CN101146838B - 一种包覆的细颗粒及其制备方法和导电细颗粒 - Google Patents

一种包覆的细颗粒及其制备方法和导电细颗粒 Download PDF

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Publication number
CN101146838B
CN101146838B CN2006800090393A CN200680009039A CN101146838B CN 101146838 B CN101146838 B CN 101146838B CN 2006800090393 A CN2006800090393 A CN 2006800090393A CN 200680009039 A CN200680009039 A CN 200680009039A CN 101146838 B CN101146838 B CN 101146838B
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fine particle
mentioned
particle
coating
covering layer
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CN101146838A (zh
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山下毅
串野光雄
黑泽真实子
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Nippon Shokubai Co Ltd
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Nippon Shokubai Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F18/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09D161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09D161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C09D161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Non-Insulated Conductors (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)
CN2006800090393A 2005-03-24 2006-03-23 一种包覆的细颗粒及其制备方法和导电细颗粒 Active CN101146838B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP086718/2005 2005-03-24
JP2005086718 2005-03-24
PCT/JP2006/306597 WO2006101263A1 (en) 2005-03-24 2006-03-23 Coated fine particle and their manufacturing method, and conductive fine particle

Publications (2)

Publication Number Publication Date
CN101146838A CN101146838A (zh) 2008-03-19
CN101146838B true CN101146838B (zh) 2010-12-01

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CN2006800090393A Active CN101146838B (zh) 2005-03-24 2006-03-23 一种包覆的细颗粒及其制备方法和导电细颗粒

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Country Link
JP (1) JP4950662B2 (ja)
KR (1) KR100893550B1 (ja)
CN (1) CN101146838B (ja)
TW (1) TWI356425B (ja)
WO (1) WO2006101263A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4528178B2 (ja) * 2005-03-28 2010-08-18 積水化成品工業株式会社 表面被覆架橋ポリマー粒子の製造方法
JP2007217486A (ja) * 2006-02-15 2007-08-30 Arakawa Chem Ind Co Ltd ポリマー微粒子の製造方法およびポリマー微粒子
JP2008218714A (ja) * 2007-03-05 2008-09-18 Bridgestone Corp 光透過性電磁波シールド材及びその製造方法、並びに貴金属の極薄膜を有する微粒子及びその製造方法
CN100500700C (zh) * 2007-12-13 2009-06-17 厦门大学 一种粒径单分散的核壳结构导电聚合物微球的制备方法
CN101205266B (zh) * 2007-12-13 2010-06-02 厦门大学 一种球壳结构的导电聚合物纳米材料的制备方法
KR20160137589A (ko) * 2008-09-25 2016-11-30 우베 에쿠시모 가부시키가이샤 금속 피막 형성 방법 및 도전성 입자
TWI403414B (zh) * 2009-07-31 2013-08-01 Cheng Kou Bin 機能性複合無機漿料組成物、其發泡複合體及其製法
JP5419625B2 (ja) * 2009-10-06 2014-02-19 株式会社日本触媒 コアシェル型粒子、光拡散剤、および光拡散媒体
JP5700194B2 (ja) * 2010-07-01 2015-04-15 住友ベークライト株式会社 扁平状導電性粒子の製造方法
JP5657971B2 (ja) * 2010-09-22 2015-01-21 株式会社日本触媒 アミノ樹脂架橋粒子の製造方法
JP6046414B2 (ja) * 2011-08-29 2016-12-14 株式会社日本触媒 樹脂微粒子、トナー用添加剤、および静電荷像現像用トナー
CN102558410B (zh) * 2012-01-20 2013-10-30 齐齐哈尔大学 自组装三维有序聚苯乙烯胶晶的制备方法
CN104684970B (zh) * 2013-01-24 2018-01-30 积水化学工业株式会社 基材粒子、导电性粒子、导电材料及连接结构体
JP6505391B2 (ja) * 2014-08-18 2019-04-24 積水化学工業株式会社 電子部品装置及びセラミックパッケージ用接合材料
KR102676014B1 (ko) * 2018-11-07 2024-06-17 니폰 가가쿠 고교 가부시키가이샤 피복 입자 및 그것을 함유하는 도전성 재료, 그리고 피복 입자의 제조 방법
CN109342392B (zh) * 2018-11-09 2021-09-17 中国科学院烟台海岸带研究所 一种以聚苯乙烯为包裹壳层材料的表面增强拉曼散射纳米探针及其制备方法
CN111813263B (zh) * 2020-07-10 2022-09-20 业成科技（成都）有限公司 热塑成形的修复粒子及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1423154A (zh) * 1993-11-17 2003-06-11 日本触媒株式会社 有机－无机复合物颗粒及其生产方法

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* Cited by examiner, † Cited by third party
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JPH0617374B2 (ja) 1984-10-11 1994-03-09 株式会社日本触媒 水性樹脂分散液の製造方法
JPS6391130A (ja) 1986-10-06 1988-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd 反応性界面活性剤
DE10160328A1 (de) * 2001-12-07 2003-06-18 Merck Patent Gmbh Mikropartikuläres Material
JP4022177B2 (ja) * 2002-06-19 2007-12-12 株式会社日本触媒 有機質無機質複合体微粒子およびその用途

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Publication number Priority date Publication date Assignee Title
CN1423154A (zh) * 1993-11-17 2003-06-11 日本触媒株式会社 有机－无机复合物颗粒及其生产方法

Non-Patent Citations (5)

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JP昭61-90731A 1986.05.08
JP昭62-215605A 1987.09.22
JP昭62-223275A 1987.10.01
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JP特开2004-75996A 2004.03.11

Also Published As

Publication number Publication date
TWI356425B (en) 2012-01-11
TW200641914A (en) 2006-12-01
WO2006101263A1 (en) 2006-09-28
CN101146838A (zh) 2008-03-19
KR20070121769A (ko) 2007-12-27
JP4950662B2 (ja) 2012-06-13
JP2008533212A (ja) 2008-08-21
KR100893550B1 (ko) 2009-04-17

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