CN101276765B - 喷墨印刷引线键合,密封剂和屏蔽 - Google Patents

喷墨印刷引线键合,密封剂和屏蔽 Download PDF

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CN101276765B
CN101276765B CN2008100874791A CN200810087479A CN101276765B CN 101276765 B CN101276765 B CN 101276765B CN 2008100874791 A CN2008100874791 A CN 2008100874791A CN 200810087479 A CN200810087479 A CN 200810087479A CN 101276765 B CN101276765 B CN 101276765B
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P·M·古尔文
P·J·尼斯特伦
J·P·迈尔斯
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Abstract

本发明涉及喷墨印刷引线键合，密封剂和屏蔽。一种在半导体器件中将芯片连接到封装的方法，包括在芯片和封装的至少一部分上印刷预定厚度的密封剂和在芯片和封装之间以预定的图案在密封剂上印刷一层导电材料。该印刷的导电材料与密封剂的上表面共形，以使得密封剂定义才印刷的导电材料到芯片和封装的距离。该方法进一步包括在印刷的导电线材料上印刷第二层密封剂和至少固化该第二层密封剂。

Description

喷墨印刷引线键合,密封剂和屏蔽
技术领域
本发明通常涉及引线键合技术，更具体地涉及利用原料印刷机选择性印刷引线键合和间隔物。
背景技术
迄今，在半导体器件制造中，使用引线键合将芯片上的接合焊垫连接到封装上的接合焊垫。更具体地，在工艺中提供一定长度布线的同时，引线键合工具接触芯片上的焊垫，将布线焊接到该焊垫，然后移动到封装上的焊垫。然后将该布线的另一端焊接到封装上的焊垫。工具在多个焊垫之间移动的路径决定了布线的形状和回线高度，这在许多应用中是重要的。例如，当使用多行焊垫增加连接密度时，回线高度必须被控制得足够好，以避免多个布线之间的短路。这在例如喷墨印刷头的应用中尤其重要，在那种情况下如果回线太高，布线就会被用于保持喷嘴板正面的刮片损坏。
在图1A至1C中示出了引线键合技术的实例。具体地，图1A是球焊引线键合的实例，图1B是楔焊的实例，图1C示出了球焊布线阵列。虽然大部分引线键合技术可以应用密封剂来保护引线键合，但是为了清楚地示出引线键合，将从图中省略了密封。密封剂可以用于保护引线键合不受环境和本领域中熟知的自然因素的破坏。
在熟知的上述类型的半导体器件的制造中，密封剂被分配到引线键合上，以防止短路、机械损害、例如腐蚀的环境损害以及介质击穿。通过流入该区域分配密封剂会存在妨碍器件工作的问题。为了避免这种问题，典型的方案是移动接合焊垫进一步远离该器件，由此增加了管芯尺寸和成本。
本领域熟知的另一个问题是布线可用作天线，与来自其它器件或周围环境的不希望的能量耦合。当布线用作天线时，在电路中就会产生噪声，这会影响器件的正常工作。
由此，需要提供用于半导体器件中的喷墨印刷布线和密封剂的方法和设备，来克服现有技术的这些和其它问题。
发明内容
根据本教导，提供了一种在半导体器件中将衬底电连接至封装的方法。
该示范性的方法可以包括以预定的图案将密封剂以预定的厚度印刷在衬底和封装上，在衬底和封装之间以预定的图案在密封剂上印刷一层导电线，并在印刷的导电线图案上印刷第二层密封剂。该印刷的导电线与密封剂的上表面共形，并由此通过一厚度的密封剂与该衬底分隔开。可以固化至少第二层密封剂。
根据本教导，提供了一种形成引线键合的方法。
该示范性方法可包括以选择性的图案在半导体器件上印刷导电金属材料层、和用印刷的密封剂材料将印刷的金属材料层同半导体器件的表面分隔开。
根据本教导，提供了一种引线键合的半导体器件。
该示范性的器件可以包括封装和固定在该封装上的芯片。芯片和封装每个都包括形成在其上的接合焊垫。在芯片和封装的上表面上印刷绝缘层，例如介质层或密封层。将金属布线图案印刷在绝缘层的上表面上，并且与绝缘层的表面共形，印刷的金属布线图案与芯片接合焊垫和封装接合焊垫接触，金属布线图案通过一定厚度的第一绝缘层与芯片隔开。可以在金属布线图案的上表面上印刷第二密封剂层。
附图说明
图1A、1B和1C描述了已知的引线键合的透视图；
图2示出了根据本教导的实施例的部分半导体器件；
图3A至3D是描述利用根据本教导的实施例的原料印刷头制造半导体器件的几个阶段的侧视图；和
图4示出了根据本教导的实施例的操作部件的互连。
具体实施方式
实施例通常关于用原料印刷机印刷半导体部件。印刷有机电子设备是熟知的，其中从喷墨印刷机以一滴一滴的图案选择性地沉积材料。对于这种器件的应用典型地用于大的、相对便宜的电子设备，例如平板显示器(LCD滤色器和埋色间隔器(inter-color spacer)、OLED显示器)、RFID标签、普遍存在的标志、智能纸、大的光生伏打电池、卷曲显示器、印刷电路板蚀刻和焊接掩模和生物化学传感器。
