CN101221918B - 基板搬运装置、基板承载架和基板处理装置 - Google Patents
基板搬运装置、基板承载架和基板处理装置 Download PDFInfo
- Publication number
- CN101221918B CN101221918B CN2007103056009A CN200710305600A CN101221918B CN 101221918 B CN101221918 B CN 101221918B CN 2007103056009 A CN2007103056009 A CN 2007103056009A CN 200710305600 A CN200710305600 A CN 200710305600A CN 101221918 B CN101221918 B CN 101221918B
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- China
- Prior art keywords
- substrate
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- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-352000 | 2006-12-27 | ||
JP2006352000 | 2006-12-27 | ||
JP2006352000A JP4744427B2 (ja) | 2006-12-27 | 2006-12-27 | 基板処理装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010198915XA Division CN101872736B (zh) | 2006-12-27 | 2007-12-27 | 基板处理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101221918A CN101221918A (zh) | 2008-07-16 |
CN101221918B true CN101221918B (zh) | 2010-07-14 |
Family
ID=39584217
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010198915XA Active CN101872736B (zh) | 2006-12-27 | 2007-12-27 | 基板处理装置 |
CN2007103056009A Active CN101221918B (zh) | 2006-12-27 | 2007-12-27 | 基板搬运装置、基板承载架和基板处理装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010198915XA Active CN101872736B (zh) | 2006-12-27 | 2007-12-27 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20080159832A1 (zh) |
JP (1) | JP4744427B2 (zh) |
KR (1) | KR100927302B1 (zh) |
CN (2) | CN101872736B (zh) |
TW (1) | TWI455234B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8430620B1 (en) | 2008-03-24 | 2013-04-30 | Novellus Systems, Inc. | Dedicated hot and cold end effectors for improved throughput |
JP5102717B2 (ja) * | 2008-08-13 | 2012-12-19 | 大日本スクリーン製造株式会社 | 基板搬送装置およびこれを備えた基板処理装置 |
KR100989851B1 (ko) * | 2008-08-28 | 2010-10-29 | 세메스 주식회사 | 이송부재의 속도 조절 방법, 이를 이용한 기판 이송 방법 및 기판 처리 장치 |
KR101094387B1 (ko) * | 2008-08-28 | 2011-12-15 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
JP5000627B2 (ja) | 2008-11-27 | 2012-08-15 | 東京エレクトロン株式会社 | 基板処理システム |
JP2010192685A (ja) * | 2009-02-18 | 2010-09-02 | Tokyo Electron Ltd | 基板搬送装置及び基板処理システム |
DE102009009548A1 (de) * | 2009-02-19 | 2010-09-09 | Jonas & Redmann Automationstechnik Gmbh | Verfahren zum Bilden einer paketartigen Back-To-Back-Wafercharge |
JP5037551B2 (ja) * | 2009-03-24 | 2012-09-26 | 東京エレクトロン株式会社 | 基板交換機構及び基板交換方法 |
JP5347652B2 (ja) * | 2009-03-30 | 2013-11-20 | 株式会社Ihi | 基板昇降移送装置及び基板処理移送システム |
JP5274339B2 (ja) * | 2009-03-30 | 2013-08-28 | 大日本スクリーン製造株式会社 | 基板処理装置および基板搬送方法 |
JP4707749B2 (ja) * | 2009-04-01 | 2011-06-22 | 東京エレクトロン株式会社 | 基板交換方法及び基板処理装置 |
TWI451519B (zh) * | 2010-10-19 | 2014-09-01 | Au Optronics Corp | 基板運輸處理方法 |
CN102064126B (zh) * | 2010-11-04 | 2013-04-17 | 友达光电股份有限公司 | 基板运输处理方法 |
WO2012086164A1 (ja) | 2010-12-24 | 2012-06-28 | 川崎重工業株式会社 | 搬送ロボット、その基板搬送方法、及び基板搬送中継装置 |
KR102392186B1 (ko) * | 2011-03-11 | 2022-04-28 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 툴 |
JP5666361B2 (ja) * | 2011-03-29 | 2015-02-12 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
JP2013098288A (ja) * | 2011-10-31 | 2013-05-20 | Disco Abrasive Syst Ltd | 搬送装置 |
KR20140087038A (ko) * | 2011-12-15 | 2014-07-08 | 다즈모 가부시키가이샤 | 웨이퍼 반송장치 |
