CN101286417B - 固体电解电容器及其制造方法 - Google Patents
固体电解电容器及其制造方法 Download PDFInfo
- Publication number
- CN101286417B CN101286417B CN200810125898XA CN200810125898A CN101286417B CN 101286417 B CN101286417 B CN 101286417B CN 200810125898X A CN200810125898X A CN 200810125898XA CN 200810125898 A CN200810125898 A CN 200810125898A CN 101286417 B CN101286417 B CN 101286417B
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- CN
- China
- Prior art keywords
- anode
- plating
- solid electrolytic
- capacitor
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims abstract description 245
- 239000007787 solid Substances 0.000 title claims abstract description 107
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 238000007747 plating Methods 0.000 claims abstract description 92
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims description 90
- 230000015572 biosynthetic process Effects 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000007784 solid electrolyte Substances 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002322 conducting polymer Substances 0.000 claims description 3
- 239000010407 anodic oxide Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 7
- 230000014509 gene expression Effects 0.000 description 45
- 238000000034 method Methods 0.000 description 34
- 239000011230 binding agent Substances 0.000 description 18
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007059927 | 2007-03-09 | ||
| JP2007-059927 | 2007-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101286417A CN101286417A (zh) | 2008-10-15 |
| CN101286417B true CN101286417B (zh) | 2011-02-02 |
Family
ID=39981821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810125898XA Active CN101286417B (zh) | 2007-03-09 | 2008-03-07 | 固体电解电容器及其制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7835138B2 (enExample) |
| JP (1) | JP5152946B2 (enExample) |
| CN (1) | CN101286417B (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5009183B2 (ja) * | 2008-02-04 | 2012-08-22 | Necトーキン株式会社 | 固体電解コンデンサ |
| US8169774B2 (en) * | 2008-09-30 | 2012-05-01 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor and a method for manufacturing same |
| JP2010089540A (ja) | 2008-10-03 | 2010-04-22 | Honda Motor Co Ltd | 電動パワーステアリング装置 |
| JP5201684B2 (ja) * | 2009-03-19 | 2013-06-05 | Necトーキン株式会社 | チップ型固体電解コンデンサ |
| JP5289123B2 (ja) * | 2009-03-23 | 2013-09-11 | 三洋電機株式会社 | 固体電解コンデンサ及びその製造方法 |
| JP5349112B2 (ja) * | 2009-03-30 | 2013-11-20 | 三洋電機株式会社 | 固体電解コンデンサ |
| JP2010278032A (ja) * | 2009-05-26 | 2010-12-09 | Nec Tokin Corp | 表面実装型コンデンサ |
| JP2011049225A (ja) * | 2009-08-25 | 2011-03-10 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
| JP2015201668A (ja) * | 2010-04-22 | 2015-11-12 | ローム株式会社 | 固体電解コンデンサおよび固体電解コンデンサの製造方法 |
| JP5778450B2 (ja) | 2010-04-22 | 2015-09-16 | ローム株式会社 | 固体電解コンデンサおよび固体電解コンデンサの製造方法 |
| JP5453174B2 (ja) * | 2010-06-01 | 2014-03-26 | Necトーキン株式会社 | 下面電極型の固体電解積層コンデンサおよびその実装体 |
| WO2012040292A2 (en) * | 2010-09-21 | 2012-03-29 | Jeffrey Poltorak | Solid electrolytic capacitor and method of manufacturing a solid electrolytic capacitor |
| JP5466722B2 (ja) * | 2011-04-15 | 2014-04-09 | Necトーキン株式会社 | 固体電解コンデンサ |
| JP5258071B2 (ja) * | 2011-10-12 | 2013-08-07 | Necトーキン株式会社 | 固体電解コンデンサ |
| JP5850696B2 (ja) * | 2011-10-17 | 2016-02-03 | Necトーキン株式会社 | 固体電解コンデンサ |
| CN104685589B (zh) * | 2012-09-28 | 2018-05-29 | 松下知识产权经营株式会社 | 固体电解电容器 |
| WO2014050112A1 (ja) * | 2012-09-28 | 2014-04-03 | 三洋電機株式会社 | 固体電解コンデンサ及びその製造方法 |
| JP6647124B2 (ja) * | 2016-04-14 | 2020-02-14 | 株式会社トーキン | 固体電解コンデンサ、および固体電解コンデンサの製造方法 |
| JP6293318B1 (ja) * | 2017-01-20 | 2018-03-14 | 株式会社トーキン | 固体電解コンデンサ |
