CN101258415B - 电子部件试验装置 - Google Patents
电子部件试验装置 Download PDFInfo
- Publication number
- CN101258415B CN101258415B CN2006800139501A CN200680013950A CN101258415B CN 101258415 B CN101258415 B CN 101258415B CN 2006800139501 A CN2006800139501 A CN 2006800139501A CN 200680013950 A CN200680013950 A CN 200680013950A CN 101258415 B CN101258415 B CN 101258415B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- electrical verification
- tested electrical
- test
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319870 WO2008041334A1 (fr) | 2006-10-04 | 2006-10-04 | Appareil de test de composant électronique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101258415A CN101258415A (zh) | 2008-09-03 |
| CN101258415B true CN101258415B (zh) | 2011-01-19 |
Family
ID=39268202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800139501A Active CN101258415B (zh) | 2006-10-04 | 2006-10-04 | 电子部件试验装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2008041334A1 (enExample) |
| KR (2) | KR100942527B1 (enExample) |
| CN (1) | CN101258415B (enExample) |
| TW (1) | TW200821599A (enExample) |
| WO (1) | WO2008041334A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617820B (zh) * | 2015-12-29 | 2018-03-11 | 泰克元股份有限公司 | 用於測試半導體元件的分選機 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
| JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
| JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2013137285A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
| JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
| KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
| KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
| TW201715243A (zh) * | 2015-07-31 | 2017-05-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
| CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
| JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
| KR102762417B1 (ko) * | 2023-11-21 | 2025-02-05 | 한미반도체 주식회사 | 본딩장치 |
| KR102779986B1 (ko) * | 2023-11-21 | 2025-03-13 | 한미반도체 주식회사 | 본딩장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| CN1820204A (zh) * | 2003-06-06 | 2006-08-16 | 株式会社爱德万测试 | 搬运装置、电子部件处理装置及该处理装置中的搬运方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
| JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
| KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
-
2006
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active Active
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja not_active Ceased
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Withdrawn
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
| CN1820204A (zh) * | 2003-06-06 | 2006-08-16 | 株式会社爱德万测试 | 搬运装置、电子部件处理装置及该处理装置中的搬运方法 |
Non-Patent Citations (1)
| Title |
|---|
| 同上. |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617820B (zh) * | 2015-12-29 | 2018-03-11 | 泰克元股份有限公司 | 用於測試半導體元件的分選機 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080057206A (ko) | 2008-06-24 |
| WO2008041334A1 (fr) | 2008-04-10 |
| CN101258415A (zh) | 2008-09-03 |
| KR20100017827A (ko) | 2010-02-16 |
| JPWO2008041334A1 (ja) | 2010-02-04 |
| TWI345063B (enExample) | 2011-07-11 |
| KR100942527B1 (ko) | 2010-02-12 |
| TW200821599A (en) | 2008-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |