US20080159832A1 - Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus - Google Patents

Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus Download PDF

Info

Publication number
US20080159832A1
US20080159832A1 US11/958,816 US95881607A US2008159832A1 US 20080159832 A1 US20080159832 A1 US 20080159832A1 US 95881607 A US95881607 A US 95881607A US 2008159832 A1 US2008159832 A1 US 2008159832A1
Authority
US
United States
Prior art keywords
substrate
storing
height
difference
holders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/958,816
Other languages
English (en)
Inventor
Ichiro Mitsuyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to DAINIPPON SCREEN MFG. CO., LTD. reassignment DAINIPPON SCREEN MFG. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MITSUYOSHI, ICHIRO
Publication of US20080159832A1 publication Critical patent/US20080159832A1/en
Priority to US12/886,063 priority Critical patent/US8500915B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Definitions

  • the present invention relates to a substrate transporting apparatus that transports a substrate, a substrate platform shelf where the substrate is placed and a substrate processing apparatus that processes the substrate.
  • Substrate processing apparatuses have been conventionally used to perform various types of processes on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks or the like.
  • FIG. 11 is a plan view showing the substrate processing apparatus described in JP 10-150090 A. As shown in FIG. 11 , this substrate processing apparatus 900 includes an indexer 910 and a processing module 920 .
  • the indexer 910 includes an indexer robot 912 that moves back and forth along an indexer transport path 911 that linearly extends and a cassette platform 913 where a plurality of carriers C can be placed along the indexer transport path 911 .
  • the plurality of substrates W are stored in the carriers C.
  • the processing module 920 includes a main transport robot 922 that moves back and forth along a main transport path 921 that is perpendicular to the indexer transport path 911 and a pair of unit sections 930 A, 930 B provided such that the main transport path 921 is sandwiched therebetween.
  • Processing chambers 933 , 934 for performing processing on the substrate W are provided in each of the unit sections 930 A, 930 B.
  • transportation of the substrate W is performed as follows.
  • the carrier C is carried into the cassette platform 913 from outside of the substrate processing apparatus 900 . Then, the unprocessed substrate W stored in the carrier C is taken out by the indexer robot 912 and transferred to the main transport robot 922 .
  • the substrate W transferred to the main transport robot 922 is carried into the processing chambers 933 , 934 and subjected to cleaning processing. Thereafter, the processed substrate W is again stored in the carrier C by the main transport robot 922 and the indexer robot 912 .
  • the indexer robot 912 includes a substrate taking out arm for taking the unprocessed substrate W out of the carrier C and a substrate storing arm for storing the processed substrate W in the carrier C.
  • the indexer robot 912 takes the unprocessed substrate W out of the carrier C and transports it, and transfers the substrate W to the main transport robot 922 . Also, the indexer robot 912 receives the processed substrate W from the main transport robot 922 and transports it, and stores the substrate W in the carrier C.
  • the carrier C of which the indexer robot 912 takes the unprocessed substrate W out and the carrier C in which the indexer robot 912 stores the processed substrate W are different from each other in some cases.
  • the indexer robot 912 after storing the processed substrate W in one carrier C, the indexer robot 912 must move along the indexer transport path 911 toward the other carrier C in which the unprocessed substrate W is stored. This prevents the throughput in the substrate processing apparatus 900 from being improved.
  • the operation speed of the indexer robot 912 is increased to improve the throughput in the substrate processing apparatus 900 .
  • the operation speed of the indexer robot 912 can not be remarkably increased due to the following reasons.
  • the spacing for storing the substrates W is very small in order to store more of the substrate W.
  • the substrate taking out arm and the substrate storing arm of the indexer robot 912 are manufactured so that their radial thicknesses are small, corresponding to the spacing for storing the substrate W in the carriers C. Therefore, rigidity of the substrate taking out arm and the substrate storing arm is not very high.
  • the substrate transporting apparatus transfers and receives the substrate to and from the storing container having the plurality of stages of storing grooves by using the first and second substrate holders that are provided one above the other.
  • the difference in height between the first and second substrate holders is adjusted to be the same as the difference in height between the storing grooves of the storing container by the adjusting mechanism when the substrate is transferred and received.
  • the first and second substrate holders can be easily inserted between the storing grooves of the storing container, respectively, by being advanced in the substantially horizontal direction by the driving mechanism. Accordingly, the plurality of substrates are smoothly transferred and received between the first and second substrate holders and the storing grooves of the storing container.
  • the substrate transporting apparatus transfers and receives the substrate to and from the substrate platform shelf having the plurality of stages of storing shelves by using the first and second substrate holders.
  • the difference in height between the first and second substrate holders is adjusted to be the same as the difference in height between the storing shelves of the substrate platform shelf by the adjusting mechanism when the substrate is transferred and received.
  • the first and second substrate holders can be easily inserted between the storing shelves of the substrate platform shelf, respectively, by being advanced in the substantially horizontal direction by the driving mechanism. Accordingly, the plurality of substrates are smoothly transferred and received between the first and second substrate holders and the storing shelves of the substrate platform shelf.
  • the first and second substrate holders can simultaneously transfer and receive the plurality of substrates to and from the storing container and to and from the substrate platform shelf. This allows the transport time of the substrate to be sufficiently reduced.
  • the driving mechanism may individually advance and withdraw the first and second substrate holders in the substantially horizontal direction for transferring and receiving the substrate to and from the storing container and for transferring and receiving the substrate to and from the substrate platform shelf.
  • the first and second substrate holders are individually advanced and withdrawn in the substantially horizontal direction. This allows the single substrate to be transferred and received between the first or second substrate holders and the storing container. Moreover, the single substrate can be transferred and received between the first or second substrate holders and the substrate storing shelf.
  • a substrate platform shelf for transferring and receiving a substrate between a first substrate transporting apparatus having first and second substrate holders that are provided one above the other and a second substrate transporting apparatus having third and fourth substrate holders that are provided one above the other includes a plurality of stages of storing shelves that support the substrates in substantially horizontal postures respectively and an adjusting mechanism that adjusts a difference in height between the storing shelves, wherein the adjusting mechanism adjusts the difference in height between the storing shelves to be the same as a difference in height between the first and second substrate holders when the substrate is transferred and received to and from the first substrate transporting apparatus and adjusts the difference in height between the storing shelves to be the same as a difference in height between the third and fourth substrate holders when the substrate is transferred and received to and from the second substrate transporting apparatus.
