TWI339266B - - Google Patents

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Publication number
TWI339266B
TWI339266B TW096125294A TW96125294A TWI339266B TW I339266 B TWI339266 B TW I339266B TW 096125294 A TW096125294 A TW 096125294A TW 96125294 A TW96125294 A TW 96125294A TW I339266 B TWI339266 B TW I339266B
Authority
TW
Taiwan
Prior art keywords
probe
probe assembly
vertical
conductive
parallel
Prior art date
Application number
TW096125294A
Other languages
English (en)
Chinese (zh)
Other versions
TW200809215A (en
Inventor
Gunsei Kimoto
Original Assignee
Gunsei Kimoto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gunsei Kimoto filed Critical Gunsei Kimoto
Publication of TW200809215A publication Critical patent/TW200809215A/zh
Application granted granted Critical
Publication of TWI339266B publication Critical patent/TWI339266B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096125294A 2006-08-07 2007-07-11 Contactor assembly TW200809215A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006239544A JP5077735B2 (ja) 2006-08-07 2006-08-07 複数梁合成型接触子組立

Publications (2)

Publication Number Publication Date
TW200809215A TW200809215A (en) 2008-02-16
TWI339266B true TWI339266B (https=) 2011-03-21

Family

ID=39028522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096125294A TW200809215A (en) 2006-08-07 2007-07-11 Contactor assembly

Country Status (5)

Country Link
US (1) US7423441B2 (https=)
JP (1) JP5077735B2 (https=)
KR (1) KR101332390B1 (https=)
CN (1) CN101122616B (https=)
TW (1) TW200809215A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397696B (zh) * 2006-02-19 2013-06-01 木本軍生 Probe assembly
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
CN102207435B (zh) * 2011-03-25 2013-06-26 宾伟雄 消除牵引力测试装置水平偏移的方法及其牵引力测试装置
US20130233099A1 (en) * 2012-03-08 2013-09-12 Gunsei Kimoto Probe assembly
KR101999720B1 (ko) * 2012-11-20 2019-07-16 삼성디스플레이 주식회사 기판 정전기 검사 장치 및 기판 제조 방법
CN103245808A (zh) * 2013-05-22 2013-08-14 太仓华众金属制品有限公司 一种悬臂式探针
CN106249006A (zh) * 2016-09-30 2016-12-21 乐依文半导体(东莞)有限公司 测试夹具及其单尾回形探针
CN107525953A (zh) * 2017-09-25 2017-12-29 惠科股份有限公司 一种探针装置
JP7292921B2 (ja) * 2019-03-29 2023-06-19 株式会社日本マイクロニクス 多ピン構造プローブ体及びプローブカード

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611128A (en) * 1968-07-26 1971-10-05 Hitachi Ltd Probe header for testing integrated circuits
US4116523A (en) * 1976-01-23 1978-09-26 James M. Foster High frequency probe
US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JPH075196A (ja) * 1993-06-18 1995-01-10 Fujitsu Autom Ltd プローブヘッドとプロービング方法
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
TW434407B (en) * 1999-04-07 2001-05-16 Nihon Micronics Kk Probe card
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP2002296295A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体の接触子保持構造
US6489795B1 (en) * 2001-05-18 2002-12-03 Anthony G. Klele High-frequency test probe assembly for microcircuits and associated methods
KR100664393B1 (ko) * 2003-05-13 2007-01-04 가부시키가이샤 니혼 마이크로닉스 통전 시험용 프로브
JP4721099B2 (ja) * 2004-03-16 2011-07-13 軍生 木本 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4521611B2 (ja) * 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI398640B (zh) * 2005-09-19 2013-06-11 木本軍生 Contact assembly and its LSI wafer inspection device
TWI397696B (zh) * 2006-02-19 2013-06-01 木本軍生 Probe assembly

Also Published As

Publication number Publication date
TW200809215A (en) 2008-02-16
CN101122616B (zh) 2012-07-04
JP5077735B2 (ja) 2012-11-21
KR101332390B1 (ko) 2013-11-22
CN101122616A (zh) 2008-02-13
KR20080013791A (ko) 2008-02-13
JP2008039754A (ja) 2008-02-21
US7423441B2 (en) 2008-09-09
US20080030216A1 (en) 2008-02-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees