CN101231135B - 减压干燥装置 - Google Patents
减压干燥装置 Download PDFInfo
- Publication number
- CN101231135B CN101231135B CN2007101932234A CN200710193223A CN101231135B CN 101231135 B CN101231135 B CN 101231135B CN 2007101932234 A CN2007101932234 A CN 2007101932234A CN 200710193223 A CN200710193223 A CN 200710193223A CN 101231135 B CN101231135 B CN 101231135B
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- CN
- China
- Prior art keywords
- substrate
- heating
- chamber
- dry device
- decompression dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
腔室内温度 | 23℃ | 30℃ | 35℃ | 40℃ | 45℃ |
结果 | ○ | ○ | ○ | △ | × |
Claims (11)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007015699 | 2007-01-26 | ||
JP2007-015699 | 2007-01-26 | ||
JP2007015699 | 2007-01-26 | ||
JP2007208911 | 2007-08-10 | ||
JP2007208911A JP5089288B2 (ja) | 2007-01-26 | 2007-08-10 | 減圧乾燥装置 |
JP2007-208911 | 2007-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101231135A CN101231135A (zh) | 2008-07-30 |
CN101231135B true CN101231135B (zh) | 2010-06-02 |
Family
ID=39780626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101932234A Active CN101231135B (zh) | 2007-01-26 | 2007-11-20 | 减压干燥装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5089288B2 (zh) |
KR (1) | KR100924901B1 (zh) |
CN (1) | CN101231135B (zh) |
TW (1) | TWI342385B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5371605B2 (ja) * | 2008-09-25 | 2013-12-18 | 東京エレクトロン株式会社 | 減圧乾燥装置及び減圧乾燥方法 |
CN101738069A (zh) * | 2008-11-06 | 2010-06-16 | 奇美电子股份有限公司 | 真空干燥软烤设备及真空干燥软烤工艺 |
KR101020674B1 (ko) | 2008-11-18 | 2011-03-09 | 세메스 주식회사 | 기판 상의 포토레지스트막을 건조하기 위한 장치 |
KR101020675B1 (ko) | 2008-11-18 | 2011-03-09 | 세메스 주식회사 | 기판 상의 포토레지스트막을 건조하기 위한 장치 |
WO2010113941A1 (ja) * | 2009-03-30 | 2010-10-07 | 東京エレクトロン株式会社 | 被処理体の冷却方法および被処理体処理装置 |
KR101147654B1 (ko) * | 2009-11-26 | 2012-05-23 | 세메스 주식회사 | 기판 처리 방법 |
CN103730331B (zh) * | 2012-10-10 | 2016-06-08 | 辛耘企业股份有限公司 | 干燥方法及干燥装置 |
KR20140065851A (ko) * | 2012-11-22 | 2014-05-30 | 신화일렉트론 주식회사 | 다단식 글라스 건조장치 |
JP6560072B2 (ja) * | 2015-09-11 | 2019-08-14 | 株式会社Screenホールディングス | 減圧乾燥装置および減圧乾燥方法 |
KR102560313B1 (ko) * | 2016-01-19 | 2023-07-27 | 삼성디스플레이 주식회사 | 감압 장치 및 이를 이용한 발광 표시 장치의 제조 방법 |
CN105783438B (zh) * | 2016-03-09 | 2018-09-18 | 武汉华星光电技术有限公司 | 一种减压加热干燥装置 |
KR102525361B1 (ko) | 2016-04-27 | 2023-04-25 | 삼성디스플레이 주식회사 | 감압 건조 장치 및 이를 이용한 막 제조 방법 |
JP6872328B2 (ja) * | 2016-09-06 | 2021-05-19 | 株式会社Screenホールディングス | 減圧乾燥装置、減圧乾燥システム、減圧乾燥方法 |
US10615378B2 (en) * | 2016-09-30 | 2020-04-07 | Tokyo Electron Limited | Reduced-pressure drying apparatus |
KR101870659B1 (ko) * | 2016-12-26 | 2018-06-27 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
JP6476215B2 (ja) * | 2017-01-12 | 2019-02-27 | 東京エレクトロン株式会社 | 減圧乾燥装置、減圧乾燥方法及びベーク処理システム |
JP6400771B1 (ja) * | 2017-04-11 | 2018-10-03 | 株式会社石井表記 | ヒータ付き減圧ユニット及び電池製造用装置 |
CN107062812B (zh) * | 2017-04-26 | 2019-09-03 | 京东方科技集团股份有限公司 | 一种减压干燥腔及真空减压干燥设备 |
JP6886866B2 (ja) * | 2017-05-31 | 2021-06-16 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
