留时间。停留时间的减少降低了晶片边缘区上的高反应性物质(例如自由基或中性基)的浓度。在晶片边缘区注射新气体的速度或流率可以足够低,从而避免影响窄晶片边缘区以外的蚀刻速率。通常,晶片边缘区的宽度约为3mm。
在一种实施方式中,在晶片边缘注射聚合气体以解决晶片边缘处的蚀刻速率的非均匀性。聚合气体可例如是CH2F2或CHF3。聚合物质的添加增大了晶片边缘区的聚合物沉积速率,而降低了蚀刻速率。在晶片边缘区注射聚合气体的速度或流率可以足够低,从而避免影响窄晶片边缘区以外的蚀刻速率。通常,晶片边缘区的宽度约为3mm。
在一种实施方式中,处理环205分为上处理环210和下处理环212,其间形成面向晶片130边缘(几乎与其接触)的狭窄环形缝隙220。环形缝隙220与晶片边缘间隔0.6-3mm的极小距离,例如约晶片直径的1%。供给期望气体(例如惰性气体或聚合气体),以使其从环形缝隙220沿径向向内射出且直接喷射在晶片边缘。这种新气体或聚合气体可由气体分布板185供给。
在一种实施方式中,在阴极衬套200底部提供环形气室225。阴极气流控制阀227控制从气体分布板185通过管道229到达气室225的气流。气体从气室225通过阴极衬套200内部的垂直通道240导入环形缝隙220。
图2示出了阴极衬套200的示例性内部结构。图1所述的阴极衬套200由例如石英的绝缘体形成。在图2的实施方式中,阴极衬套200由金属形成,如图5所示,石英衬套126将金属阴极衬套200与晶片支架125分隔。阴极衬套200包括具有环形顶表面201a的柱形侧壁201。环状基部215支撑柱形侧壁201。肩部235从基部215沿径向向外延伸,并容纳气体供给进口230。图1所示的气室225形成在图2的阴极环状基部215内部,如图3的剖视图所示。内部通道232径向延伸通过肩部235,并且一端与气体供给进口230耦合,另一端与气室225耦合,如图4的剖视图所示。如图2所示,垂直通道240轴向延伸通过柱形侧壁201,并且在柱形侧壁201上以等方位角分布。每个垂直通道240的底端与气室225耦合,并且每个垂直通道240的顶端在柱形侧壁201的环形顶表面201a上开口。在一种实施方式中,柱形侧壁201的厚度约为0.25英寸,并且每个垂直通道240为柱形侧壁201内部沿轴向的0.05英寸的孔。
在图1的实施方式中,柱形侧壁201支撑下处理环212,上处理环210支撑在下处理环215上。
如图5所示,内部石英衬套126包围工件支架125并被阴极衬套柱形侧壁201包围。如图5所示,内部衬套126支撑下处理环212,而阴极衬套柱形侧壁201支撑上处理环210。柱形侧壁顶表面201a、上处理环210和下处理环212限定了环形气体进料室260。上处理环210与下处理环212的间隙形成环形进料通道262。上处理环210的底表面上的外侧环形凸部210a与下处理环212的顶表面上的外侧环形凹部212a相对。内侧环形凹部210b设置在上处理环210的底表面上。内侧环形凹部210b与下处理环212的凸出肩部212b相对,形成气体注射缝隙220。凸部210a、凹部212a、凹部210b和肩部212b使进料通道262具有曲折路径,如图5所示。通过图1的阀227供给的气体流至阴极或晶片支架125并进入图4所示的进口230,然后通过内部通道232流至气室225。从气室225,气体向上流过垂直通道240进入图5的进料室260,然后流过进料通道262进入注射缝隙220。
如图6的侧视图所示,注射缝隙220的端部或出口与晶片130的边缘间的距离D很小,其中D的量级为0.6-3mm。在如此小的距离下,可以将来自注射缝隙220的气流高度定域化,从而不影响3mm宽的晶片边缘区130a以外的处理。这种定域性可以通过在注射缝隙220内建立极低的气体流率来实现。例如,通过阀227(到晶片边缘注射缝隙220)的气体流率可为通过阀180和190的气体流率的1-10%。以此方式,流出注射缝隙220的气体只影响窄晶片边缘区130a中的处理(例如,蚀刻速率),而不影响晶片130的其余部分的处理。