| WO2018143354A1 (ja) * | 2017-02-03 | 2018-08-09 | 株式会社村田製作所 | 固体電解コンデンサ及びその製造方法 |
| WO2020111278A1 (ja) | 2018-11-30 | 2020-06-04 | パナソニックIpマネジメント株式会社 | 電解コンデンサおよびその製造方法 |
| CN114267541B (zh) * | 2021-12-21 | 2022-09-30 | 西安交通大学 | 一种固态钽电解电容器及其ald制备方法 |
| JPWO2024043279A1 (enExample) * | 2022-08-24 | 2024-02-29 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6882519B2 (en) * | 2003-03-31 | 2005-04-19 | Rubycon Corporation | Flat aluminum electrolytic capacitor and method of manufacturing the same |
| US6912117B2 (en) * | 2003-02-20 | 2005-06-28 | Nec Tokin Corporation | Solid electrolytic capacitor and method of manufacturing the same |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0372519B1 (en) * | 1988-12-07 | 1994-04-27 | Matsushita Electric Industrial Co., Ltd. | A solid electrolytic capacitor |
| MXPA00001238A (es) * | 1998-06-11 | 2005-07-13 | Showa Denko Kk | Elemento capacitor de una sola capa y capacitor electrolitico solido de capas multiples. |
| JP3536722B2 (ja) * | 1998-06-18 | 2004-06-14 | 松下電器産業株式会社 | チップ形固体電解コンデンサおよびその製造方法 |
| JP3942000B2 (ja) | 1999-06-01 | 2007-07-11 | ローム株式会社 | パッケージ型固体電解コンデンサの構造及びその製造方法 |
| JP3349133B2 (ja) * | 2000-04-07 | 2002-11-20 | エヌイーシートーキン株式会社 | チップ型コンデンサ及びその製造方法並びにモールド金型 |
| TW516054B (en) * | 2000-05-26 | 2003-01-01 | Matsushita Electric Industrial Co Ltd | Solid electrolytic capacitor |
| JP2002170742A (ja) * | 2000-09-22 | 2002-06-14 | Nippon Chemicon Corp | チップ型固体電解コンデンサ |
| US6625009B2 (en) * | 2001-04-05 | 2003-09-23 | Rohm Co., Ltd. | Solid electrolytic capacitor and method of making the same |
| JP4454916B2 (ja) * | 2002-07-22 | 2010-04-21 | Necトーキン株式会社 | 固体電解コンデンサ |
| JP2004104048A (ja) * | 2002-09-13 | 2004-04-02 | Nec Tokin Corp | チップ型固体電解コンデンサ |
| JP2004228424A (ja) | 2003-01-24 | 2004-08-12 | Nec Tokin Corp | チップ電解コンデンサおよびその製造方法 |
| JP3806818B2 (ja) | 2003-09-26 | 2006-08-09 | Necトーキン株式会社 | チップ型個体電解コンデンサ |
| JP4878103B2 (ja) | 2004-01-07 | 2012-02-15 | Necトーキン株式会社 | チップ型固体電解コンデンサの製造方法 |
| JP4492265B2 (ja) * | 2004-09-13 | 2010-06-30 | パナソニック株式会社 | チップ形固体電解コンデンサ |
| JP4659448B2 (ja) * | 2004-12-21 | 2011-03-30 | Tdk株式会社 | 固体電解コンデンサの製造方法 |
| JP2008117793A (ja) * | 2005-01-21 | 2008-05-22 | Rohm Co Ltd | パッケージ型電子部品におけるリード端子の切断方法 |
| JP2006278876A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
| JP4872365B2 (ja) * | 2005-05-23 | 2012-02-08 | パナソニック株式会社 | チップ形固体電解コンデンサ |
-
2008
- 2008-03-07 US US12/044,337 patent/US7835138B2/en active Active
- 2008-03-07 CN CN200810125898XA patent/CN101286417B/zh active Active
- 2008-03-10 JP JP2008060347A patent/JP5152946B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6912117B2 (en) * | 2003-02-20 | 2005-06-28 | Nec Tokin Corporation | Solid electrolytic capacitor and method of manufacturing the same |
| US6882519B2 (en) * | 2003-03-31 | 2005-04-19 | Rubycon Corporation | Flat aluminum electrolytic capacitor and method of manufacturing the same |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2004-228424A 2004.08.12 |
| JP特开2005-101418A 2005.04.14 |
| JP特开2005-197457A 2005.07.21 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090059479A1 (en) | 2009-03-05 |
| CN101286417A (zh) | 2008-10-15 |
| JP2008258602A (ja) | 2008-10-23 |
| JP5152946B2 (ja) | 2013-02-27 |
| US7835138B2 (en) | 2010-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Miyagi Prefecture in Japan Patentee after: Tokin Corporation Address before: Miyagi Prefecture in Japan Patentee before: NEC Tokin Corp. |
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| CP01 | Change in the name or title of a patent holder |