CN101235524A - 金凹凸或者金布线形成用的非氰系电解金电镀浴液 - Google Patents
金凹凸或者金布线形成用的非氰系电解金电镀浴液 Download PDFInfo
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- CN101235524A CN101235524A CNA2007101663933A CN200710166393A CN101235524A CN 101235524 A CN101235524 A CN 101235524A CN A2007101663933 A CNA2007101663933 A CN A2007101663933A CN 200710166393 A CN200710166393 A CN 200710166393A CN 101235524 A CN101235524 A CN 101235524A
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- CN
- China
- Prior art keywords
- gold
- convex
- salt
- concavo
- golden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010931 gold Substances 0.000 title claims abstract description 110
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 104
- 238000005868 electrolysis reaction Methods 0.000 title claims description 41
- 238000007747 plating Methods 0.000 title abstract description 33
- 238000009713 electroplating Methods 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 47
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 22
- 239000003153 chemical reaction reagent Substances 0.000 claims description 18
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 15
- 150000002940 palladium Chemical class 0.000 claims description 14
- 150000003057 platinum Chemical class 0.000 claims description 14
- -1 sulfurous acid gold alkali salt Chemical class 0.000 claims description 14
- 150000003751 zinc Chemical class 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- GKSYFVIEBZCLEQ-UHFFFAOYSA-N OS(O)=O.N.[Au+3] Chemical compound OS(O)=O.N.[Au+3] GKSYFVIEBZCLEQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011324 bead Substances 0.000 abstract description 13
- 150000003839 salts Chemical class 0.000 abstract description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical class [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical class [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract description 6
- 239000013078 crystal Substances 0.000 abstract description 4
- 239000011701 zinc Chemical class 0.000 abstract description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 abstract 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical class [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical class [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 150000001447 alkali salts Chemical class 0.000 abstract 1
- NHFMFALCHGVCPP-UHFFFAOYSA-M azanium;gold(1+);sulfite Chemical compound [NH4+].[Au+].[O-]S([O-])=O NHFMFALCHGVCPP-UHFFFAOYSA-M 0.000 abstract 1
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract 1
- 238000002161 passivation Methods 0.000 abstract 1
- 229910052709 silver Chemical class 0.000 abstract 1
- 239000004332 silver Chemical class 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000002425 crystallisation Methods 0.000 description 8
- 230000008025 crystallization Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 239000006210 lotion Substances 0.000 description 6
- 238000007669 thermal treatment Methods 0.000 description 5