然而，在这里的示范性实施例中，密封剂材料和导电金属材料可以在任何期望的表面上从具有压电印刷头的原料印刷机以精确和可控的方式被分配以印刷接合焊垫、迹线、布线和密封剂。
在编程计算机的指示下，可以指示这里使用的压电印刷头来印刷各种材料，例如金属和绝缘体。因为印刷材料最初是由计算机管理的，所以可以印刷许多图案，甚至与材料无关，由此能够实现现有技术没有实现的分层半导体器件。
图2示出了用将在这里描述的原料型印刷头通过印刷一定的部件而装配的半导体器件200。应该认识到，半导体器件200代表一般的示意性说明，并且可加入其它部件，或者可以移除或修改现有的部件。该装配的半导体器件200可包括封装210、形成在封装210上的衬底220、分别用于衬底220和封装210的每一个的接合焊垫230、240、第一印刷层的密封剂250、第一印刷层的布线260和第二层的印刷密封剂270。虽然没有示出，但是在该器件中也可以包括迹线。
为了描述这里的示范性实施例，术语“衬底”可以指的是本领域熟知的管芯芯片等。另外，这里使用的术语“布线”指的是由印刷头印刷的导电金属，并且本质上不是指将金属的形状限制为布线的形状。根据预定的设计参数，可以提供多层印刷密封剂和印刷布线。虽然没有详细描述，但是本领域的技术人员将认识到基于这里给出的描述该装置可包括多个另外的层。另外，由下面的阅读将认识到，交错的密封剂能够实现在现有技术中先前没有实现的布线图案。
此外，结合示范性实施例，在确定的上下文中，可以用绝缘或介质层代替使用密封剂。如这里使用的密封剂，成分可以变化，但是典型为高纯度。换句话说，为了减少腐蚀，密封剂可以包含很少的离子性污染物。仅举例来说，密封剂可以是环氧树脂、凝胶、例如硅酮的合成橡胶和其它相关材料。密封剂典型地可以通过从大约60℃加热到大约200℃而固化。密封剂也可以通过从大约125℃加热到大约150℃而固化。另外，密封剂的固化可以不用加热来实现，例如，利用两部分混合固化或例如紫外线的其它射线。
现在转到图3A至3D，将描述用于装配半导体器件300的工艺。应该认识到，图3A至3D是为了说明简化的，并且可加入其它步骤，或移除或修改现有的部件。
首先参考图3A，装配的最初阶段可以包括提供固定到封装310上的衬底320，并且具有所示的分别预先固定到衬底320和封装310的每一个上的接合焊垫330、340。如所示出的，可以预先存在迹线(未示出)，或者用原料印刷机的印刷头390将迹线印刷在器件上。
在制造位置应用接合焊垫和迹线的情况下，该应用可以利用原料印刷头390来进行，类似于密封剂和布线。例如，原料印刷头390可以将悬浮在易挥发溶剂中的胶质导体的滴印刷到衬底320和封装310上。衬底320和/或封装310可以预先加热，使溶剂在与其接触时快速蒸发。预加热衬底320和封装310可以具有更快速地干燥印刷材料的优点，同时最小化材料在其上的扩展。典型地，将衬底和封装预加热到大约100℃和大约300℃之间的温度，这将使表面温度能够快速地蒸发所使用的易挥发溶剂。通过预加热，期望材料的印刷滴能够形成为在室温的表面上材料的类似印刷滴尺寸的大约一半尺寸。
用于胶质导体的材料的实例可以包括胶质银、胶质金或其它类似已知的导体。
限定接合焊垫334、340和迹线的印刷材料的厚度可以通过印刷头390完全控制。换句话说，如果厚层材料是期望的，则将额外的液滴喷射到衬底上相同的位置处。在每个印刷层之后或在相同的位置施加了许多材料滴之后，可以进行材料的烧结。如果将衬底加热到足够高的温度，则可以不需要单独的印刷材料的烧结步骤。在使用烧结的情况下，期望在大约200℃到大约300℃进行10分钟的时间周期，将呈现印刷材料的峰值导电性。另外，期望对银大约200℃的温度和对金大约300℃的温度，可以提供所述的峰值导电性。
如图3B所示，该器件还可以包括用原料印刷头390印刷到至少衬底320和封装310上的密封剂350。虽然该密封剂描述为印刷到衬底320和封装310上，但是应该认识到，如果该表面是绝缘的或电介质的，则通过印刷沉积的第一层可以是定义第一层布线360的金属，如下进一步描述的那样。由此，“第一层密封剂”不必是印刷到衬底和封装上的第一层。
在密封剂印刷在衬底和封装上的情况下，第一层密封剂350可以印刷到对应衬底320和第一布线层360之间的期望距离的厚度。密封剂350可以重叠衬底接合焊垫330的一部分上，并且横过衬底320和封装310之间的阶梯结构，以邻近于封装接合焊垫340终止。应该意识到，如果非接合焊垫区中的衬底或结构是导电的，则可以仅提供重叠。如果衬底和封装表面是介电的、绝缘的，或提供有绝缘表面或层，那么就可以省略第一层密封剂。如果使用的话，印刷的密封剂在衬底320和将上覆盖布线360之间用作绝缘间隔物，如在这里进一步描述的，并且可以根据设计参数印刷期望的厚度。
典型地，印刷的密封剂层350可以是从大约1到大约5微米厚。在印刷期间，印刷头390可以离衬底320大约1mm；然而，可以根据印刷需要调节该距离，例如，当在封装310上面印刷时。
一旦印刷了，可以利用烘焙完全固化密封剂。烘焙的温度和持续时间可以根据用于密封剂的材料而不同；然而，在大约100℃到大约150℃的温度持续大约30分钟可以用作为基础。对于薄密封剂层，可以使用较短的烘焙时间和/或较低的温度，并且对于厚密封剂层，可以使用更长的烘焙时间和/或更高的温度。另外，可以使印刷头390适应大约600微米的衬底320和封装310之间的台阶高度。