图7示出了一种工艺中的晶片表面上的SiCl2密度与径向位置的关系,在该工艺中,通过图1-6的晶片边缘注射缝隙220引入例如CH2F2或CHF3的聚合气体,而通过室顶注射器170、175引入例如HBr和Cl2的蚀刻处理气体。SiCl2的密度指示了这种工艺中的聚合度。图7表明,当不存在任何来自注射缝隙220的气流时,晶片边缘处的聚合相对得到抑制(曲线A)。随着通过注射缝隙220供给聚合气体,晶片边缘处的聚合度显著增大(曲线B)。通过晶片边缘注射缝隙220的聚合气流被限定为低流率。这种对注射缝隙流率的限定使聚合度的增大局限于晶片直径外侧1%(晶片边缘区)。在一个实施例中,通过室顶注射器喷嘴170、175的蚀刻处理气体流率约为150sccm,而通过晶片边缘注射器缝隙的聚合气体流率约为5sccm。
图8示出了操作图1-6的等离子体反应器以增大晶片边缘区的CD的示例性方法。通过内区室顶注射器170以第一气体流率(图8的方框400),并通过外区室顶注射器175以第二气体流率(图8的方框405),注射例如HBr和Cl2的硅蚀刻剂气体。通过内区和外区室顶注射器170、175的气流足以在整个晶片表面上获得期望的平均蚀刻速率。独立地调节通过内、外区室顶注射器170、175的气体流率,由此调节除晶片表面周边1%以外的蚀刻速率分布,直到蚀刻速率分布均匀性最优化(图8的方框410)。这通常导致晶片边缘区或晶片表面外侧1%中的蚀刻速率过高(或CD过低)。通过以下方法来调低晶片边缘区的蚀刻速率(或调高CD):专门减少气体在晶片边缘区上的停留时间,从而减少晶片边缘区上的解离。在一种实施方式中,减少气体在晶片边缘区上的停留时间如下实现:将合适的气体(例如惰性气体或氧气)流过晶片边缘注射缝隙220,以促进晶片边缘上的气体流动(图8的方框415)。限定通过晶片边缘注射器缝隙的气体流率为小流率,可使气流的增大或气体停留时间的减少局限于晶片边缘区。选择这种小流率,以获得最均匀的CD分布,所述流率可能受选择的处理气体物质影响,并可例如为1-20sccm。
图9示出了操作图1-6的等离子体反应器以增大晶片边缘区的CD的另一种示例性方法。通过内区室顶注射器170以第一气体流率(图9的方框420),并通过外区室顶注射器175以第二气体流率(图9的方框425),注射例如HBr和Cl2的硅蚀刻剂气体。通过内区和外区室顶注射器170、175的气流足以在整个晶片表面上获得期望的平均蚀刻速率。独立地调节通过内、外区室顶注射器170、175的气体流率,由此调节除晶片表面周边1%以外的蚀刻速率分布,直到蚀刻速率分布均匀性最优化(图9的方框430)。这通常导致晶片边缘区或晶片表面外侧1%中的蚀刻速率过高(或CD过低)。通过以下方法来调低晶片边缘区的蚀刻速率(或调高CD):专门提高晶片边缘区上的聚合,从而减少晶片边缘区上的蚀刻速率。在一种实施方式中,提高晶片边缘区上的聚合如下实现:将聚合气体(例如CH2F2或CHF3)流过晶片边缘注射缝隙220(图9的方框435)。聚合物沉积速率得到提高,而这增大了CD。限定通过晶片边缘注射器缝隙的气体流率为小流率,可使CD的增大局限于晶片边缘区。选择这种小流率,以获得最均匀的CD分布,所述流率可能受选择的处理气体物质影响,并可例如为1-20sccm
在图8或图9的任一种方法中,调节通过室顶注射器170和175的气体流率,和/或调节通过晶片边缘缝隙220的气体流率,可以实现进一步优化。例如,可以减少通过室顶注射器170、175的蚀刻剂气流,同时增加通过晶片边缘缝隙220的惰性或聚合气流,从而进一步增大晶片边缘区的CD。然而,通过晶片边缘缝隙的流率可以足够低,以使效果局限于晶片边缘区。但是,通过室顶注射器170、175的蚀刻剂气体流率可以根据需要降低(例如,减至0)。相反地,为了减小晶片边缘区的CD,在减少通过晶片边缘缝隙220的惰性或聚合气流的同时,可以增大通过室顶注射器170、175的蚀刻剂气流。
尽管本发明的上述实施方式通过连续缝隙注射器来将选定气体注射到晶片边缘,但晶片边缘的注射器也可以具有其它形式,例如围绕晶片边缘的多个气体注射孔的阵列或序列。
尽管上文针对的是本发明的具体实施例,但是在不脱离本发明的基本范围的情况下可以想到其更多实施例,本发明的范围由权利要求来限定。
Claims (15)
1.一种用于处理工件的等离子体反应器,包括:
室壳体,包括侧壁和室顶;
所述室中的工件支架,具有面向所述室顶的工件支撑表面;
包围所述工件支架的阴极衬套,具有顶表面和基部,并具有多条从所述基部延伸到所述顶表面的内部气流通道;
位于所述基部的气体供给室,与每条所述内部气流通道耦合;
覆盖在所述阴极衬套的所述顶表面上的处理环,具有与所述晶片支撑表面的周围边缘相邻的内侧边缘;