- 244000247747 Coptis groenlandica Species 0.000 description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 150000002496 iodine Chemical class 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical class Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 150000003016 phosphoric acids Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- XASWYPVFCVEQSU-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;potassium Chemical compound [K].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O XASWYPVFCVEQSU-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- 244000131522 Citrus pyriformis Species 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical class OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical class [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- OCNFLBCBOWEIRI-UHFFFAOYSA-N [K+].[Au+].S(O)(O)=O Chemical compound [K+].[Au+].S(O)(O)=O OCNFLBCBOWEIRI-UHFFFAOYSA-N 0.000 description 1
- RXNUQHQAZAAIDP-UHFFFAOYSA-N [Na+].[Au+].OS(O)=O Chemical compound [Na+].[Au+].OS(O)=O RXNUQHQAZAAIDP-UHFFFAOYSA-N 0.000 description 1
- IKWTVSLWAPBBKU-UHFFFAOYSA-N a1010_sial Chemical compound O=[As]O[As]=O IKWTVSLWAPBBKU-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229960002594 arsenic trioxide Drugs 0.000 description 1
- GOLCXWYRSKYTSP-UHFFFAOYSA-N arsenic trioxide Inorganic materials O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- HOQPTLCRWVZIQZ-UHFFFAOYSA-H bis[[2-(5-hydroxy-4,7-dioxo-1,3,2$l^{2}-dioxaplumbepan-5-yl)acetyl]oxy]lead Chemical compound [Pb+2].[Pb+2].[Pb+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HOQPTLCRWVZIQZ-UHFFFAOYSA-H 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- RLJMLMKIBZAXJO-UHFFFAOYSA-N lead nitrate Chemical compound [O-][N+](=O)O[Pb]O[N+]([O-])=O RLJMLMKIBZAXJO-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- FWFGVMYFCODZRD-UHFFFAOYSA-N oxidanium;hydrogen sulfate Chemical compound O.OS(O)(=O)=O FWFGVMYFCODZRD-UHFFFAOYSA-N 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- MAUNVSHDXVBYGO-UHFFFAOYSA-M silver;azane;hydroxy-oxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound N.[Ag+].OS([O-])(=O)=S MAUNVSHDXVBYGO-UHFFFAOYSA-M 0.000 description 1
- HRZFUMHJMZEROT-UHFFFAOYSA-L sodium disulfite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])(=O)=O HRZFUMHJMZEROT-UHFFFAOYSA-L 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 235000010262 sodium metabisulphite Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- BXBMHLIYMZRCNK-UHFFFAOYSA-H thallium(3+);trisulfate Chemical compound [Tl+3].[Tl+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BXBMHLIYMZRCNK-UHFFFAOYSA-H 0.000 description 1
- KLBIUKJOZFWCLW-UHFFFAOYSA-N thallium(iii) nitrate Chemical compound [Tl+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O KLBIUKJOZFWCLW-UHFFFAOYSA-N 0.000 description 1
- UFVDXEXHBVQKGB-UHFFFAOYSA-L thallous malonate Chemical compound [Tl+].[Tl+].[O-]C(=O)CC([O-])=O UFVDXEXHBVQKGB-UHFFFAOYSA-L 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
实施例 | ||||||
1 | 2 | 3 | 4 | 5 | 6 | |
电镀条件电镀温度(℃)电流密度(A/dm2)电镀时间(分钟) | 600.558 | 600.558 | 600.558 | 600.458 | 600.658 | 600.558 |
配比浓度(g/L)Na3Au(SO3)2 as AuNa2SO3 as SO3Na2SO4 as SO41,2-二氨基乙烷Tl(mg/L)缓冲剂A缓冲剂B钯盐(mg/L as Pd)铂盐(mg/L as Pt)锌盐(mg/L as Zn)银盐(mg/L as Ag ) | 10401041515-7--- | 10401041515--5-- | 10401041515---15- | 10401041515----10 | 1030301515-55--- | 1030301515-5-7-- |
凹凸表面的断坡(μm) | 0.14 | 0.48 | 0.15 | 0.50 | 0.10 | 0.12 |
浴液稳定性电镀被膜外观被膜硬度未进行热处理(Hv)被膜硬度300℃热处理后(Hv)腐蚀性综合评价 | ○○10548○○ | ○○11247○○ | ○○11546○○ | ○○11047○○ | ○○12147○○ | ○○12348○○ |
比较例 | ||
1 | 2 | |
电镀条件电镀温度(℃)电流密度(A/dm2)电镀时间(分钟) | 600.558 | 600.558 |
配比浓度(g/L)Na3Au(SO3)2 as AuNa2SO3 as SO3Na2SO4 as SO41,2-二氨基乙烷Tl(mg/L)缓冲剂A缓冲剂B钯盐(mg/L as Pd)铂盐(mg/L as Pt)锌盐(mg/L as Zn)银盐(mg/L as Ag) | 10401041515----- | 1030301515-5---- |
凹凸表面的高度差(μm)浴液稳定性电镀表膜外观 | 1.86○○ | 1.91○○ |
