CN100552934C - 具有减轻应力集中结构的印刷电路板及其半导体芯片封装 - Google Patents
具有减轻应力集中结构的印刷电路板及其半导体芯片封装 Download PDFInfo
- Publication number
- CN100552934C CN100552934C CNB2005100825448A CN200510082544A CN100552934C CN 100552934 C CN100552934 C CN 100552934C CN B2005100825448 A CNB2005100825448 A CN B2005100825448A CN 200510082544 A CN200510082544 A CN 200510082544A CN 100552934 C CN100552934 C CN 100552934C
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- circuit board
- printed circuit
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
参数 | 允许的范围 |
引线节距(P) | 25μm~35μm |
引线厚度(T) | 6μm~10μm |
引线宽度(W) | 12μm~18μm |
引线蚀刻系数(E.f) | 2~4 |
凸起长度(BL) | 80μm~120μm |
PI带厚度 | 30μm~50μm |
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040057141 | 2004-07-22 | ||
KR1020040057141A KR101070897B1 (ko) | 2004-07-22 | 2004-07-22 | 응력 집중을 완화하는 구조를 가지는 회로기판 및 이를구비한 반도체 소자 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1725486A CN1725486A (zh) | 2006-01-25 |
CN100552934C true CN100552934C (zh) | 2009-10-21 |
Family
ID=35655925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100825448A Expired - Fee Related CN100552934C (zh) | 2004-07-22 | 2005-07-08 | 具有减轻应力集中结构的印刷电路板及其半导体芯片封装 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7804693B2 (zh) |
KR (1) | KR101070897B1 (zh) |
CN (1) | CN100552934C (zh) |
TW (1) | TWI367696B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100582742B1 (ko) * | 2004-12-21 | 2006-05-22 | 인티그런트 테크놀로지즈(주) | 기준 전류 발생 회로 |
CN101098590A (zh) * | 2006-06-30 | 2008-01-02 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
DE102007046428A1 (de) * | 2007-09-28 | 2009-04-09 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Anschlussfolie und elektrische Anschlussverbindung |
DE102008042335A1 (de) * | 2008-09-24 | 2010-03-25 | Robert Bosch Gmbh | Gehäuse für eine elektrische Schaltung |
KR20120018894A (ko) * | 2010-08-24 | 2012-03-06 | 삼성전자주식회사 | 패키지 기판 및 이를 갖는 플립 칩 패키지 |
US9082759B2 (en) * | 2012-11-27 | 2015-07-14 | Infineon Technologies Ag | Semiconductor packages and methods of formation thereof |
US9397027B1 (en) * | 2014-05-07 | 2016-07-19 | Maxim Integrated Products, Inc. | Sacrificial pad on semiconductor package device and method |
US9257374B1 (en) * | 2014-12-24 | 2016-02-09 | Nxp B.V. | Thin shrink outline package (TSOP) |
TWI748668B (zh) * | 2020-09-29 | 2021-12-01 | 頎邦科技股份有限公司 | 軟性電路板之佈線結構 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020163068A1 (en) * | 1999-12-24 | 2002-11-07 | Junichi Asada | Semiconductor device |
US6559524B2 (en) * | 2000-10-13 | 2003-05-06 | Sharp Kabushiki Kaisha | COF-use tape carrier and COF-structured semiconductor device using the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
JP2652107B2 (ja) | 1992-06-18 | 1997-09-10 | セイコーエプソン株式会社 | 電気的接続構造 |
JP3501316B2 (ja) * | 1995-06-16 | 2004-03-02 | 株式会社ルネサステクノロジ | 半導体装置及びその製造方法 |
JPH09129686A (ja) * | 1995-11-06 | 1997-05-16 | Toshiba Microelectron Corp | テープキャリヤ及びその実装構造 |
KR100574278B1 (ko) | 1998-11-27 | 2006-09-22 | 삼성전자주식회사 | 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈 |
JP3566869B2 (ja) | 1998-12-16 | 2004-09-15 | 株式会社ルネサステクノロジ | 半導体装置及び半導体装置の製造方法 |
JP2000188366A (ja) * | 1998-12-24 | 2000-07-04 | Hitachi Ltd | 半導体装置 |
JP3683434B2 (ja) | 1999-04-16 | 2005-08-17 | 富士通株式会社 | 半導体装置 |
JP3215686B2 (ja) * | 1999-08-25 | 2001-10-09 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JP3420153B2 (ja) * | 2000-01-24 | 2003-06-23 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
TW462120B (en) | 2000-11-10 | 2001-11-01 | Siliconware Precision Industries Co Ltd | Tape carrier type semiconductor package structure |
US6707135B2 (en) * | 2000-11-28 | 2004-03-16 | Texas Instruments Incorporated | Semiconductor leadframe for staggered board attach |
US8129222B2 (en) * | 2002-11-27 | 2012-03-06 | United Test And Assembly Test Center Ltd. | High density chip scale leadframe package and method of manufacturing the package |
JP3840180B2 (ja) * | 2002-12-26 | 2006-11-01 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
JP4162583B2 (ja) * | 2003-12-19 | 2008-10-08 | 三井金属鉱業株式会社 | プリント配線板および半導体装置 |
JP4485460B2 (ja) * | 2004-12-16 | 2010-06-23 | 三井金属鉱業株式会社 | フレキシブルプリント配線板 |
-
2004
- 2004-07-22 KR KR1020040057141A patent/KR101070897B1/ko active IP Right Grant
-
2005
- 2005-06-27 US US11/167,858 patent/US7804693B2/en not_active Expired - Fee Related
- 2005-07-08 TW TW094123283A patent/TWI367696B/zh not_active IP Right Cessation
- 2005-07-08 CN CNB2005100825448A patent/CN100552934C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020163068A1 (en) * | 1999-12-24 | 2002-11-07 | Junichi Asada | Semiconductor device |
US6559524B2 (en) * | 2000-10-13 | 2003-05-06 | Sharp Kabushiki Kaisha | COF-use tape carrier and COF-structured semiconductor device using the same |
Also Published As
Publication number | Publication date |
---|---|
US20060016619A1 (en) | 2006-01-26 |
KR101070897B1 (ko) | 2011-10-06 |
KR20060007775A (ko) | 2006-01-26 |
TW200605739A (en) | 2006-02-01 |
CN1725486A (zh) | 2006-01-25 |
US7804693B2 (en) | 2010-09-28 |
TWI367696B (en) | 2012-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: MDS CO., LTD. Free format text: FORMER OWNER: SAMSUNG TECHWIN CO., LTD. Effective date: 20140722 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140722 Address after: Gyeongnam, South Korea Patentee after: MDS Co., Ltd. Address before: Gyeongnam, South Korea Patentee before: Samsung TECHWIN Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091021 Termination date: 20140708 |
|
EXPY | Termination of patent right or utility model |