JPS56105494A - Gold-palladium-copper alloy plating solution - Google Patents
Gold-palladium-copper alloy plating solutionInfo
- Publication number
- JPS56105494A JPS56105494A JP623280A JP623280A JPS56105494A JP S56105494 A JPS56105494 A JP S56105494A JP 623280 A JP623280 A JP 623280A JP 623280 A JP623280 A JP 623280A JP S56105494 A JPS56105494 A JP S56105494A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- gold
- palladium
- alloy plating
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To form a stable, corrosion-resistant layer plate with gold-alloy, and is colored white to pink, using a plating solution having an adjusted pH contg. each specific concentration of Au, Pd, and Cu, and specific additives.
CONSTITUTION: Au-Pd-Cu alloy plating solution contains 2.5W20.0g/l or preferably 3W5g/l of Au as gold sulfite salt, 1.5W10.0g/l or preferably 2W3g/l of Pd as palladium ammonium sulfate, and 0.15W1.0g/l or preferably 0.2W0.3g/l of Cu as cupric citrate. Contained additives are 27.5W80g/l of ammonium sulfate, 25W 150g/l of alkali citrate, and 22.5W180g/l of alkali sulfite. The pH of the plating solution is adjusted to 7.0W9.0 or preferably to 8.0 and is used. Preferably, the solution temperature is about 60°C or less and the current density is about 2A/dm2.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP623280A JPS56105494A (en) | 1980-01-22 | 1980-01-22 | Gold-palladium-copper alloy plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP623280A JPS56105494A (en) | 1980-01-22 | 1980-01-22 | Gold-palladium-copper alloy plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56105494A true JPS56105494A (en) | 1981-08-21 |
Family
ID=11632763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP623280A Pending JPS56105494A (en) | 1980-01-22 | 1980-01-22 | Gold-palladium-copper alloy plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56105494A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6228457B1 (en) * | 1999-03-30 | 2001-05-08 | Furuyametals Co. Ltd. | Optical data storage medium |
US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
JP2008115449A (en) * | 2006-11-07 | 2008-05-22 | Ne Chemcat Corp | Non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring |
JP5025815B1 (en) * | 2011-08-10 | 2012-09-12 | 小島化学薬品株式会社 | Hard gold plating solution |
-
1980
- 1980-01-22 JP JP623280A patent/JPS56105494A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6576114B1 (en) | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
US6228457B1 (en) * | 1999-03-30 | 2001-05-08 | Furuyametals Co. Ltd. | Optical data storage medium |
JP2008115449A (en) * | 2006-11-07 | 2008-05-22 | Ne Chemcat Corp | Non-cyanogen-based gold electroplating bath for forming gold bump or gold wiring |
JP5025815B1 (en) * | 2011-08-10 | 2012-09-12 | 小島化学薬品株式会社 | Hard gold plating solution |
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