CN101035645B - 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法 - Google Patents

通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法 Download PDF

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Publication number
CN101035645B
CN101035645B CN2005800304241A CN200580030424A CN101035645B CN 101035645 B CN101035645 B CN 101035645B CN 2005800304241 A CN2005800304241 A CN 2005800304241A CN 200580030424 A CN200580030424 A CN 200580030424A CN 101035645 B CN101035645 B CN 101035645B
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target
laser
entry
segment
perimeter
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Expired - Fee Related
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Chinese (zh)
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CN101035645A (zh
Inventor
R·M·派耶索普
W·雷
H·马楚莫托
G·西门森
D·A·瓦特
M·A·昂若斯
W·J·乔丹斯
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Sampling And Sample Adjustment (AREA)
CN2005800304241A 2004-08-04 2005-08-01 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法 Expired - Fee Related CN101035645B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/912,525 2004-08-04
US10/912,525 US7259354B2 (en) 2004-08-04 2004-08-04 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
PCT/US2005/027584 WO2006017583A2 (en) 2004-08-04 2005-08-01 Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories

Publications (2)

Publication Number Publication Date
CN101035645A CN101035645A (zh) 2007-09-12
CN101035645B true CN101035645B (zh) 2010-12-15

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CN2005800304241A Expired - Fee Related CN101035645B (zh) 2004-08-04 2005-08-01 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法

Country Status (8)

Country Link
US (1) US7259354B2 (https=)
JP (4) JP2008509006A (https=)
KR (1) KR101242143B1 (https=)
CN (1) CN101035645B (https=)
DE (1) DE112005001893T5 (https=)
GB (1) GB2431371A (https=)
TW (1) TWI353279B (https=)
WO (1) WO2006017583A2 (https=)

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JP2013091102A (ja) 2013-05-16
KR101242143B1 (ko) 2013-03-12
TWI353279B (en) 2011-12-01
US7259354B2 (en) 2007-08-21
JP5581303B2 (ja) 2014-08-27
US20060027544A1 (en) 2006-02-09
GB2431371A (en) 2007-04-25
JP2016153142A (ja) 2016-08-25
TW200610605A (en) 2006-04-01
WO2006017583A3 (en) 2006-03-30
JP6014465B2 (ja) 2016-10-25
JP2012066308A (ja) 2012-04-05
KR20070039582A (ko) 2007-04-12
DE112005001893T5 (de) 2007-09-06
JP2008509006A (ja) 2008-03-27
WO2006017583A2 (en) 2006-02-16
GB0701804D0 (en) 2007-03-14
CN101035645A (zh) 2007-09-12

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