CN100524707C - 用于印刷电路组件的底部填充膜 - Google Patents

用于印刷电路组件的底部填充膜 Download PDF

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Publication number
CN100524707C
CN100524707C CNB2004800028872A CN200480002887A CN100524707C CN 100524707 C CN100524707 C CN 100524707C CN B2004800028872 A CNB2004800028872 A CN B2004800028872A CN 200480002887 A CN200480002887 A CN 200480002887A CN 100524707 C CN100524707 C CN 100524707C
Authority
CN
China
Prior art keywords
printed circuit
circuit board
pcb
encapsulation
bottom filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004800028872A
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English (en)
Chinese (zh)
Other versions
CN1742369A (zh
Inventor
贾尼丝·当维尔
凯瑟琳·德瓦涅
纳迪娅·亚拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN1742369A publication Critical patent/CN1742369A/zh
Application granted granted Critical
Publication of CN100524707C publication Critical patent/CN100524707C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H10W72/348—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CNB2004800028872A 2003-01-31 2004-01-30 用于印刷电路组件的底部填充膜 Expired - Fee Related CN100524707C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/356,419 2003-01-31
US10/356,419 US7265994B2 (en) 2003-01-31 2003-01-31 Underfill film for printed wiring assemblies

Publications (2)

Publication Number Publication Date
CN1742369A CN1742369A (zh) 2006-03-01
CN100524707C true CN100524707C (zh) 2009-08-05

Family

ID=32770803

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800028872A Expired - Fee Related CN100524707C (zh) 2003-01-31 2004-01-30 用于印刷电路组件的底部填充膜

Country Status (5)

Country Link
US (1) US7265994B2 (enExample)
JP (1) JP4724652B2 (enExample)
KR (1) KR101054239B1 (enExample)
CN (1) CN100524707C (enExample)
WO (1) WO2004071140A2 (enExample)

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KR20020053326A (ko) * 2000-12-27 2002-07-05 이일희 폐옥을 이용한 건축자재 제조방법
KR100475540B1 (ko) * 2002-05-27 2005-03-10 양원모 건축물 마감재의 제조 방법
US6978540B2 (en) 2003-05-23 2005-12-27 National Starch And Chemical Investment Holding Corporation Method for pre-applied thermoplastic reinforcement of electronic components
US7004375B2 (en) 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
CN100499101C (zh) * 2006-08-02 2009-06-10 南茂科技股份有限公司 具有延长引脚的薄膜覆晶封装构造
US7889959B2 (en) * 2008-02-07 2011-02-15 Lockheed Martin Corporation Composite material for cable floatation jacket
JP2010103336A (ja) * 2008-10-24 2010-05-06 Fujitsu Ltd 基板ユニット、情報処理装置及び基板ユニットの製造方法
US20110115099A1 (en) * 2009-05-14 2011-05-19 Vertical Circuits, Inc. Flip-chip underfill
KR20110024291A (ko) * 2009-09-01 2011-03-09 삼성전기주식회사 회로 기판, 반도체 패키지 및 회로 기판의 제조 방법
US20110067910A1 (en) * 2009-09-18 2011-03-24 International Business Machines Corporation Component securing system and associated method
US10429929B2 (en) 2010-09-24 2019-10-01 Blackberry Limited Piezoelectric actuator apparatus and methods
FR2994768B1 (fr) 2012-08-21 2016-02-05 Commissariat Energie Atomique Hybridation face contre face de deux composants microelectroniques a l'aide d'un recuit uv
US20150064851A1 (en) * 2013-09-03 2015-03-05 Rohm And Haas Electronic Materials Llc Pre-applied underfill
KR20170064594A (ko) 2015-12-01 2017-06-12 삼성디스플레이 주식회사 전자 소자의 실장 방법 및 이에 사용되는 언더 필 필름
CN107025481B (zh) * 2016-02-02 2021-08-20 上海伯乐电子有限公司 柔性印制电路板及应用其的智能卡模块和智能卡
KR102694680B1 (ko) 2016-08-01 2024-08-14 삼성디스플레이 주식회사 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법
US11153970B1 (en) * 2020-07-20 2021-10-19 Atl Technology, Llc Apparatus with electrical components end mounted to printed circuit board
CN113438826B (zh) * 2021-06-29 2022-10-28 荣成歌尔微电子有限公司 底填胶封装方法及设备
US20250081349A1 (en) * 2023-09-05 2025-03-06 Nvidia Corporation Secure electronic component assembly

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US5920125A (en) * 1992-11-12 1999-07-06 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device
US6204163B1 (en) * 1998-04-13 2001-03-20 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6426566B1 (en) * 1998-12-02 2002-07-30 Seiko Epson Corporation Anisotropic conductor film, semiconductor chip, and method of packaging

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US6204163B1 (en) * 1998-04-13 2001-03-20 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6426566B1 (en) * 1998-12-02 2002-07-30 Seiko Epson Corporation Anisotropic conductor film, semiconductor chip, and method of packaging

Also Published As

Publication number Publication date
KR101054239B1 (ko) 2011-08-08
US7265994B2 (en) 2007-09-04
CN1742369A (zh) 2006-03-01
JP4724652B2 (ja) 2011-07-13
WO2004071140A2 (en) 2004-08-19
JP2006517348A (ja) 2006-07-20
KR20050092456A (ko) 2005-09-21
WO2004071140A3 (en) 2005-04-28
US20040150967A1 (en) 2004-08-05

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Texas in the United States

Patentee after: NXP USA, Inc.

Address before: Texas in the United States

Patentee before: FREESCALE SEMICONDUCTOR, Inc.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805