JP5283770B2 (ja) * | 2012-05-15 | 2013-09-04 | 大日本スクリーン製造株式会社 | 基板搬送装置およびこれを備えた基板処理装置 |
JP5993625B2 (ja) * | 2012-06-15 | 2016-09-14 | 株式会社Screenホールディングス | 基板反転装置、および、基板処理装置 |
US9245783B2 (en) | 2013-05-24 | 2016-01-26 | Novellus Systems, Inc. | Vacuum robot with linear translation carriage |
JP6190645B2 (ja) * | 2013-07-09 | 2017-08-30 | 東京エレクトロン株式会社 | 基板搬送方法 |
US9214369B2 (en) * | 2013-11-01 | 2015-12-15 | Varian Semiconductor Equipment Associates, Inc. | Dynamic pitch substrate lift |
JP6347333B2 (ja) * | 2015-06-01 | 2018-06-27 | 株式会社ダイフク | 平面保管設備における入出庫装置の制御方法 |
CN107552467A (zh) * | 2017-09-24 | 2018-01-09 | 安徽海拓志永智能装备股份有限公司 | 适用于玻璃清洗的上线系统 |
TWI668790B (zh) * | 2018-04-30 | 2019-08-11 | 漢民科技股份有限公司 | 用於半導體製程之基板傳送機構及成膜裝置 |
US11427412B2 (en) * | 2019-05-09 | 2022-08-30 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and substrate conveying method |
US11004713B2 (en) * | 2019-05-16 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot arm device and method for transferring wafer |
KR102150230B1 (ko) * | 2020-04-07 | 2020-08-31 | (주)볼타오토메이션 | 진공로봇을 이용한 이송장치 |
KR20220106900A (ko) * | 2021-01-22 | 2022-08-01 | 삼성디스플레이 주식회사 | 기판 적재용 카세트 및 이를 이용한 기판 처리 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0870033A (ja) * | 1994-08-26 | 1996-03-12 | Kokusai Electric Co Ltd | 半導体製造装置のウェーハ移載機 |
KR100310249B1 (ko) * | 1995-08-05 | 2001-12-17 | 엔도 마코토 | 기판처리장치 |
TW318258B (zh) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
JP3522469B2 (ja) * | 1996-11-18 | 2004-04-26 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JPH11130254A (ja) * | 1997-10-24 | 1999-05-18 | Sharp Corp | 基板搬送カセット |
JP3589839B2 (ja) * | 1997-10-24 | 2004-11-17 | シャープ株式会社 | ピッチ変換を伴う基板搬送装置 |
JP3974985B2 (ja) | 1997-12-02 | 2007-09-12 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JP3888608B2 (ja) * | 2001-04-25 | 2007-03-07 | 東京エレクトロン株式会社 | 基板両面処理装置 |
JP4283559B2 (ja) * | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | 搬送装置及び真空処理装置並びに常圧搬送装置 |
JP2005072559A (ja) * | 2003-08-05 | 2005-03-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP5154008B2 (ja) * | 2004-11-10 | 2013-02-27 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
KR20060077960A (ko) * | 2004-12-30 | 2006-07-05 | 삼성전자주식회사 | 레티클 수납 카세트 |
-
2006
- 2006-12-27 JP JP2006352000A patent/JP4744427B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-18 US US11/958,816 patent/US20080159832A1/en not_active Abandoned
- 2007-12-21 KR KR1020070135430A patent/KR100927302B1/ko active IP Right Grant
- 2007-12-27 TW TW096150475A patent/TWI455234B/zh active
- 2007-12-27 CN CN201010198915XA patent/CN101872736B/zh active Active
- 2007-12-27 CN CN2007103056009A patent/CN101221918B/zh active Active
-
2010
- 2010-09-20 US US12/886,063 patent/US8500915B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101872736A (zh) | 2010-10-27 |
TWI455234B (zh) | 2014-10-01 |
KR20080061290A (ko) | 2008-07-02 |
US20080159832A1 (en) | 2008-07-03 |
CN101872736B (zh) | 2012-10-24 |
US8500915B2 (en) | 2013-08-06 |
CN101221918A (zh) | 2008-07-16 |
JP2008166370A (ja) | 2008-07-17 |
JP4744427B2 (ja) | 2011-08-10 |
TW200836289A (en) | 2008-09-01 |
US20110008148A1 (en) | 2011-01-13 |
KR100927302B1 (ko) | 2009-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |