CN100524733C - 半导体功率模块 - Google Patents
半导体功率模块 Download PDFInfo
- Publication number
- CN100524733C CN100524733C CN200410096536.4A CN200410096536A CN100524733C CN 100524733 C CN100524733 C CN 100524733C CN 200410096536 A CN200410096536 A CN 200410096536A CN 100524733 C CN100524733 C CN 100524733C
- Authority
- CN
- China
- Prior art keywords
- power
- power module
- module
- terminal
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 238000006243 chemical reaction Methods 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002131 composite material Substances 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inverter Devices (AREA)
- Power Conversion In General (AREA)
- Dc-Dc Converters (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003424421 | 2003-12-22 | ||
JP2003424421A JP4423462B2 (ja) | 2003-12-22 | 2003-12-22 | 半導体パワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1638116A CN1638116A (zh) | 2005-07-13 |
CN100524733C true CN100524733C (zh) | 2009-08-05 |
Family
ID=34675393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200410096536.4A Expired - Fee Related CN100524733C (zh) | 2003-12-22 | 2004-11-30 | 半导体功率模块 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7425757B2 (zh) |
JP (1) | JP4423462B2 (zh) |
CN (1) | CN100524733C (zh) |
DE (1) | DE102004059353B4 (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4492454B2 (ja) * | 2005-06-20 | 2010-06-30 | 富士電機システムズ株式会社 | パワー半導体モジュール |
JP4494397B2 (ja) * | 2006-12-26 | 2010-06-30 | 三菱電機株式会社 | 誘導加熱装置 |
US8581423B2 (en) * | 2008-11-17 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Double solid metal pad with reduced area |
JP5449341B2 (ja) | 2009-05-26 | 2014-03-19 | 三菱電機株式会社 | パワー半導体装置の包装装置 |
US8878454B2 (en) * | 2009-12-09 | 2014-11-04 | Tyco Electronics Corporation | Solid state lighting system |
JP5569141B2 (ja) * | 2010-05-18 | 2014-08-13 | 富士電機株式会社 | 電力変換装置、ディスクリート型の制御型半導体素子及び制御型半導体素子モジュール |
DE102010063220B4 (de) | 2010-12-16 | 2018-09-20 | Semikron Elektronik Gmbh & Co. Kg | Halbleiterschaltungsanordnung |
JP2014531752A (ja) | 2011-09-11 | 2014-11-27 | クリー インコーポレイテッドCree Inc. | 改善したレイアウトを有するトランジスタを備える高電流密度電力モジュール |
US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
CN103780102B (zh) * | 2014-01-24 | 2017-06-06 | 嘉兴斯达微电子有限公司 | 一种智能半导体功率模块 |
US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
CN106712458B (zh) * | 2015-07-30 | 2018-12-14 | 台达电子工业股份有限公司 | 内建emi电路的变频器结构 |
KR101679385B1 (ko) | 2015-10-14 | 2016-11-28 | 주식회사 에코세미텍 | 전력용 반도체 모듈 제조방법 및 이를 이용하여 제조된 전력용 반도체 모듈 |
JP6096994B1 (ja) * | 2016-07-28 | 2017-03-15 | 株式会社小松製作所 | パワー半導体モジュールの端子接続構造 |
US10256178B2 (en) | 2016-09-06 | 2019-04-09 | Fairchild Semiconductor Corporation | Vertical and horizontal circuit assemblies |
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
JP1585831S (zh) * | 2017-01-05 | 2017-09-11 | ||
US10319670B2 (en) | 2017-10-20 | 2019-06-11 | Semiconductor Components Industries, Llc | Package including multiple semiconductor devices |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US10553517B2 (en) | 2018-01-18 | 2020-02-04 | Semiconductor Components Industries, Llc | High power module semiconductor package with multiple submodules |
US10438877B1 (en) | 2018-03-13 | 2019-10-08 | Semiconductor Components Industries, Llc | Multi-chip packages with stabilized die pads |
US10991670B2 (en) | 2018-09-28 | 2021-04-27 | Semiconductor Components Industries, Llc | Semiconductor device assemblies including spacer with embedded semiconductor die |
US11075137B2 (en) | 2018-05-02 | 2021-07-27 | Semiconductor Components Industries, Llc | High power module package structures |