  • the substrate is transferred and received between the plurality of stages of storing shelves that support the substrate in the substantially horizontal posture and the first substrate transporting apparatus.
  • the difference in height between the storing shelves is adjusted to be the same as the difference in height between the first and second substrate holders by the adjusting mechanism when the substrate is transferred and received. This allows the first and second substrate holders to be easily inserted between the storing shelves, respectively. Accordingly, the plurality of substrates are smoothly transferred and received between the plurality of stages of storing shelves and the first substrate transporting apparatus.
  • the substrate is transferred and received between the storing shelf and the second substrate transporting apparatus in this substrate platform shelf.
  • the difference in height between the storing shelves is adjusted to be the same as the difference in height between the third and fourth substrate holders by the adjusting mechanism when the substrate is transferred and received. This allows the third and fourth substrate holders to be easily inserted between the storing shelves, respectively. Accordingly, the plurality of substrates are smoothly transferred and received between the plurality of stages of storing shelves and the second substrate transporting apparatus.
  • the plurality of substrates can be simultaneously transferred and received between the plurality of stages of storing shelves and the first and second substrate transporting apparatuses, even though the difference in height between the first and second substrate holders of the first substrate transporting apparatus and the difference in height between the third and fourth substrate holders of the second substrate transporting apparatus are different from each other. This allows the transport time of the substrate to be sufficiently reduced.
  • Each stage of the storing shelves may include a set of shelves arranged at a predetermined spacing within a substantially horizontal plane and a plurality of support members that are provided in the set of shelves and support a lower surface of the substrate.
  • a space is formed between the shelves on each stage of the storing shelves. This allows the first and second substrate holders to be more easily inserted into the space formed between the shelves when the substrate is transferred and received between the plurality of stages of storing shelves and the first substrate transporting apparatus.
  • the third and fourth substrate holders can be more easily inserted into the space formed between the shelves when the substrate is transferred and received between the plurality of stages of storing shelves and the second substrate transporting apparatus.
  • the plurality of substrates are more smoothly transferred and received between the plurality of stages of storing shelves and the first substrate transporting apparatus and between the plurality of stages of storing shelves and the second substrate transporting apparatus.
  • the storing container is placed in the container platform in the carrying in and out region.
  • the substrates are stored in substantially horizontal postures in the plurality of storing grooves of the storing container.
  • the first substrate transporting apparatus in the carrying in and out region transports the substrate between the storing container on the container platform and the substrate platform shelf in the interface.
  • the substrates are placed in the substantially horizontal postures in the plurality of stages of storing shelves of the substrate platform shelf.
  • the second substrate transporting apparatus in the processing region transports the substrate between the substrate platform shelf in the interface and the processing unit.
  • the substrate stored in the storing container in the carrying in and out region is transported by the first and second substrate transporting apparatuses to be processed in the processing unit.
  • the substrate processed in the processing unit is transported by the second and first substrate transporting apparatuses to be stored in the storing container in the carrying in and out region.
  • the first substrate transporting apparatus transfers and receives the substrate to and from the storing container having the plurality of stages of storing grooves by using the first and second substrate holders that are provided one above the other.
  • the difference in height between the first and second substrate holders is adjusted to be the same as the difference in height between the storing grooves of the storing container by the adjusting mechanism when the substrate is transferred and received.
  • first and second substrate holders to be easily inserted between the storing grooves of the storing container, respectively, by being advanced in the substantially horizontal direction by the driving mechanism.
  • the plurality of substrates are smoothly transferred and received between the first and second substrate holders and the storing grooves of the storing container.
  • the first substrate transporting apparatus transfers and receives the substrate to and from the substrate platform shelf having the plurality of stages of storing shelves by using the first and second substrate holders.
  • the difference in height between the first and second substrate holders is adjusted to be the same as the difference in height between the storing shelves of the substrate platform shelf by the adjusting mechanism when the substrate is transferred and received.
  • the first and second holders can be easily inserted between the storing shelves of the substrate platform shelf, respectively, by being advanced in the substantially horizontal direction by the driving mechanism. Accordingly, the plurality of substrates are smoothly transferred and received between the first and second substrate holders and the storing shelves of the substrate platform shelf.
  • the first and second substrate holders of the first substrate transporting apparatus can simultaneously transfer and receive the plurality of substrates to and from the storing container and to and from the substrate platform shelf. As a result, the transport time of the substrate is sufficiently reduced and the throughput in the substrate processing is sufficiently improved.
  • the processing unit may include a cleaning processing unit that cleans the substrate.
  • the substrate is cleaned by the cleaning processing unit.
  • the storing container is placed in the container platform in the carrying in and out region.
  • the substrates are stored in the substantially horizontal postures in the plurality of storing grooves of the storing container.
  • the first substrate transporting apparatus in the carrying in and out region transports the substrate between the storing container on the container platform and the substrate platform shelf in the interface.
  • the substrates are placed in the substantially horizontal postures in the plurality of stages of storing shelves of the substrate platform shelf.
  • the second substrate transporting apparatus in the processing region transports the substrate between the substrate platform shelf in the interface and the processing unit.
  • the substrate stored in the storing container in the carrying in and out region is transported by the first and second substrate transporting apparatuses to be processed in the processing unit.
  • the substrate processed in the processing unit is transported by the second and first substrate transporting apparatuses to be stored in the storing container in the carrying in and out region.
  • the first substrate transporting apparatus transfers and receives the substrate to and from the substrate platform shelf having the plurality of stages of storing shelves by using the first and second substrate holders that are provided one above the other.