CN107219727B (zh) * | 2017-06-22 | 2021-02-02 | 武汉华星光电技术有限公司 | 减压干燥设备 |
JP6871959B2 (ja) * | 2018-03-30 | 2021-05-19 | 芝浦メカトロニクス株式会社 | 有機膜形成装置、および有機膜の製造方法 |
KR102226624B1 (ko) * | 2018-03-30 | 2021-03-12 | 시바우라 메카트로닉스 가부시끼가이샤 | 유기막 형성 장치, 및 유기막의 제조 방법 |
CN109489363A (zh) * | 2018-12-24 | 2019-03-19 | 国兴(东莞)新能源科技有限公司 | 一种软包电池除水装置 |
DE102019220279B4 (de) * | 2019-08-22 | 2023-08-10 | Smartec Co., Ltd. | Trocknungsgerät für Batterieelektrode |
JP6907280B2 (ja) * | 2019-09-12 | 2021-07-21 | 中外炉工業株式会社 | 減圧乾燥装置 |
JP2021096961A (ja) * | 2019-12-17 | 2021-06-24 | 東京エレクトロン株式会社 | 減圧乾燥装置および減圧乾燥方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004079682A (ja) * | 2002-08-13 | 2004-03-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2005277268A (ja) * | 2004-03-26 | 2005-10-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US7082261B2 (en) * | 2004-03-26 | 2006-07-25 | Ushio Denki Kabushiki Kaisha | Heating stage |
CN1834791A (zh) * | 2005-03-14 | 2006-09-20 | 大日本网目版制造株式会社 | 减压干燥装置 |
JP2006302980A (ja) * | 2005-04-18 | 2006-11-02 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0265233A (ja) * | 1988-08-31 | 1990-03-05 | Nec Yamagata Ltd | 半導体ウェーハの水分除去装置 |
JPH02114522A (ja) * | 1988-10-24 | 1990-04-26 | Mitsubishi Electric Corp | ウエハ処理装置 |
JPH03228313A (ja) * | 1990-02-02 | 1991-10-09 | Nec Corp | 半導体基板の乾燥装置 |
JP3831478B2 (ja) * | 1997-05-14 | 2006-10-11 | 芝浦メカトロニクス株式会社 | 真空乾燥処理装置 |
JPH11329922A (ja) * | 1998-05-08 | 1999-11-30 | Dainippon Screen Mfg Co Ltd | 基板冷却装置および基板冷却方法 |
JP2001194067A (ja) * | 2000-01-12 | 2001-07-17 | Chiyoda Manufacturing Co Ltd | マイクロ波乾燥装置の運転方法 |
JP2003279245A (ja) * | 2002-03-19 | 2003-10-02 | Seiko Epson Corp | 塗布膜の乾燥方法及びその装置、デバイスの製造方法、デバイス |
JP4236881B2 (ja) * | 2002-07-19 | 2009-03-11 | 大日本スクリーン製造株式会社 | 熱処理装置 |
KR100464853B1 (ko) * | 2002-06-20 | 2005-01-06 | 삼성전자주식회사 | 순간감압가열 건조방법 및 장치 |
JP2004174316A (ja) * | 2002-11-25 | 2004-06-24 | Canon Inc | 乾燥装置および乾燥方法 |
JP4250469B2 (ja) * | 2003-07-14 | 2009-04-08 | キヤノンマーケティングジャパン株式会社 | 熱処理装置及び熱処理方法 |
-
2007
- 2007-08-10 JP JP2007208911A patent/JP5089288B2/ja active Active
- 2007-11-09 TW TW096142587A patent/TWI342385B/zh active
- 2007-11-12 KR KR1020070114894A patent/KR100924901B1/ko active IP Right Grant
- 2007-11-20 CN CN2007101932234A patent/CN101231135B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004079682A (ja) * | 2002-08-13 | 2004-03-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2005277268A (ja) * | 2004-03-26 | 2005-10-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US7082261B2 (en) * | 2004-03-26 | 2006-07-25 | Ushio Denki Kabushiki Kaisha | Heating stage |
CN1834791A (zh) * | 2005-03-14 | 2006-09-20 | 大日本网目版制造株式会社 | 减压干燥装置 |
JP2006302980A (ja) * | 2005-04-18 | 2006-11-02 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080070503A (ko) | 2008-07-30 |
KR100924901B1 (ko) | 2009-11-02 |
TW200844388A (en) | 2008-11-16 |
TWI342385B (en) | 2011-05-21 |
CN101231135A (zh) | 2008-07-30 |
JP5089288B2 (ja) | 2012-12-05 |
JP2008202930A (ja) | 2008-09-04 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |