CN101122616B - 探针组合体 - Google Patents

探针组合体 Download PDF

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Publication number
CN101122616B
CN101122616B CN200710143125XA CN200710143125A CN101122616B CN 101122616 B CN101122616 B CN 101122616B CN 200710143125X A CN200710143125X A CN 200710143125XA CN 200710143125 A CN200710143125 A CN 200710143125A CN 101122616 B CN101122616 B CN 101122616B
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CN
China
Prior art keywords
probe assembly
probe
vertical
conductive
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200710143125XA
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English (en)
Chinese (zh)
Other versions
CN101122616A (zh
Inventor
木本军生
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Individual
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Individual
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Publication date
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Publication of CN101122616A publication Critical patent/CN101122616A/zh
Application granted granted Critical
Publication of CN101122616B publication Critical patent/CN101122616B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN200710143125XA 2006-08-07 2007-08-06 探针组合体 Expired - Fee Related CN101122616B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-239544 2006-08-07
JP2006239544 2006-08-07
JP2006239544A JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立

Publications (2)

Publication Number Publication Date
CN101122616A CN101122616A (zh) 2008-02-13
CN101122616B true CN101122616B (zh) 2012-07-04

Family

ID=39028522

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710143125XA Expired - Fee Related CN101122616B (zh) 2006-08-07 2007-08-06 探针组合体

Country Status (5)

Country Link
US (1) US7423441B2 (https=)
JP (1) JP5077735B2 (https=)
KR (1) KR101332390B1 (https=)
CN (1) CN101122616B (https=)
TW (1) TW200809215A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397696B (zh) * 2006-02-19 2013-06-01 木本軍生 Probe assembly
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
CN102207435B (zh) * 2011-03-25 2013-06-26 宾伟雄 消除牵引力测试装置水平偏移的方法及其牵引力测试装置
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
KR101999720B1 (ko) * 2012-11-20 2019-07-16 삼성디스플레이 주식회사 기판 정전기 검사 장치 및 기판 제조 방법
CN103245808A (zh) * 2013-05-22 2013-08-14 太仓华众金属制品有限公司 一种悬臂式探针
CN106249006A (zh) * 2016-09-30 2016-12-21 乐依文半导体(东莞)有限公司 测试夹具及其单尾回形探针
CN107525953A (zh) * 2017-09-25 2017-12-29 惠科股份有限公司 一种探针装置
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1670540A (zh) * 2004-03-16 2005-09-21 木本军生 电气信号连接装置、及使用此装置之探针组装体及探测器装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
US4116523A (en) * 1976-01-23 1978-09-26 James M. Foster High frequency probe
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
TW434407B (en) * 1999-04-07 2001-05-16 Nihon Micronics Kk Probe card
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP2002296295A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体の接触子保持構造
US6489795B1 (en) * 2001-05-18 2002-12-03 Anthony G. Klele High-frequency test probe assembly for microcircuits and associated methods
KR100664393B1 (ko) * 2003-05-13 2007-01-04 가부시키가이샤 니혼 마이크로닉스 통전 시험용 프로브
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI398640B (zh) * 2005-09-19 2013-06-11 木本軍生 Contact assembly and its LSI wafer inspection device
TWI397696B (zh) * 2006-02-19 2013-06-01 木本軍生 Probe assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1670540A (zh) * 2004-03-16 2005-09-21 木本军生 电气信号连接装置、及使用此装置之探针组装体及探测器装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2000-338133A 2000.12.08
JP特开2004-274010A 2004.09.30

Also Published As

Publication number Publication date
TW200809215A (en) 2008-02-16
JP5077735B2 (ja) 2012-11-21
KR101332390B1 (ko) 2013-11-22
CN101122616A (zh) 2008-02-13
KR20080013791A (ko) 2008-02-13
TWI339266B (https=) 2011-03-21
JP2008039754A (ja) 2008-02-21
US7423441B2 (en) 2008-09-09
US20080030216A1 (en) 2008-02-07

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Granted publication date: 20120704

Termination date: 20150806

EXPY Termination of patent right or utility model