  • the difference in height between the storing shelves is adjusted to be the same as the difference in height between the first and second substrate holders by the adjusting mechanism when the substrate is transferred and received. This allows the first and second substrate holders to be easily inserted between the storing shelves, respectively.
  • the plurality of substrates are smoothly transferred and received between the plurality of stages of storing shelves and the first substrate transporting apparatus.
  • the second substrate transporting apparatus transfers and receives the substrate to and from the substrate platform shelf having the plurality of stages of storing shelves by using the third and fourth substrate holders that are provided one above the other.
  • the difference in height between the storing shelves is adjusted to be the same as the difference in height between the third and fourth substrate holders by the adjusting mechanism when the substrate is transferred and received.
  • This allows the third and fourth substrate holders to be easily inserted between the storing shelves, respectively. Accordingly, the plurality of substrates are smoothly transferred and received between the plurality of stages of storing shelves and the second substrate transporting apparatus.
  • the plurality of substrates can be simultaneously transferred and received between the plurality of stages of storing shelves and the first and second substrate transporting apparatuses, even though the difference in height between the first and second substrate holders of the first substrate transporting apparatus and the difference in height between the third and fourth substrate holders of the second substrate transporting apparatus are different from each other. As a result, the transport time of the substrate is sufficiently reduced and the throughput in the substrate processing is sufficiently improved.
  • the processing unit may include a cleaning processing unit that cleans the substrate.
  • the substrate is cleaned by the cleaning processing unit.
  • FIG. 1 is a plan view and a schematic side view of a substrate processing apparatus according to a first embodiment
  • FIG. 2 is a diagram schematically showing a sectional view taken along the line A-A of FIG. 1 ( a );
  • FIG. 3 is a vertical sectional view for explaining configurations of a carrier and a substrate platform of FIG. 1 ;
  • FIG. 4 is a side view of an indexer robot
  • FIG. 5 is a plan view of the indexer robot
  • FIG. 6 is a side view and a plan view of a main robot
  • FIG. 7 is a diagram for explaining a configuration of a top surface cleaning unit
  • FIG. 8 is a diagram for explaining a configuration of a substrate platform used for a substrate processing apparatus according to a second embodiment
  • FIG. 9 is a diagram showing an example of a case where a spacing between support plates that are vertically adjacent to each other is changed in the substrate platform of FIG. 8 ;
  • FIG. 10 is a side view of an indexer robot used for the substrate processing apparatus according to the second embodiment.
  • FIG. 11 is a plan view showing a substrate processing apparatus described in JP 10-150090 A.
  • a substrate refers to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk or the like.
  • FIG. 1( a ) is a plan view of a substrate processing apparatus according to a first embodiment of the present invention and FIG. 1( b ) is a schematic side view in which the substrate processing apparatus of FIG. 1( a ) is seen from the direction of the arrow X.
  • FIG. 2 is a diagram schematically showing a cross section of FIG. 1 ( a ) taken along the line A-A.
  • the substrate processing apparatus 100 includes an indexer block 10 and a processing block 11 .
  • the indexer block 10 and the processing block 11 are provided in parallel to each other.
  • the indexer block 10 is provided with a plurality of carrier platforms 40 , an indexer robot IR and a controller 4 .
  • a carrier C that stores a plurality of substrates W in multiple stages is placed on each of the carrier platforms 40 . Details of the carrier C will be described later.
  • the indexer robot IR is constructed so that it can move in the direction of the arrow U ( FIG. 1 ( a )), rotate around a vertical axis and move up and down.
  • Hands IRH 1 , IRH 2 for transferring and receiving the substrate W are provided one above the other in the indexer robot IR.
  • the hands IRH 1 , IRH 2 hold a peripheral portion of the lower surface of the substrate W and an outer circumference of the substrate W. Details of the indexer robot IR will be described later.
  • the controller 4 consists of a computer or the like including a CPU (central processing unit) and controls each component in the substrate processing apparatus 100 .
  • a plurality of top surface cleaning units SS and a main robot MR are provided in the processing block 11 .
  • one side of the processing block 11 has a vertical stack of the four top surface cleaning units SS, and the other side of the processing block 11 has a vertical stack of another four top surface cleaning units SS.
  • the main robot MR is provided between the plurality of top surface cleaning units SS positioned on the one side of the processing bock 11 and the plurality of top surface cleaning units SS positioned on the other side of the processing block 11 .
  • the main robot MR is constructed so that it can rotate around a vertical axis and move up and down.
  • hands MRH 1 , MRH 2 for transferring and receiving the substrate W are provided one above the other in the main robot MR.
  • the hands MRH 1 , MRH 2 hold the peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W. Details of the main robot MR will be described later.
  • substrate platforms PASS 1 , PASS 2 for transferring and receiving the substrate W between the indexer robot IR and the main robot MR are provided one above the other between the indexer block 10 and the processing block 11 .
  • the plurality of substrates W can be placed in multiple stages in each of the substrate platforms PASS 1 , PASS 2 .
  • the upper substrate platform PASS 1 is used for transporting the substrate W from the processing block 11 to the indexer block 10
  • the lower substrate platform PASS 2 is used for transporting the substrate W from the indexer block 10 to the processing block 11 . Details of the substrate platforms PASS 1 , PASS 2 will be described later.
  • the indexer robot IR takes the two unprocessed substrates W out of one of the carriers C placed on the carrier platforms 40 by using the two hands IRH 1 , IRH 2 that are provided one above the other.
  • the indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and places the two unprocessed substrates W on the substrate platform PASS 2 .
  • the main robot MR moves up and down while rotating around the vertical axis, and receives the substrate W from the substrate platform PASS 2 by using the lower hand MRH 2 .
  • the main robot MR takes the substrate W after top surface cleaning processing out of any of the top surface cleaning units SS by the upper hand MRH 1 , and carries the substrate W held by the hand MRH 2 into the top surface cleaning unit SS.
  • the main robot MR again moves up and down while rotating around the vertical axis, and places the substrate W held by the upper hand MRH 1 on the substrate platform PASS 1 .
  • the indexer robot IR takes the two processed substrates W out of the substrate platform PASS 1 by using the two hands IRH 1 , IRH 2 .
  • the indexer robot IR rotates around the vertical axis while moving in the direction of the arrow U, and stores the two processed substrates W in one of the carriers C placed on the carrier platforms 40 .
  • FIG. 3 is a vertical sectional view for explaining configurations of the carrier C and the substrate platform PASS 1 , PASS 2 of FIG. 1 .
  • FIG. 3 ( a ) shows a vertical sectional view of the carrier C of FIG. 1 .
  • the carrier C has a box shape with one face being open (an opening C 1 ).
  • a plurality of substrate storing grooves C 2 extending along a horizontal direction are formed inside the carrier C extending in a vertical direction.
  • Each of the substrate storing grooves C 2 stores the substrate W.
  • a spacing GA between the substrate storing grooves C 2 that are vertically adjacent to each other is set to be approximately 10 mm, for example. In this case, the substrates W are stored at the spacing of about 10 mm in the carrier C. Reducing the spacing GA between the substrate storing grooves C 2 allows a larger number of substrates W to be stored in the carrier C.
  • FIG. 3 ( b ) shows a vertical sectional view of the substrate platform PASS 1 , PASS 2 of FIG. 1 .
  • the substrate platform PASS 1 , PASS 2 has the configuration in which a plurality of support plates 51 are stacked in multiple stages by a plurality of support posts 52 .
  • a plurality of support pins PN that support the lower surface of the substrate W are provided on the support plate 51 .
  • the substrate W is temporarily placed on the support pins PN of the substrate platform PASS 1 , PASS 2 when the substrate W is transferred and received between the indexer robot IR and the main robot MR.
  • a spacing GC between the support plates 51 that are vertically adjacent to each other is approximately 45 mm, for example.
  • the substrates W are placed at the spacing of about 45 mm in the substrate platform PASS 1 , PASS 2 .
  • the spacing GC between the support plates 51 that are vertically adjacent to each other in the substrate platform PASS 1 , PASS 2 is set to be larger than the spacing GA between the substrate storing grooves C 2 of the carrier C.
  • Optical sensors that detect the presence or absence of the substrate W are provided per support plate 51 in the substrate platform PASS 1 , PASS 2 . This allows determination as to whether or not the substrate W is placed in the substrate platform PASS 1 , PASS 2 to be made.
  • FIG. 4 is a side view of the indexer robot IR
  • FIG. 5 is a plan view of the indexer robot IR.
  • the indexer robot IR includes a transport rail 210 , a moving support post 220 , a lifting supporter 230 and a base 240 .
  • the transport rail 210 is attached to the floor face of the indexer block 10 .
  • the moving support post 220 extending in the vertical direction is attached on the transport rail 210 .
  • One end of the lifting supporter 230 extending in the horizontal direction is attached to the moving support post 220 .
  • the base 240 is attached to the other end of the lifting supporter 230 .
  • a horizontally moving mechanism 211 consisting of, for example, a set of a ball screw and a motor and the like is provided in the transport rail 210 extending in the horizontal direction.
  • the moving support post 220 is moved along the transport rail 210 in the horizontal direction (the arrow MV 1 ) by the horizontally moving mechanism 211 .
  • a vertically moving mechanism 221 consisting of, for example, a ball screw, a motor and the like is provided in the moving support post 220 .
  • the lifting supporter 230 is moved along the moving support post 220 in the vertical direction (the arrow MV 2 ) by the vertically moving mechanism 221 . Accordingly, the base 240 can move in the horizontal and vertical directions.
  • a rotation stage 250 is provided on the base 240 so as to be rotatable with respect to the base 240 .
  • the rotation stage 250 is rotated by a rotating mechanism 241 (the arrow MV 3 ) provided inside the base 240 .
  • the rotating mechanism 241 is constituted by, for example, a motor.
  • a lifting shaft 260 is provided so as to stand at the rotation stage 250 .
  • a hand IRH 1 is connected to the upper surface of the rotation stage 250 by a multi-joint type arm IAM 1
  • a hand IRH 2 is connected to the upper surface of the rotation stage 250 by the lifting shaft 260 and a multi-joint type arm IAM 2 .
  • the multi-joint type arms IAM 1 , IAM 2 are independently driven by driving mechanisms that are not shown, respectively, and advance and withdraw the respective hands IRH 1 , IRH 2 in the horizontal direction (the arrow MV 4 ) while maintaining them in fixed postures.
  • the hand IRH 1 is provided to have a certain height with respect to the rotation stage 250 and positioned above the hand IRH 2 .
  • a ball screw 261 is provided inside the lifting shaft 260 .
  • the ball screw 261 is connected to a motor 251 that is provided inside the rotation stage 250 .
  • the operation of the motor 251 rotates the ball screw 261 , so that the multi-joint type arm IAM 2 attached to the lifting shaft 260 is moved in the vertical direction (the arrow MV 5 ).
  • a difference in height between the hand IRH 1 and the hand IRH 2 is changed within a predetermined range.
  • the difference in height between the hand IRH 1 and the hand IRH 2 when the multi-joint type arm IAM 2 is moved to the highest position of the lifting shaft 260 is shown by an arrow HG 1 .
  • the difference in height between the hand IRH 1 and the hand IRH 2 when the multi-joint type arm IAM 2 is moved to the lowest position of the lifting shaft 260 is shown by an arrow HG 2 .
  • the difference in height between the hand IRH 1 and the hand IRH 2 shown by the arrow HG 1 is set to be equal to the spacing GA between the substrate storing grooves C 2 of the carrier C of FIG. 3 ( a ), for example, and the difference in height between the hand IRH 1 and the hand IRH 2 shown by the arrow HG 2 is set to be equal to the spacing GC between the support plates 51 of the substrate platform PASS 1 , PASS 2 of FIG. 3 ( b ), for example.
  • the hands IRH 1 , IRH 2 have the same shape, and are formed to be substantially U-shaped, respectively.
  • the hand IRH 1 has two claw portions IRH 1 extending substantially in parallel to each other, and the hand IRH 2 has two claw portions IH 12 extending substantially in parallel to each other.
  • a plurality of support pins 271 are attached to the upper surfaces of the hands IRH 1 , IRH 2 , respectively.
  • the respective four support pins 271 are attached on the upper surfaces of the hands IRH 1 , IRH 2 , at substantially equal distances from each other along the outer circumference of the substrate W placed thereon. The peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W are held by the four support pins 271 .
  • Each of the hands IRH 1 , IRH 2 has a thickness of approximately 4 mm, for example.
  • the hands IRH 1 , IRH 2 can be inserted between the plurality of substrates W stored in the carrier C of FIG. 3 ( a ).
  • the operations of the horizontally moving mechanism 211 , the vertically moving mechanism 221 , the rotating mechanism 241 and the motor 251 , mentioned above, are controlled by the controller 4 of FIG. 1 .
  • FIG. 6 ( a ) is a side view of the main robot MR
  • FIG. 6 ( b ) is a plan view of the main robot MR.
  • the main robot MR includes a base 21 , to which a moving portion 22 is attached so as to be able to vertically move and rotate with respect to the base 21 .
  • the hands MRH 1 and MRH 2 are connected to the moving portion 22 by the multi-joint type arms AM 1 and AM 2 , respectively.
  • the moving portion 22 is rotated around the vertical axis by a rotation driving mechanism 26 that is provided in the base 21 while being moved up and down by a lifting mechanism 25 that is provided in the base 21 .
  • the multi-joint type arms AM 1 , AM 2 are independently driven by driving mechanisms that are not shown, respectively, and advance and withdraw the respective hands MRH 1 , MRH 2 in the horizontal direction while maintaining them in fixed postures.
  • the hands MRH 1 , MRH 2 are provided to have certain heights with respect to the moving portion 22 , respectively, and the hand MRH 1 is positioned above the hand MRH 2 .
  • a difference M 1 ( FIG. 6 ( a )) in height between the hand MRH 1 and the hand MRH 2 is maintained constant.
  • the difference M 1 in height between the hand MRH 1 and the hand MRH 2 may be set to be substantially equal to, for example, the spacing GC between the support plates 51 that are vertically adjacent to each other in the substrate platform PASS 1 , PASS 2 shown in FIG. 3 ( b ).
  • the hands MRH 1 , MRH 2 have the same shape, and are formed to be substantially U-shaped, respectively.
  • the hand MRH 1 has two claw portions H 11 extending substantially in parallel to each other, and the hand MRH 2 has two claw portions H 12 extending substantially in parallel to each other.
  • a plurality of support pins 23 are attached on the upper surfaces of the hands MRH 1 , MRH 2 , respectively.