作为选择，当多层密封剂和金属印刷在器件上时，在完成了印刷各种层之后，可以进行单次烘焙。
如图3C所示，定义第一层布线360的金属印刷在第一层密封剂350上方。为了完成导电路径，印刷第一布线层360，以连接衬底接合焊垫330和封装接合焊垫340。在由示范性实施例确定的优点中，接合焊垫330、340之间的印刷线360的路径可以根据实际任何设计参数而不同。一旦印刷了印刷布线360，其要和密封剂的上表面共形。另外，该金属“布线”360可以具有由许多重叠的印刷滴剂定义的厚度，和具有由许多相邻的印刷金属材料的滴剂定义的宽度。
因此，最后得到的印刷布线360本质上不需要环行，而是可以印刷成适合于特定器件的任何形状和尺寸。例如，通过约束印刷布线360的垂直尺度，可以形成微带型的线。更进一步，如果印刷布线360意图承载大电流，则该布线可以印刷成适合该电流的尺寸。还可以改变该形状，以改变布线的阻抗，在该布线用作传输线的情况下，这对于降低反射是重要的。再进一步，阵列内多个布线的每一个可以不同地印刷。同样，当该布线360承载大量电流时，例如公共接地连接，其可以印刷成具有大的横截面。
由此，应该认识到，印刷布线360可以达到距离衬底320预定的距离，直接走到外侧，达到边缘，并下降将接合焊垫贴附到封装。因为密封剂350是在印刷顶布线之前印刷的，所以，例如，在现有布线之上的5μm，可以通过另外的布线，而没有任何短路的危险。具体地通过在离衬底320不同的高度印刷多个横向行进的行，可以在比先前能够达到的密度更高的密度使用布线。布线可以具有“U”型弯曲，以消除应力或平衡阵列中器件之间的阻抗。此外，由于密封剂仅印刷在需要它的地方，所以需要非常小的管芯空间使密封剂不靠近器件。提供这些实例，以说明通过在示范性实施例中印刷布线而发现的灵活性，而并不是用于限制。
一旦印刷了布线360，在连接接合焊垫和迹线时可以对其进行如上所述的烧结。例如，可以在大约200℃到大约300℃的温度下持续大约10分钟来烧结印刷布线360。
在印刷和烧结了印刷布线360之后，在印刷的布线360上印刷第二层密封剂370。接下来，可以用与结合第一层密封剂350描述的相同的方式固化密封剂370。如果没有另外层的布线360要被印刷，那么第二层印刷的密封剂370的功能可以是：盖帽印刷布线360，以保护它们不受彼此和环境的影响。在将应用另外层印刷布线的情况下，第二层密封剂370可以是密封剂的中间层，用来定义相邻印刷布线层360之间的厚度。应该认识到，根据具体器件需要的布线层的数目，可以重复印刷密封剂和布线层。
虽然没有具体说明，但还应认识到，金属层可以印刷为电磁干扰(EMI)屏蔽，以隔离布线。这可以具体应用在高频操作，或者用于电噪声区域。如果期望防止器件之间的电串扰，则可以围绕各个布线进行金属屏蔽。更进一步，可以单独密封每个布线。
提供图4用来说明根据本教导实施例的操作部件的互连。更具体地，编程具有可编程中央处理单元的计算机来指示从原料印刷头490喷射到器件400上的印刷材料的类型和位置。根据计算机的输入和生成的应用程序来控制变化印刷位置、数量和图案。虽然概括性的描述了部件之间的关系，但是本领域的技术人员应该认识到，在没有偏离示范性实施例的前提下，可以增加、移除或修改某些部件。
本领域的技术人员应认识到，通过这里描述的示范性实施例能够获得几个好处，并且包括多种应用、形状控制、高布线密度、控制布线形状和直径、布线的选定路线容易和全过程简化。例如，这里描述的布线可以印刷到几乎任何类型的通常使用标准引线键合的器件上，不管该器件自身是否是利用原料印刷机创造的。形状控制特征几乎允许完成三维控制布线形状，由此能够实现线交叉、防止短路和保持低回路高度。低回路高度在约束垂直尺度的应用中尤其是有利的，例如在避免喷墨头的刮片或高密度互连的应用中。
此外，原料印刷机可以印刷25μm间隔的25μm细的布线，允许单排50μm的布线间距。增加额外的接合焊垫行和布线行，可以允许有效间距更小，对于四行大约是12.5μm。距器件边沿的每行可以以比先前的布线更高的高度(利用印刷的密封剂)形成，以便其不与其它行干扰。
此外，由于相应需要大量的连接，所以存在当前不能使用大量布线的情况。通过利用具有大量喷头的原料印刷机，可以同时印刷许多布线，没有任何时间约束。而且，由于失效的风险，非常大数量的标准引线键合是不切实际的，而印刷布线能够避免这个问题，并且能提供比标准引线键合技术更高的精度。
另外，不同的布线长度具有不同的阻抗，这对于要求所有器件同样进行的一些应用会导致问题。对于传统的引线键合，通过改变回路高度能够达到目的，但是这会很难确定理想的回路高度、产生回路高度的接合器的理想路径，和确保接合器始终如一的重复该过程。因此应认识到，这里示范性实施例的印刷布线能够很容易加长或缩短线路，或者能够具有包括增加布线阻抗的额外的回路。为了使阻抗相等，还可以改变布线的截面，截面面积越大则给出的阻抗就越小。
尽管阐明本发明的广阔范围的数值域和参数是近似的，但是在具体实例中列出的数值是尽可能精确呈现的。然而，任何数值都固有地包含由在其各个实验测量中发现的标准差所导致的一定误差。而且，这里公开的所有范围要理解为包括这里包含的任何和所有子范围。例如，“小于10”的范围可包括在最小值0和最大值10之间(且包括)的任何所有的子范围，也就是说，任何和全部具有等于或大于0的最小值和等于或小于10的最大值的子范围，例如，1到5。

