JPS56105494A - Gold-palladium-copper alloy plating solution - Google Patents

Gold-palladium-copper alloy plating solution

Info

Publication number
JPS56105494A
JPS56105494A JP623280A JP623280A JPS56105494A JP S56105494 A JPS56105494 A JP S56105494A JP 623280 A JP623280 A JP 623280A JP 623280 A JP623280 A JP 623280A JP S56105494 A JPS56105494 A JP S56105494A
Authority
JP
Japan
Prior art keywords
plating solution
gold
palladium
alloy plating
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP623280A
Other languages
Japanese (ja)
Inventor
Takashi Konase
Seiji Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP623280A priority Critical patent/JPS56105494A/en
Publication of JPS56105494A publication Critical patent/JPS56105494A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To form a stable, corrosion-resistant layer plate with gold-alloy, and is colored white to pink, using a plating solution having an adjusted pH contg. each specific concentration of Au, Pd, and Cu, and specific additives.
CONSTITUTION: Au-Pd-Cu alloy plating solution contains 2.5W20.0g/l or preferably 3W5g/l of Au as gold sulfite salt, 1.5W10.0g/l or preferably 2W3g/l of Pd as palladium ammonium sulfate, and 0.15W1.0g/l or preferably 0.2W0.3g/l of Cu as cupric citrate. Contained additives are 27.5W80g/l of ammonium sulfate, 25W 150g/l of alkali citrate, and 22.5W180g/l of alkali sulfite. The pH of the plating solution is adjusted to 7.0W9.0 or preferably to 8.0 and is used. Preferably, the solution temperature is about 60°C or less and the current density is about 2A/dm2.
COPYRIGHT: (C)1981,JPO&Japio
JP623280A 1980-01-22 1980-01-22 Gold-palladium-copper alloy plating solution Pending JPS56105494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP623280A JPS56105494A (en) 1980-01-22 1980-01-22 Gold-palladium-copper alloy plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP623280A JPS56105494A (en) 1980-01-22 1980-01-22 Gold-palladium-copper alloy plating solution

Publications (1)

Publication Number Publication Date
JPS56105494A true JPS56105494A (en) 1981-08-21

Family

ID=11632763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP623280A Pending JPS56105494A (en) 1980-01-22 1980-01-22 Gold-palladium-copper alloy plating solution

Country Status (1)

Country Link
JP (1) JPS56105494A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228457B1 (en) * 1999-03-30 2001-05-08 Furuyametals Co. Ltd. Optical data storage medium
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
JP2008115449A (en) * 2006-11-07 2008-05-22 Ne Chemcat Corp Non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
US6228457B1 (en) * 1999-03-30 2001-05-08 Furuyametals Co. Ltd. Optical data storage medium
JP2008115449A (en) * 2006-11-07 2008-05-22 Ne Chemcat Corp Non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring
JP5025815B1 (en) * 2011-08-10 2012-09-12 小島化学薬品株式会社 Hard gold plating solution

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