  • the respective four support pins 23 are attached on the upper surfaces of the hands MRH 1 , MRH 2 , at substantially equal distances from each other along the outer circumference of the substrate W placed thereon. The peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W are held by the four support pins 23 .
  • Each of the hands MRH 1 , MRH 2 is formed to be thicker than the hands IRH 1 , IRH 2 of the indexer robot IR, and has a thickness of approximately 7 mm, for example. Accordingly, the hands MRH 1 , MRH 2 have high rigidity compared to the hands IRH 1 , IRH 2 of the indexer robot IR.
  • heights of the support pins PN are set so that the hands MRH 1 , MRH 2 of the main robot MR can be easily inserted between the support plate 51 and the substrate W in the substrate platform PASS 1 , PASS 2 of FIG. 3 ( b ).
  • FIG. 7 is a diagram for explaining a configuration of the top surface cleaning unit SS.
  • the cleaning processing of the substrate W by using a brush hereinafter referred to as the scrub cleaning processing
  • the top surface cleaning unit SS includes a spin chuck 61 for rotating the substrate W around a vertical axis passing through the center of the substrate W while holding the substrate W horizontally.
  • the spin chuck 61 is secured to the upper end of a rotation shaft 63 that is rotated by a chuck rotation driving mechanism 62 .
  • the substrate W with the top surface thereof directed upward is carried into the top surface cleaning unit SS.
  • the scrub cleaning processing is performed, the back surface of the substrate W is held by suction on the spin chuck 61 .
  • a motor 64 is provided outside the spin chuck 61 .
  • a rotation shaft 65 is connected to the motor 64 .
  • An arm 66 is coupled to the rotation shaft 65 so as to extend in the horizontal direction, and a substantially cylindrical brush cleaner 70 is provided on the tip of the arm 66 .
  • a liquid discharge nozzle 71 is provided above the spin chuck 61 for supplying a cleaning liquid or a rinse liquid (pure water) onto the top surface of the substrate W held by the spin chuck 61 .
  • the liquid discharge nozzle 71 is connected to a supply pipe 72 , and the cleaning liquid and the rinse liquid are selectively supplied to the liquid discharge nozzle 71 through this supply pipe 72 .
  • the motor 64 rotates the rotation shaft 65 .
  • the arm 66 turns within a horizontal plane, and the brush cleaner 70 moves between a position outside the substrate W and a position above the center of the substrate W, centered around the rotation shaft 65 .
  • a lifting mechanism (not shown) is provided in the motor 64 . The lifting mechanism lifts and lowers the brush cleaner 70 in the position outside the substrate W and the position above the center of the substrate W by lifting and lowering the rotation shaft 65 .
  • the substrate W with the top surface thereof directed upward is rotated by the spin chuck 61 .
  • the cleaning liquid or the rinse liquid is supplied to the liquid discharge nozzle 71 through the supply pipe 72 .
  • the cleaning liquid or the rinse liquid is supplied onto the top surface of the substrate W that rotates.
  • the brush cleaner 70 is swung and moved up and down by the rotation shaft 65 and the arm 66 . Accordingly, the scrub cleaning processing is performed on the top surface of the substrate W.
  • the suction-type spin chuck 61 is used in the top surface cleaning unit SS, the peripheral portion and the outer circumference of the substrate W can be simultaneously cleaned.
  • the difference in height between the hand IRH 1 and the hand IRH 2 in the indexer robot IR can be changed within a predetermined range.
  • the indexer robot IR can adjust the difference in height between the hand IRH 1 and the hand IRH 2 to be small (approximately 10 mm, for example), corresponding to the spacing GA between the substrate storing grooves C 2 that are vertically adjacent to each other when taking the two substrates W out of the carrier C.
  • the indexer robot IR can insert the hand IRH 1 and the hand IRH 2 between the plurality of substrates W stored in the carrier C, and easily take out the two substrates W stored vertically adjacent to each other.
  • the indexer robot IR can adjust the difference in height between the hand IRH 1 and the hand IRH 2 to be larger (approximately 45 mm, for example), corresponding to the spacing GC between the support plates 51 that are vertically adjacent to each other during the transport of the taken out two substrates W to the substrate platform PASS 2 .
  • the indexer robot IR can easily place the two substrates W held by the hand IRH 1 and the hand IRH 2 on the support plates 51 that are vertically adjacent to each other in the substrate platform PASS 2 .
  • the indexer robot IR can similarly adjust the difference in height between the hand IRH 1 and the hand IRH 2 when transporting the two substrates W from the substrate platform PASS 1 to the carrier C.
  • the two substrates W at a time can be transported between the carrier C and the substrate platforms PASS 1 , PASS 2 .
  • This allows the transport time of the substrate W between the carrier C and the substrate platforms PASS 1 , PASS 2 to be reduced and the improvement of the throughput in the substrate processing apparatus 100 to be achieved.
  • the multi-joint type arms IAM 1 , IAM 2 are independently driven by the driving mechanisms that are not shown, respectively, in the indexer robot IR, it is also possible that the substrates W are transported one by one between the carrier C and the substrate platforms PASS 1 , PASS 2 .
  • the present invention is not limited to this and the top surface of the substrate W can be cleaned by using a chemical liquid.
  • the main robot MR uses the hand MRH 2 for holding the unprocessed substrate W and uses the hand MRH 1 for holding the substrate W subjected to the scrub cleaning processing
  • the hand MRH 1 may be used for holding the unprocessed substrate W
  • the hand MRH 2 may be used for holding the substrate W subjected to the scrub cleaning processing.
  • the present invention is not limited to this and linear-type transport robots that advance and withdraw their hands by linearly sliding them with respect to the substrate W may be used.
  • the main robot MR may transfer and receive the two substrates W to and from the substrate platforms PASS 1 , PASS 2 .
  • the main robot MR can insert the hand MRH 1 and the hand MRH 2 between the support plates 51 that are adjacent to each other in the substrate platform PASS 1 , PASS 2 , and easily take out the two substrates W placed vertically adjacent to each other. Furthermore, the two substrates W held by the hand MRH 1 and the hand MRH 2 can be placed on the support plates 51 that are adjacent to each other in the substrate platform PASS 1 , PASS 2 .
  • the transport time of the substrate W between the substrate platforms PASS 1 , PASS 2 and the top surface cleaning unit SS can be reduced.
  • the number of the hands provided in the indexer robot IR is not limited as long as it is not less than two.
  • the number of the hands may be three or four, for example.
  • a configuration of a substrate processing apparatus according to a second embodiment is different from the configuration of the substrate processing apparatus 100 according to the first embodiment in the following points.
  • a substrate platform used in the substrate processing apparatus according to the present embodiment has the following configuration.
  • FIG. 8 is a diagram for explaining the configuration of the substrate platform used for the substrate processing apparatus according to the second embodiment.
  • FIG. 8 ( a ) shows a plan view of the substrate platform PASS 1 , PASS 2 of the present embodiment
  • FIG. 8 ( b ) shows a cross section of FIG. 8 ( a ) taken along the line B-B.
  • the substrate platform PASS 1 , PASS 2 of the present embodiment includes a plurality of sets of support plates 51 P arranged so as to face each other within the horizontal plane.
  • the sets of support plates 51 P are stacked in multiple stages by a plurality of cylinders 510 .
  • the plurality of support pins PN that support the lower surface of the substrate W are provided on each set of support plates 51 P.