所述处理环中的气体注射器,具有通过所述内侧边缘并面向所述工件支撑表面的气体注射路径,所述气体注射器与所述多条气流通道耦合;和
与所述气体供给室耦合的气体供给系统。
2.如权利要求1的反应器,其中通过所述内侧边缘的所述气体注射路径包括面向所述工件支撑表面的连续缝隙开口。
3.如权利要求1的反应器,其中通过所述内侧边缘的所述气体注射路径包括多个气体注射孔。
4.如权利要求1的反应器,其中所述气体注射器包括在所述处理环中的间隙,所述间隙将所述处理环分为上处理环和下处理环。
5.如权利要求4的反应器,还包括由所述处理环和所述阴极衬套限定的内部进料通道,所述多条内部气流通道在所述顶表面与所述进料通道耦合,所述进料通道与所述处理环中的所述间隙耦合。
6.如权利要求1的反应器,其中所述内侧边缘与所述工件支撑表面的周边以小于所述工件支撑表面的直径的约1%的距离间隔。
7.如权利要求1的反应器,还包括在所述室顶的与所述气体供给系统耦合的处理气体分布器,所述处理气体分布器包括内侧和外侧气体注射区及其各自独立的分别通向内侧和外侧气体注射区的气流通道。
8.如权利要求7的反应器,其中到(a)所述处理环中的所述气体注射器、(b)所述气体分布器的所述内侧气体注射区和(c)所述气体分布器的所述外侧气体注射区的气体流率可被独立地控制。
9.如权利要求8的反应器,其中所述气体供给系统包括与所述气体分布器耦合的第一处理气体的源和与所述处理环中的所述气体注射器耦合的第二处理气体的源。
10.如权利要求1的反应器,所述晶片支架为具有对称轴的柱形,并且所述衬套包括与所述晶片支架共轴的柱形侧壁,并且其中所述气体注射器包括环形缝隙。
11.如权利要求10的反应器,其中所述晶片支撑表面具有与被支撑在所述晶片支撑表面上的晶片的周围边缘相对应的周围边缘,所述环状缝隙与所述周围边缘以小于所述工件支撑表面的直径的约1%的距离间隔。
12.一种在等离子体反应器中处理工件的方法,包括:
将所述工件放置在等离子体反应器室中的工件支架上;
通过与所述工件相邻并包围所述工件的周围边缘的工件支架处理气体注射器引入第一处理气体;
将等离子体RF源功率耦合到等离子体反应器中,以在所述等离子体反应器室中产生等离子体;
通过位于工件支架上方的室顶位置的室顶处理气体分布器引入第二处理气体;和
独立于通过所述室顶处理气体分布器的气体流率来控制通过所述工件支架处理气体注射器的气体流率。
13.如权利要求12的方法,其中所述室顶处理气体分布器包括外侧气体分布器和内侧处理气体分布器,所述方法还包括:
调节通过所述内侧和外侧处理气体分布器的气体流率,以优化所述工件的主要部分上的工艺均匀性;和
调节通过所述工件支架处理气体注射器的处理气体流率,以优化所述工件的边缘区的处理。
14.如权利要求12的方法,其中通过工件支架处理气体注射器引入第一处理气体的步骤包括:
通过在所述工件支架的一部分的内部的气流通道供给所述第一处理气体;和
通过包围所述工件的处理环传导得自所述气流通道的处理气体。
15.如权利要求13的方法,还包括通过所述工件支架气体注射器来限定气体流率,以使第一处理气体的作用局限于所述工件的所述边缘区。
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US10304664B2 (en) | 2014-09-30 | 2019-05-28 | Semes Co., Ltd. | Systems and methods of treating a substrate |
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Also Published As
Publication number | Publication date |
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US20090057269A1 (en) | 2009-03-05 |
US7879250B2 (en) | 2011-02-01 |
CN101383272B (zh) | 2012-02-01 |
US20110068082A1 (en) | 2011-03-24 |
US8383002B2 (en) | 2013-02-26 |
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