CN101211888A - 布线基板及其制造方法以及半导体装置 - Google Patents

布线基板及其制造方法以及半导体装置 Download PDF

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Publication number
CN101211888A
CN101211888A CNA2007103011690A CN200710301169A CN101211888A CN 101211888 A CN101211888 A CN 101211888A CN A2007103011690 A CNA2007103011690 A CN A2007103011690A CN 200710301169 A CN200710301169 A CN 200710301169A CN 101211888 A CN101211888 A CN 101211888A
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CN
China
Prior art keywords
wiring
wiring board
unit
resin portion
wiring plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007103011690A
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English (en)
Chinese (zh)
Inventor
荒井直
小林敏男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101211888A publication Critical patent/CN101211888A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNA2007103011690A 2006-12-27 2007-12-26 布线基板及其制造方法以及半导体装置 Pending CN101211888A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006351000 2006-12-27
JP2006351000A JP4926692B2 (ja) 2006-12-27 2006-12-27 配線基板及びその製造方法と半導体装置

Publications (1)

Publication Number Publication Date
CN101211888A true CN101211888A (zh) 2008-07-02

Family

ID=39581929

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007103011690A Pending CN101211888A (zh) 2006-12-27 2007-12-26 布线基板及其制造方法以及半导体装置

Country Status (4)

Country Link
US (1) US7901986B2 (https=)
JP (1) JP4926692B2 (https=)
CN (1) CN101211888A (https=)
TW (1) TW200832673A (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796897A (zh) * 2014-09-11 2017-05-31 索尼公司 电子装置、部件安装基板和电子设备
CN111933590A (zh) * 2020-09-11 2020-11-13 甬矽电子(宁波)股份有限公司 封装结构和封装结构制作方法
CN113270327A (zh) * 2021-07-20 2021-08-17 珠海越亚半导体股份有限公司 主被动器件垂直叠层嵌埋封装结构及其制作方法
CN116825746A (zh) * 2023-07-03 2023-09-29 武汉新芯集成电路制造有限公司 半导体封装结构及其制造方法

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US20090277670A1 (en) * 2008-05-10 2009-11-12 Booth Jr Roger A High Density Printed Circuit Board Interconnect and Method of Assembly
KR20100037300A (ko) * 2008-10-01 2010-04-09 삼성전자주식회사 내장형 인터포저를 갖는 반도체장치의 형성방법
WO2011033601A1 (ja) * 2009-09-21 2011-03-24 株式会社 東芝 ３次元集積回路製造方法、及び装置
US8592973B2 (en) * 2009-10-16 2013-11-26 Stats Chippac Ltd. Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof
JP5352437B2 (ja) 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8581394B2 (en) 2010-06-21 2013-11-12 Samsung Electro-Mechanics Co., Ltd Semiconductor package module and electric circuit assembly with the same
US9059187B2 (en) * 2010-09-30 2015-06-16 Ibiden Co., Ltd. Electronic component having encapsulated wiring board and method for manufacturing the same
KR101719636B1 (ko) * 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
US20120292777A1 (en) * 2011-05-18 2012-11-22 Lotz Jonathan P Backside Power Delivery Using Die Stacking
US20130154106A1 (en) 2011-12-14 2013-06-20 Broadcom Corporation Stacked Packaging Using Reconstituted Wafers
US9548251B2 (en) 2012-01-12 2017-01-17 Broadcom Corporation Semiconductor interposer having a cavity for intra-interposer die
US20130187284A1 (en) 2012-01-24 2013-07-25 Broadcom Corporation Low Cost and High Performance Flip Chip Package
US8587132B2 (en) 2012-02-21 2013-11-19 Broadcom Corporation Semiconductor package including an organic substrate and interposer having through-semiconductor vias
US8558395B2 (en) 2012-02-21 2013-10-15 Broadcom Corporation Organic interface substrate having interposer with through-semiconductor vias
DE102012202826A1 (de) * 2012-02-24 2013-08-29 Robert Bosch Gmbh Stromsensor zur Befestigung an einer Stromschiene
US8749072B2 (en) 2012-02-24 2014-06-10 Broadcom Corporation Semiconductor package with integrated selectively conductive film interposer
US8872321B2 (en) 2012-02-24 2014-10-28 Broadcom Corporation Semiconductor packages with integrated heat spreaders
US9275976B2 (en) 2012-02-24 2016-03-01 Broadcom Corporation System-in-package with integrated socket
US8928128B2 (en) 2012-02-27 2015-01-06 Broadcom Corporation Semiconductor package with integrated electromagnetic shielding
US9368458B2 (en) 2013-07-10 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die-on-interposer assembly with dam structure and method of manufacturing the same
WO2015029951A1 (ja) 2013-08-26 2015-03-05 日立金属株式会社 実装基板用ウエハ、多層セラミックス基板、実装基板、チップモジュール、及び実装基板用ウエハの製造方法
TWI493195B (zh) * 2013-11-04 2015-07-21 Via Tech Inc 探針卡
US12068231B2 (en) * 2014-05-24 2024-08-20 Broadpak Corporation 3D integrations and methods of making thereof
TWI566305B (zh) * 2014-10-29 2017-01-11 巨擘科技股份有限公司 製造三維積體電路的方法
US9971970B1 (en) * 2015-04-27 2018-05-15 Rigetti & Co, Inc. Microwave integrated quantum circuits with VIAS and methods for making the same
US9859202B2 (en) * 2015-06-24 2018-01-02 Dyi-chung Hu Spacer connector
EP3376537A4 (en) * 2015-11-11 2019-04-17 KYOCERA Corporation PACKAGING FOR AN ELECTRONIC COMPONENT
FR3044864B1 (fr) * 2015-12-02 2018-01-12 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage d'un tel dispositif electrique
US10181447B2 (en) 2017-04-21 2019-01-15 Invensas Corporation 3D-interconnect
US10687419B2 (en) 2017-06-13 2020-06-16 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US11281608B2 (en) * 2017-12-11 2022-03-22 Micron Technology, Inc. Translation system for finer grain memory architectures
KR102661196B1 (ko) * 2019-11-08 2024-04-29 삼성전자 주식회사 적층형 기판을 포함하는 전자 장치
CN113053758A (zh) 2019-12-27 2021-06-29 台湾积体电路制造股份有限公司 半导体器件的制造方法
US11515173B2 (en) * 2019-12-27 2022-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices and methods of manufacturing
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796897A (zh) * 2014-09-11 2017-05-31 索尼公司 电子装置、部件安装基板和电子设备
CN111933590A (zh) * 2020-09-11 2020-11-13 甬矽电子(宁波)股份有限公司 封装结构和封装结构制作方法
CN113270327A (zh) * 2021-07-20 2021-08-17 珠海越亚半导体股份有限公司 主被动器件垂直叠层嵌埋封装结构及其制作方法
CN116825746A (zh) * 2023-07-03 2023-09-29 武汉新芯集成电路制造有限公司 半导体封装结构及其制造方法

Also Published As

Publication number Publication date
JP4926692B2 (ja) 2012-05-09
US7901986B2 (en) 2011-03-08
US20080155820A1 (en) 2008-07-03
TW200832673A (en) 2008-08-01
JP2008166327A (ja) 2008-07-17

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Open date: 20080702