  • the hands IRH 1 , IRH 2 of the indexer robot IR and the hands MRH 1 , MRH 2 of the main robot MR can be inserted between the sets of two support plates 51 P. Accordingly, the substrate W transported by the indexer robot IR and the main robot MR is temporarily placed on the plurality of support pins PN provided on each set of support plates 51 P.
  • An air cylinder, an oil cylinder or the like is used as the above-mentioned cylinder 510 , for example.
  • Each of the cylinders 510 is connected to a cylinder synchronization mechanism 500 .
  • the cylinder synchronization mechanism 500 is controlled by the controller 4 and supplies a fluid (for example, air, oil or the like) to the plurality of cylinders 510 while synchronizing the plurality of cylinders 510 .
  • each of the cylinders 510 performs a telescoping operation in the vertical direction depending on a supply amount of the fluid (for example, air, oil or the like) from the cylinder synchronization mechanism 500 . Accordingly, the spacing GC between the support plates 51 P that are vertically adjacent to each other is changed within a predetermined range in the substrate platforms PASS 1 , PASS 2 of the present embodiment.
  • the fluid for example, air, oil or the like
  • FIG. 9 is a diagram showing an example of the case where the spacing GC between the support plates 51 P that are vertically adjacent to each other is changed in the substrate platform PASS 1 , PASS 2 of FIG. 8 .
  • the spacing GC between the support plates 51 P that are vertically adjacent to each other is changed from a maximum spacing HG 3 shown by the dotted line to a minimum spacing HG 4 shown by the solid line, for example.
  • the maximum spacing HG 3 between the support plates 51 P is set to be substantially equal to the difference M 1 in height between the hand MRH 1 and the hand MRH 2 of the main robot MR of FIG. 6 ( a ), for example.
  • the minimum spacing HG 4 between the support plates 51 P is set to be approximately 10 mm, for example, so as to be equal to, for example, the spacing GA of FIG. 3 ( a ).
  • the maximum spacing HG 3 between the support plates 51 P may be set to be approximately 45 mm so as to be equal to, for example, the spacing GC of FIG. 3 ( b ).
  • optical sensors that detect the presence or absence of the substrate W are provided corresponding to each set of support plates 51 P.
  • FIG. 10 is a side view of the indexer robot IR used for the substrate processing apparatus according to the second embodiment. As shown in FIG. 10 , the motor 251 , the lifting shaft 260 and the ball screw 261 of FIG. 4 are not provided in the indexer robot IR of the present embodiment.
  • the hand IRH 1 is connected to the upper surface of the rotation stage 250 by the multi-joint type arm IAM 1 and the hand IRH 2 is connected to the upper surface of the rotation stage 250 by the multi-joint type arm IAM 2 in the indexer robot IR of the present embodiment.
  • the multi-joint type arms IAM 1 , IAM 2 do not move in the vertical direction to the rotation stage 250 , and are provided to have certain heights from the rotation stage 250 .
  • a difference N 1 ( FIG. 10 ) in height between the hand IRH 1 and the hand IRH 2 is maintained constant.
  • the difference N 1 in height between the hand IRH 1 and the hand IRH 2 is set to be, for example, approximately 10 mm so as to be equal to, for example, the spacing GA of FIG. 3 ( a ).
  • the difference N 1 ( FIG. 10 ) in height between the hand IRH 1 and the hand IRH 2 in the indexer robot IR is set to be equal to the spacing GA between the substrate storing grooves C 2 that are vertically adjacent to each other in the carrier C.
  • the indexer robot IR can insert the hand IRH 1 and the hand IRH 2 between the plurality of substrates W stored in the carrier C for taking the two substrates W out of the carrier C.
  • the two substrates W stored vertically adjacent to each other are easily taken out of the carrier C.
  • the spacing GC between the support plates 51 P that are vertically adjacent to each other in the substrate platform PASS 1 , PASS 2 is changed within the predetermined range.
  • the spacing GC between the support plates 51 that are vertically adjacent to each other can be adjusted to be the minimum spacing HG 4 in the substrate platforms PASS 1 , PASS 2 when the two substrates W are transported by the indexer robot IR, for example.
  • the minimum spacing HG 4 between the support plates 51 P is equal to the spacing GA between the substrate storing grooves C 2 that are vertically adjacent to each other in the carrier C. Accordingly, the indexer robot IR can easily place the two substrates W held by the hand IRH 1 and the hand IRH 2 on the support plates 51 P in the substrate platform PASS 2 since the difference N 1 in height between the hand IRH 1 and the hand IRH 2 is equal to the spacing GA between the substrate storing grooves C 2 .
  • the indexer robot IR can easily take out the two substrates W placed on the support plates 51 P in the substrate platform PASS 1 by using the hand IRH 1 and the hand IRH 2 .
  • the two substrates W at a time can be transported between the carrier C and the substrate platforms PASS 1 , PASS 2 . This allows the improvement of the throughput in the substrate processing apparatus 100 to be achieved.
  • the spacing GC between the support plates 51 that are vertically adjacent to each other can be adjusted to be the maximum spacing HG 3 in the substrate platforms PASS 1 , PASS 2 when the substrates W are transported to the top surface cleaning unit SS by the main robot MR, for example.
  • the maximum spacing HG 3 between the support plates 51 P is sufficiently larger than the spacing GA between the substrate storing grooves C 2 that are vertically adjacent to each other in the carrier C, and is substantially equal to the difference M 1 in height between the hand MRH 1 and the hand MRH 2 of the main robot MR.
  • the hands MRH 1 , MRH 2 of the main robot MR having larger thicknesses than those of the hands IRH 1 , IRH 2 of the indexer robot IR are easily inserted between the plurality of substrates W placed on the support plates 51 P in the substrate platforms PASS 1 , PASS 2 .
  • the carrier C is an example of a storing container
  • the support plates 51 , 51 P are examples of a storing shelf
  • the substrate platforms PASS 1 , PASS 2 are examples of a substrate platform shelf and an interface
  • the indexer robot IR is an example of a substrate transporting apparatus and a first substrate transporting apparatus.
  • the transport rail 210 , the horizontally moving mechanism 211 , the moving support post 220 , the vertically moving mechanism 221 , the lifting supporter 230 , the base 240 , the rotating mechanism 241 , the rotation stage 250 and the multi-joint type arms IAM 1 , IAM 2 are examples of a driving mechanism.
  • the hand IRH 1 is an example of a first substrate holder
  • the hand IRH 2 is an example of a second substrate holder
  • the motor 251 , the lifting shaft 260 and the ball screw 261 as well as the cylinder synchronization mechanism 500 and the cylinder 510 are examples of an adjusting mechanism.
  • the hand MRH 1 is an example of a third holder
  • the hand MRH 2 is an example of a fourth holder
  • the main robot MR is an example of a second substrate transporting apparatus
  • the support pin PN is an example of a support member
  • the processing block 11 is an example of a processing region
  • the indexer robot 10 is an example of a carrying in and out region
  • the carrier platform 40 is an example of a container platform
  • the top surface cleaning unit SS is an example of a processing unit and a cleaning processing unit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
US11/958,816 2006-12-27 2007-12-18 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus Abandoned US20080159832A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/886,063 US8500915B2 (en) 2006-12-27 2010-09-20 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-352000 2006-12-27
JP2006352000A JP4744427B2 (ja) 2006-12-27 2006-12-27 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/886,063 Division US8500915B2 (en) 2006-12-27 2010-09-20 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus

Publications (1)

Publication Number Publication Date
US20080159832A1 true US20080159832A1 (en) 2008-07-03

Family

ID=39584217

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/958,816 Abandoned US20080159832A1 (en) 2006-12-27 2007-12-18 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus
US12/886,063 Active US8500915B2 (en) 2006-12-27 2010-09-20 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/886,063 Active US8500915B2 (en) 2006-12-27 2010-09-20 Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus

Country Status (5)

Country Link
US (2) US20080159832A1 (zh)
JP (1) JP4744427B2 (zh)
KR (1) KR100927302B1 (zh)
CN (2) CN101872736B (zh)
TW (1) TWI455234B (zh)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100247274A1 (en) * 2009-03-24 2010-09-30 Tokyo Electron Limited Substrate exchanging mechanism and method of exchanging substrates
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method
CN101853799A (zh) * 2009-03-30 2010-10-06 株式会社Ihi 基板升降移送装置及基板处理移送系统
US20110153062A1 (en) * 2008-08-28 2011-06-23 Semes Co., Ltd. Substrate-processing apparatus and method of transferring substrate in the same
US20110308691A1 (en) * 2009-02-19 2011-12-22 Jonas & Redmann Automationstechnik Gmbh Method and device for forming a packet-like back-to-back wafer batch
US20120249990A1 (en) * 2011-03-29 2012-10-04 Kazuhiro Nishimura Substrate processing apparatus
US20140003890A1 (en) * 2010-12-24 2014-01-02 Kawasaki Jukogyo Kabushiki Kaisha Transfer robot, its substrate transfer method and substrate transfer relay device
US20140348622A1 (en) * 2011-12-15 2014-11-27 Tazmo Co., Ltd. Wafer transport apparatus
US20150016936A1 (en) * 2013-07-09 2015-01-15 Tokyo Electron Limited Substrate transfer method and device
US20150125240A1 (en) * 2013-11-01 2015-05-07 Varian Semiconductor Equipment Associates, Inc. Dynamic pitch substrate lift
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
US9472432B1 (en) 2008-03-24 2016-10-18 Novellus Systems, Inc. Dedicated hot and cold end effectors for improved throughput
US11004713B2 (en) * 2019-05-16 2021-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Robot arm device and method for transferring wafer
US20220088793A1 (en) * 2020-09-18 2022-03-24 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US20220234948A1 (en) * 2021-01-22 2022-07-28 Samsung Display Co., Ltd. Substrate loading cassette and method of processing substrate using the same
US12036662B2 (en) * 2020-09-18 2024-07-16 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5102717B2 (ja) * 2008-08-13 2012-12-19 大日本スクリーン製造株式会社 基板搬送装置およびこれを備えた基板処理装置
KR100989851B1 (ko) * 2008-08-28 2010-10-29 세메스 주식회사 이송부재의 속도 조절 방법, 이를 이용한 기판 이송 방법 및 기판 처리 장치
JP5000627B2 (ja) 2008-11-27 2012-08-15 東京エレクトロン株式会社 基板処理システム
JP2010192685A (ja) * 2009-02-18 2010-09-02 Tokyo Electron Ltd 基板搬送装置及び基板処理システム
JP4707749B2 (ja) * 2009-04-01 2011-06-22 東京エレクトロン株式会社 基板交換方法及び基板処理装置
TWI451519B (zh) * 2010-10-19 2014-09-01 Au Optronics Corp 基板運輸處理方法
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
KR102392186B1 (ko) * 2011-03-11 2022-04-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
JP2013098288A (ja) * 2011-10-31 2013-05-20 Disco Abrasive Syst Ltd 搬送装置
JP5283770B2 (ja) * 2012-05-15 2013-09-04 大日本スクリーン製造株式会社 基板搬送装置およびこれを備えた基板処理装置
JP5993625B2 (ja) * 2012-06-15 2016-09-14 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、および、基板処理装置
JP6347333B2 (ja) * 2015-06-01 2018-06-27 株式会社ダイフク 平面保管設備における入出庫装置の制御方法
CN107552467A (zh) * 2017-09-24 2018-01-09 安徽海拓志永智能装备股份有限公司 适用于玻璃清洗的上线系统
TWI668790B (zh) * 2018-04-30 2019-08-11 漢民科技股份有限公司 用於半導體製程之基板傳送機構及成膜裝置
US11427412B2 (en) * 2019-05-09 2022-08-30 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate conveying method
KR102150230B1 (ko) * 2020-04-07 2020-08-31 (주)볼타오토메이션 진공로봇을 이용한 이송장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0870033A (ja) * 1994-08-26 1996-03-12 Kokusai Electric Co Ltd 半導体製造装置のウェーハ移載機
KR100310249B1 (ko) * 1995-08-05 2001-12-17 엔도 마코토 기판처리장치
JP3522469B2 (ja) * 1996-11-18 2004-04-26 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JPH11130254A (ja) * 1997-10-24 1999-05-18 Sharp Corp 基板搬送カセット
JP3589839B2 (ja) * 1997-10-24 2004-11-17 シャープ株式会社 ピッチ変換を伴う基板搬送装置
JP3974985B2 (ja) 1997-12-02 2007-09-12 大日本スクリーン製造株式会社 基板搬送装置
JP3888608B2 (ja) * 2001-04-25 2007-03-07 東京エレクトロン株式会社 基板両面処理装置
JP4283559B2 (ja) * 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP2005072559A (ja) * 2003-08-05 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5154008B2 (ja) * 2004-11-10 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
KR20060077960A (ko) * 2004-12-30 2006-07-05 삼성전자주식회사 레티클 수납 카세트