US11824048B2 (en) | 2018-09-20 | 2023-11-21 | Mitsubishi Electric Corporation | Power semiconductor module and composite module having peripheral structures surrounding parts of the module main body |
USD916039S1 (en) * | 2020-03-20 | 2021-04-13 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2851268B2 (ja) * | 1987-06-10 | 1999-01-27 | 株式会社東芝 | ノイズ低減方法 |
JP2530051B2 (ja) * | 1990-07-24 | 1996-09-04 | 株式会社東芝 | 半導体集積回路装置 |
JP2854757B2 (ja) * | 1992-06-17 | 1999-02-03 | 三菱電機株式会社 | 半導体パワーモジュール |
US5880403A (en) * | 1994-04-01 | 1999-03-09 | Space Electronics, Inc. | Radiation shielding of three dimensional multi-chip modules |
US5825042A (en) * | 1993-06-18 | 1998-10-20 | Space Electronics, Inc. | Radiation shielding of plastic integrated circuits |
FI117224B (fi) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
JP3480811B2 (ja) * | 1997-07-15 | 2003-12-22 | 株式会社東芝 | 電圧駆動型電力用半導体装置 |
JP3734122B2 (ja) | 1997-10-22 | 2006-01-11 | 株式会社デンソー | 三相インバータ回路モジュール |
JP2991172B2 (ja) * | 1997-10-24 | 1999-12-20 | 日本電気株式会社 | 半導体装置 |
JPH11238844A (ja) | 1998-02-19 | 1999-08-31 | Toshiba Corp | 半導体回路素子用リアクトル及びそれを用いた半導体回路素子 |
JP2000058740A (ja) * | 1998-07-31 | 2000-02-25 | Kankyo Denji Gijutsu Kenkyusho:Kk | コモンモードフィルタ素子内蔵半導体デバイス |
JP2001160605A (ja) | 1999-12-01 | 2001-06-12 | Toyota Autom Loom Works Ltd | 半導体パッケージ基板の電磁シールド構造、半導体パッケージ基板及び電磁シールドキャップ |
JP4138192B2 (ja) | 1999-12-27 | 2008-08-20 | 三菱電機株式会社 | 半導体スイッチ装置 |
US6758607B2 (en) * | 2001-03-09 | 2004-07-06 | Sumitomo Electric Industries, Ltd. | Optical communication module and optical communication module product |
JP3865601B2 (ja) * | 2001-06-12 | 2007-01-10 | 日東電工株式会社 | 電磁波抑制体シート |
JP4605946B2 (ja) | 2001-07-02 | 2011-01-05 | 京セラ株式会社 | 半導体素子収納用パッケージ |
JP2004207432A (ja) * | 2002-12-25 | 2004-07-22 | Mitsubishi Electric Corp | パワーモジュール |
JP4154325B2 (ja) * | 2003-12-19 | 2008-09-24 | 株式会社日立産機システム | 電気回路モジュール |
JP4492454B2 (ja) * | 2005-06-20 | 2010-06-30 | 富士電機システムズ株式会社 | パワー半導体モジュール |
-
2003
- 2003-12-22 JP JP2003424421A patent/JP4423462B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-30 CN CN200410096536.4A patent/CN100524733C/zh not_active Expired - Fee Related
- 2004-12-09 DE DE102004059353A patent/DE102004059353B4/de not_active Expired - Fee Related
- 2004-12-20 US US11/017,187 patent/US7425757B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4423462B2 (ja) | 2010-03-03 |
DE102004059353A1 (de) | 2005-07-14 |
DE102004059353B4 (de) | 2010-11-11 |
US20050156251A1 (en) | 2005-07-21 |
CN1638116A (zh) | 2005-07-13 |
JP2005183776A (ja) | 2005-07-07 |
US7425757B2 (en) | 2008-09-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI MOTOR SYSTEM CO., LTD. Free format text: FORMER OWNER: FUJI MOTOR ELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20100511 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100511 Address after: Tokyo, Japan Patentee after: Fuji Electric Systems Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Fuji Electronic Device Technol |
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C56 | Change in the name or address of the patentee |
Owner name: FUJI ELECTRIC CO., LTD. Free format text: FORMER NAME: FUJI ELECTRIC SYSTEMS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Japan's Kawasaki City Patentee after: Fuji Electric Co., Ltd. Address before: Tokyo, Japan Patentee before: Fuji Electric Systems Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20181130 |
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CF01 | Termination of patent right due to non-payment of annual fee |