Claims (1)

1.一种在半导体器件中将芯片连接到封装的方法，包括：
在芯片和封装上印刷接合焊垫；
在芯片和封装的至少一部分上印刷预定厚度的第一层密封剂，所印刷的第一层密封剂还与芯片接合焊垫的一部分重叠；
使用包括压电印刷头的原料印刷机在芯片和封装之间以预定的图案在所述第一层密封剂上印刷一层导电材料，其中印刷的导电材料与第一层密封剂的上表面共形，以使得第一层密封剂定义从印刷的导电材料到芯片和封装的距离；
在印刷的导电线材料上印刷第二层密封剂；和
至少固化第二层密封剂，
其中使用包括压电印刷头的原料印刷机至少印刷所述第一层密封剂和所述第二层密封剂其中之一。
2．根据权利要求1的方法，进一步包括绝缘芯片和封装表面，并在印刷密封剂之前在绝缘的芯片和封装上印刷一层导电材料，其中第一印刷的导电材料层具有与随后印刷的导电材料层不同的图案。
3．根据权利要求1的方法，其中在芯片和封装的至少一部分上印刷密封剂。
4．根据权利要求1的方法，其中印刷接合焊垫包括：
预加热器件到100℃和300℃之间的温度；
向该预加热后的器件印刷悬浮在易挥发溶剂中的导电滴剂；并且
在易挥发溶剂与预加热的器件上接触时蒸发该易挥发溶剂。
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KR20080089215A (ko) 2008-10-06
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TW200903572A (en) 2009-01-16
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CN101276765A (zh) 2008-10-01
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US8097497B2 (en) 2012-01-17
EP1976008A2 (en) 2008-10-01

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