被膜硬度未进行热处理(Hv)被膜硬度300℃热处理后(Hv)腐蚀性综合评价 | 10344○× | 9645○× |
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006302066A JP4881129B2 (ja) | 2006-11-07 | 2006-11-07 | 金バンプ又は金配線形成用非シアン系電解金めっき浴 |
JP2006302066 | 2006-11-07 | ||
JP2006-302066 | 2006-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101235524A true CN101235524A (zh) | 2008-08-06 |
CN101235524B CN101235524B (zh) | 2010-12-08 |
Family
ID=39501640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101663933A Expired - Fee Related CN101235524B (zh) | 2006-11-07 | 2007-11-07 | 金凹凸或者金布线形成用的非氰系电解金电镀浴液 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4881129B2 (zh) |
KR (1) | KR101344018B1 (zh) |
CN (1) | CN101235524B (zh) |
TW (1) | TWI420609B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104099653A (zh) * | 2013-11-12 | 2014-10-15 | 南茂科技股份有限公司 | 半导体结构及其制造方法 |
CN104357883A (zh) * | 2014-11-20 | 2015-02-18 | 中国地质大学(武汉) | 一种无氰电铸金溶液及电铸金方法 |
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JPS5823478B2 (ja) * | 1979-06-28 | 1983-05-16 | 日本電鍍工業株式会社 | 硬質金合金被膜の製造方法 |
JPS56105494A (en) * | 1980-01-22 | 1981-08-21 | Nippon Mining Co Ltd | Gold-palladium-copper alloy plating solution |
JPH1150295A (ja) * | 1997-07-28 | 1999-02-23 | Daiwa Kasei Kenkyusho:Kk | めっき浴 |
US6126807A (en) * | 1999-04-30 | 2000-10-03 | Lucent Technologies Inc. | Process for making sodium gold sulfite solution |
JP2003013278A (ja) * | 2001-06-26 | 2003-01-15 | Japan Pure Chemical Co Ltd | 金めっき液 |
JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
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JP2005256140A (ja) * | 2004-03-15 | 2005-09-22 | C Uyemura & Co Ltd | 金めっき浴 |
CN100351433C (zh) * | 2004-11-19 | 2007-11-28 | 大连理工大学 | 一种工业纯钛的镀金工艺 |
JP5416330B2 (ja) * | 2005-03-10 | 2014-02-12 | 日本高純度化学株式会社 | 金めっき液用亜硫酸金塩水溶液の製造方法 |
JP2006291242A (ja) * | 2005-04-06 | 2006-10-26 | Matsushita Electric Ind Co Ltd | 金めっき液および金めっき方法および半導体装置の製造方法および半導体装置 |
-
2006
- 2006-11-07 JP JP2006302066A patent/JP4881129B2/ja not_active Expired - Fee Related
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2007
- 2007-10-19 TW TW096139325A patent/TWI420609B/zh not_active IP Right Cessation
- 2007-11-01 KR KR1020070110902A patent/KR101344018B1/ko active IP Right Grant
- 2007-11-07 CN CN2007101663933A patent/CN101235524B/zh not_active Expired - Fee Related
Cited By (8)
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CN104540983A (zh) * | 2012-10-04 | 2015-04-22 | 日本电镀工程股份有限公司 | 非氰系电解镀金液 |
CN104540983B (zh) * | 2012-10-04 | 2019-05-21 | 日本电镀工程股份有限公司 | 非氰系电解镀金液 |
CN104099653A (zh) * | 2013-11-12 | 2014-10-15 | 南茂科技股份有限公司 | 半导体结构及其制造方法 |
CN104099653B (zh) * | 2013-11-12 | 2015-10-28 | 南茂科技股份有限公司 | 半导体结构及其制造方法 |
CN104357883A (zh) * | 2014-11-20 | 2015-02-18 | 中国地质大学(武汉) | 一种无氰电铸金溶液及电铸金方法 |
CN104357883B (zh) * | 2014-11-20 | 2016-09-14 | 中国地质大学(武汉) | 一种无氰电铸金溶液及电铸金方法 |
CN113981495A (zh) * | 2021-09-30 | 2022-01-28 | 深圳市联合蓝海黄金材料科技股份有限公司 | 用于晶圆电镀的无氰电镀金液及其应用和晶圆电镀金的方法 |
CN113981495B (zh) * | 2021-09-30 | 2022-05-27 | 深圳市联合蓝海黄金材料科技股份有限公司 | 用于晶圆电镀的无氰电镀金液及其应用和晶圆电镀金的方法 |
Also Published As
Publication number | Publication date |
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KR20080041571A (ko) | 2008-05-13 |
CN101235524B (zh) | 2010-12-08 |
TW200836278A (en) | 2008-09-01 |
TWI420609B (zh) | 2013-12-21 |
JP2008115449A (ja) | 2008-05-22 |
KR101344018B1 (ko) | 2013-12-24 |
JP4881129B2 (ja) | 2012-02-22 |
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