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989346A (en) * 1995-12-12 1999-11-23 Tokyo Electron Limited Semiconductor processing apparatus

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9472432B1 (en) 2008-03-24 2016-10-18 Novellus Systems, Inc. Dedicated hot and cold end effectors for improved throughput
US20110153062A1 (en) * 2008-08-28 2011-06-23 Semes Co., Ltd. Substrate-processing apparatus and method of transferring substrate in the same
US8615323B2 (en) 2008-08-28 2013-12-24 Semes Co., Ltd. Substrate-processing apparatus and method of transferring substrate in the same
US20110308691A1 (en) * 2009-02-19 2011-12-22 Jonas & Redmann Automationstechnik Gmbh Method and device for forming a packet-like back-to-back wafer batch
US20100247274A1 (en) * 2009-03-24 2010-09-30 Tokyo Electron Limited Substrate exchanging mechanism and method of exchanging substrates
US20100249993A1 (en) * 2009-03-30 2010-09-30 Ichiro Mitsuyoshi Substrate processing apparatus and substrate transport method
CN101853799A (zh) * 2009-03-30 2010-10-06 株式会社Ihi 基板升降移送装置及基板处理移送系统
US8504194B2 (en) 2009-03-30 2013-08-06 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate transport method
US9368381B2 (en) * 2010-12-24 2016-06-14 Kawasaki Jukogyo Kabushiki Kaisha Transfer robot, its substrate transfer method and substrate transfer relay device
US20140003890A1 (en) * 2010-12-24 2014-01-02 Kawasaki Jukogyo Kabushiki Kaisha Transfer robot, its substrate transfer method and substrate transfer relay device
US10216099B2 (en) 2011-03-29 2019-02-26 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
US20120249990A1 (en) * 2011-03-29 2012-10-04 Kazuhiro Nishimura Substrate processing apparatus
US9494877B2 (en) * 2011-03-29 2016-11-15 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
US20140348622A1 (en) * 2011-12-15 2014-11-27 Tazmo Co., Ltd. Wafer transport apparatus
US9245783B2 (en) 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
US9589822B2 (en) * 2013-07-09 2017-03-07 Tokyo Electron Limited Substrate transfer method with a second positioning step
US20150016936A1 (en) * 2013-07-09 2015-01-15 Tokyo Electron Limited Substrate transfer method and device
US20150125240A1 (en) * 2013-11-01 2015-05-07 Varian Semiconductor Equipment Associates, Inc. Dynamic pitch substrate lift
US9214369B2 (en) * 2013-11-01 2015-12-15 Varian Semiconductor Equipment Associates, Inc. Dynamic pitch substrate lift
US11004713B2 (en) * 2019-05-16 2021-05-11 Taiwan Semiconductor Manufacturing Co., Ltd. Robot arm device and method for transferring wafer
US11837484B2 (en) 2019-05-16 2023-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Robot arm device and method for transferring wafer
US20220088793A1 (en) * 2020-09-18 2022-03-24 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US12036662B2 (en) * 2020-09-18 2024-07-16 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US20220234948A1 (en) * 2021-01-22 2022-07-28 Samsung Display Co., Ltd. Substrate loading cassette and method of processing substrate using the same
US11993537B2 (en) * 2021-01-22 2024-05-28 Samsung Display Co., Ltd. Substrate loading cassette and method of processing substrate using the same

Also Published As

Publication number Publication date
CN101872736A (zh) 2010-10-27
TWI455234B (zh) 2014-10-01
KR20080061290A (ko) 2008-07-02
CN101221918B (zh) 2010-07-14
CN101872736B (zh) 2012-10-24
US8500915B2 (en) 2013-08-06
CN101221918A (zh) 2008-07-16
JP2008166370A (ja) 2008-07-17
JP4744427B2 (ja) 2011-08-10
TW200836289A (en) 2008-09-01
US20110008148A1 (en) 2011-01-13
KR100927302B1 (ko) 2009-11-18

Similar Documents

Publication Publication Date Title
US8500915B2 (en) Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus
US8919358B2 (en) Substrate processing apparatus
US8757180B2 (en) Substrate processing apparatus
US7878213B2 (en) Substrate processing apparatus
US9050635B2 (en) Substrate processing apparatus
JP5068738B2 (ja) 基板処理装置およびその方法
US6755603B2 (en) Apparatus for and method of transporting substrates to be processed
US20080156361A1 (en) Substrate processing apparatus
JP4743939B2 (ja) 入力モジュールを使用して半導体基板を搬送する方法および装置
US8303232B2 (en) Substrate processing system
US20080170931A1 (en) Substrate processing apparatus and substrate processing method
US20120148378A1 (en) Substrate transfer apparatus, substrate process system, and substrate transfer method
US20090053020A1 (en) Substrate processing apparatus
US20090087285A1 (en) Substrate processing apparatus
KR20210037563A (ko) 기판 처리 장치
JP3446158B2 (ja) 基板搬送処理装置
KR102453865B1 (ko) 기판 처리 장치
JP4869097B2 (ja) 基板処理装置
KR100466296B1 (ko) 이송 로봇 및 이를 이용한 기판 정렬 시스템
KR20050057012A (ko) 프로세싱 툴에 기판을 공급하는 방법 및 장치
KR100587993B1 (ko) 기판반송로봇 및 그것을 갖는 기판 세정 시스템
US11069546B2 (en) Substrate processing system
JP4004260B2 (ja) 基板処理装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: DAINIPPON SCREEN MFG. CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MITSUYOSHI, ICHIRO;REEL/FRAME:020267/0265

Effective date: 20071120

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION