CN100524707C - 用于印刷电路组件的底部填充膜 - Google Patents

用于印刷电路组件的底部填充膜 Download PDF

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CN100524707C
CN100524707C CNB2004800028872A CN200480002887A CN100524707C CN 100524707 C CN100524707 C CN 100524707C CN B2004800028872 A CNB2004800028872 A CN B2004800028872A CN 200480002887 A CN200480002887 A CN 200480002887A CN 100524707 C CN100524707 C CN 100524707C
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printed circuit
pcb
circuit board
encapsulation
bottom filling
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CN1742369A (zh
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贾尼丝·当维尔
凯瑟琳·德瓦涅
纳迪娅·亚拉
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NXP USA Inc
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/3205—Shape
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    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract

自支持底部填充膜(18)粘附性地使表面安装集成电路封装(14)键合到印刷电路板(10)上。印刷电路板在表面上具有导电迹线(12)和露出的导电焊盘(13)。膜粘合剂关键设置在靠近导电焊盘的印刷电路板上，然后把表面安装印刷电路板封装放置在板上，使得封装上的导电焊盘(16)对准板上的导电焊盘。当使封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充以增强焊接点的机械完整性。

Description

用于印刷电路组件的底部填充膜
美国政府已批准本发明和权利在限定的情况内，以要求专利权人在由NIST批准的许可号No.70NANB8H4007的条款所提供的合理条件下许可其他人使用。
技术领域
本发明通常涉及印刷电路组件。更具体地，本发明涉及底部填充粘合剂的利用以使表面安装集成电路封装键合到印刷电路板上。
背景技术
借助于表面安装焊接点，使例如倒装芯片(FC)或球栅阵列(BGA)封装的集成电路(IC)封装直接附着到印刷电路板(PCB)上。现今，在从计算机到移动电话的电子产品中广泛使用这种技术，以产生非常有效、高密度的产品。
然而，当这些封装被固定在印刷电路板上时，通过许多机构、例如焊接点或电路迹线的裂缝、或焊接焊盘可以从PCB分层，转移到焊接点上的机械应力能使互连系统中断。这些机械应力可以产生于许多来源，例如封装和PCB之间的热失配，但最普遍地是当电子产品跌落时由机械震动所引起的。一段时间已知对于这种问题的一种常见解决方法。具体地，液相聚合材料、所谓的“底部填充”在封装焊接到PCB上之后在封装下面流动。一旦底部填充完全填充了存在于倒装芯片底部和基板之间的小间隙时，通过聚合使材料变硬。变硬的、聚合的底部填充使IC封装和PCB固定在一起，使得几乎不存在任何细微的移动。通过控制将另外形成在芯片和PCB之间的接合处的额外应力，可以制造可靠的组件。
当底部填充的传统利用已解决了PCB上的机械震动问题时，产生了一系列严重的制造问题。首先，必须用特殊的设备使预先聚合的液体底部填充受到二级处理。一般地，底部填充涂敷到已组装的封装的一个、两个或三个边缘，并且使得在已固定的封装下面自始至终流动。一旦材料流动到相反边缘，并且从芯片下面已排出全部空气，那么可以使额外的底部填充扩散到那些外部边缘以形成嵌条(fillet)。嵌条增加了可靠性并即使其需要额外的制造时间也是通常优选的。接着，在烘炉中烘焙组件以聚合并硬化底部填充，再次增加了处理的时间。该烘焙处理正常占10至30分钟，虽然其可能会占用几个小时，并且附加的设备和其维护显著增加了制造成本。从而，当底部填充的利用有助于减轻了机械震动问题并提供了商业解决方案，但电子器件制造工业寻求具有更低附加成本的更有效的制造方法。
最近，已发展了改进和流水线化的底部填充工艺。一种方法包括在IC封装组配到板上之前扩散底部填充到IC封装上。在焊接之前预先扩散的底部填充应含有助熔剂或具有促进焊接点形成的特性。由于电路上的焊盘常常氧化以及由于IC封装上的锡/铅焊接凸起通常氧化，所以必须设计助熔剂和底部填充来减少这些氧化物涂布并促进焊接点形成。当简化IC封装组件工艺时，该方法仍将需要额外的步骤。不管由IC封装底部填充技术所提供的各种优点，也仍需要涂敷底部填充的更简单方法。还存在用于减少了由底部填充涂敷所需的大量工艺步骤的工艺方法的需要。
发明内容
根据本发明的一个方面，提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电迹线；表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘附性地使所述封装键合到所述印刷电路板上；以及其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
根据本发明的另一个方面，提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电迹线；表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘附性地使所述封装键合到所述印刷电路板上；以及其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上；其中游离薄膜是“L”形状的，并且放置在所述阵列的角处。
根据本发明的再一个方面，提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电迹线；表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘附性地使所述封装键合到所述印刷电路板上；以及其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上；其中游离薄膜是张开的丝网栅格。
根据本发明，还提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电迹线；表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；底部填充粘合剂，沿所述封装主表面的周边的至少一部分设置在所述封装和所述印刷电路板之间，以粘附性地使所述封装键合到所述印刷电路板上；以及其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，而在涂敷之后，软化所述底部填充粘合剂以流动并使所述封装键合到所述印刷电路板上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
根据本发明，进一步提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电迹线；表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；底部填充粘合剂，沿所述封装主表面的周边的至少一部分设置在所述封装和所述印刷电路板之间，以粘附性地使所述封装键合到所述印刷电路板上；以及其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，而在涂敷之后，软化所述底部填充粘合剂以流动并使所述封装键合到所述印刷电路板上，其中游离薄膜是“L”形状的，并且被放置在所述阵列的角处。
根据本发明，还提供了一种印刷电路组件，包括：印刷电路板，在其主表面上具有多条导电焊盘；表面安装集成电路封装，在其主表面上具有焊接凸起的阵列，所述凸起焊接到导电焊盘上；底部填充粘合剂，沿所述封装主表面的周边的一部分设置在所述封装和所述印刷电路板之间，使得底部填充粘附性地使所述封装键合到所述印刷电路板上；以及其中，在焊接所述凸起到所述导电焊盘之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
附图说明
用权利要求中的特性来阐明认为是新颖的本发明的特征。然而，参考介绍了本发明确定的示范性实施例的本发明的下列详细说明，可以与其目的和优点一起最好地理解发明本身及其构造和操作方法。在以下说明中，在附图的几个视图中，相同的参考数字用来描述相同、相似或相应的元件，其中：
图1是根据本发明安装在印刷电路板上的球栅阵列封装的等角视图。
图2是根据本发明安装在印刷电路板上的球栅阵列封装的分解侧视图。
图3和4是根据本发明各种实施例安装在印刷电路板上的球栅阵列封装的局部侧视图。
图5是具有附着到其上的底部填充膜的印刷电路板的局部平面图，用来描绘根据本发明一个实施例的膜的布置。
图6是具有附着到其上的底部填充膜的印刷电路板的局部平面图，用来描绘根据本发明另一个实施例的膜的布置。
具体实施方式
尽管本发明能容许许多不同形式的实施例，在附图中示出并在此处详细介绍具体的实施例，应明白本公开可看作为本发明的原理的一个例子并不意图将本发明限制为所示和所述的具体实施例。在下列说明中，在附图的几个视图中相同的参考数字用于描述相同、相似或相应的元件。
自支持的底部填充膜附着地使表面安装集成电路封装键合到印刷电路板上。印刷电路板在表面上具有导电迹线和露出的导电焊盘。膜粘合剂关键定位在靠近导电焊盘的印刷电路板上，并随后把凸起的表面安装集成电路封装放置在印刷电路板上，使得在封装上的导电焊盘对准板上的导电焊盘。当把封装焊接在板上时软化膜粘合剂，并且膜最终用作底部填充以增加焊点的机械完整性。
现在参考图1和2，按传统方式，设计用于表面安装元件的印刷电路板10在至少一个主表面或侧面11上具有导电迹线12。PCB 10还具有位于侧面上并连接至少一些导电迹线12的多个导电焊盘13，其一般按一定的图案排列、例如阵列，并适合于接收集成电路封装14。通常露出导电焊盘13，以便成为IC封装14和PCB上的迹线12之间的电连接。IC封装、例如球栅阵列、倒装芯片封装、或其它类型的区域阵列表面安装封装通常在封装的底面上具有接触或端子16的阵列，其按本领域普通技术人员所周知的传统方式连接集成电路。这些接触16一般凸起有焊接球以使IC封装回流焊接到PCB上的相应导电焊盘13上。自支持膜粘合剂18放置在导电焊盘13附近而不与其接触的PCB上。粘合剂膜18用作IC封装14和PCB 10之间的底部填充并在使封装焊接到PCB上之后用于加固组件。现在参考图5，在一个实施例中，按字母“L”的形状剪切粘合剂膜58并关键放置在导电焊盘的阵列的四个角的每个角处。仔细定位粘合剂膜，使得其靠近独立的导电焊盘，而不接触焊盘，以便不妨碍IC封装对PCB的焊接。与现有技术不一样的是在粘附到PCB之后分布底部填充，另外与现有技术不一样的是在IC封装上预先分布底部填充，我们的发明实现了在IC封装放置在PCB的时间之前，放置到PCB上的粘合剂的自支持膜。因为底部填充粘合剂是按自支持膜的形式，所以其例如可以预先封装成带和卷轴形式，以便正如任何其它的电子元件一样通过安置工具或自动仪器来很容易地操作。实际上，恰好在放置IC封装之前，通过至少一个安置工具使膜放置到PCB上，并保留在适当的位置处，直到IC封装被存放到该位置上。当IC封装放置在PCB上时，膜和封装保留在适当的位置。在回流焊接步骤期间，IC封装上的焊接凸起熔化并被焊接到PCB导电焊盘13上，同时底部填充粘合剂膜18软化并流动以形成围绕IC封装的外部边缘的嵌条(fillet)，如图1中所示。当然，软化和流动的程度取决于选择用于底部填充膜的特性。例如，在焊接步骤期间，热塑性粘合剂将软化并流动，并随后在冷却到室温时变硬。热固性粘合剂、例如环氧树脂、聚脂、聚氨基甲酸酯和聚酰亚胺将很少会经历(experiencelittle)或不软化，并通常比热塑性塑料流动差，但在凝固成刚硬的固体之前仍产生一小的嵌条。在任一情况下，在冷却时，粘合剂变硬以在适当地位置处牢固地锁住IC封装，并在电子产品的寿命周期可能出现的随后机械震动期间防止细微的移动。
现在参考图3，流动的底部填充膜粘合剂将形成类似于该所示的嵌条38，具有接触IC封装底侧的一部分嵌条和向上延伸到封装的外侧边缘的一部分以形成一弯月面形。在该优选实施例中，底部填充延伸在封装边缘以外，并且我们发现这提供了耐机械震动的优良抵抗性。图4示出了完全在IC封装下面的底部填充膜粘合剂48，形成一凹入的嵌条。实际上，我们已发现该构造提供了改善的抗震动性，但不会达到在封装边缘外侧的优选嵌条的情况下所发现的程度。如上所述和图5中所描绘的，粘合剂膜58的优选形状是“L”形状，在阵列的每个角上的单个“L”形状的膜锁住了IC封装的角但却不会接触PCB上的独立的焊接焊盘13。在“L”形状的膜之间的间隙提供了沿封装周长的每条边的中间的开口，以使在焊接操作中所产生的挥发性气体从封装的下面逸出。这些开口通过增加IC封装下面的导热还更快速地焊接。图6中示出了本发明的一可替换实施例，其中自支持底部填充粘合剂膜68是以丝网或栅格图案的形式，包围PCB阵列上的独立的焊接焊盘13或焊盘的组。
自支持粘合剂底部填充膜18可以是纯聚合物，或其可以填充有填充物以改变粘合剂的物理特性。例如，许多的无机填充物、例如石英、二氧化钛、碳素纤维、微球等对于本领域那些技术人员来说是公知的并能随同有机染料一起被很容易地添加到膜里。这是有利的，因为其减少了膜的固有的柔软性，使得更容易在自动工厂里操作。还可以利用堆叠膜，例如，具有作为在两层粘合剂膜之间的中心核心的纵向堆叠的加劲构件(stiffener)。可以把例如金属箔、玻璃纤维垫、纸片或一层完全凝固的热固性聚合物的加劲构件堆叠到粘合剂膜上。
总之，在不意图限制本发明的范围的情况下，在印刷电路板上提供用于表面安装IC封装的底部填充的新颖方法，利用了在放置IC封装之前放置在PCB上的粘合剂的自支持膜。然后在回流焊接期间凝固或软化膜以使IC封装键合到PCB上，由此防止来自机械震动的应力被集中在焊接点处。本领域那些技术人员应认识到，按照基于在玻璃加强型印刷电路板上焊接凸起球栅阵列的利用的示范性实施例，已介绍了本发明。然而，由于对于本领域技术人员考虑到此处的讲解将会产生其它变化，所以本发明不应如此受到限制。例如，尽管本发明主要针对焊接凸起和回流的IC封装，人们还可以利用具有附着方法的其它非焊接类型的本发明，例如导电油墨、导电橡胶、镀金焊盘等，系统的这些类型包括在权利要求中。可选择地，人们可以利用不软化或流动、却根据接触简单地锁定IC封装在适当位置的力敏型粘合剂，或利用通过电磁辐射软化或凝固的粘合剂。
当结合具体实施例来描述本发明时，很明显，根据上述说明，许多转换、修改、变更和变化对于本领域那些普通技术人员来说将变得显而易见。因此，意图使本发明包含落入权利要求范围内的所有这种转换、修改和变换。

Claims (10)

1.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电迹线；
表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；
底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘合剂使所述封装键合到所述印刷电路板上；以及
其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
2.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电迹线；
表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；
底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘合剂使所述封装键合到所述印刷电路板上；以及
其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上；
其中游离薄膜是“L”形状的，并且放置在所述阵列的角处。
3.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电迹线；
表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；
底部填充粘合剂，设置在所述封装和所述印刷电路板之间，使得底部填充粘合剂使所述封装键合到所述印刷电路板上；以及
其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上；
其中游离薄膜是张开的丝网栅格。
4.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电迹线；
表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；
底部填充粘合剂，沿所述封装主表面的周边的至少一部分设置在所述封装和所述印刷电路板之间，以粘附性地使所述封装键合到所述印刷电路板上；以及
其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，而在涂敷之后，软化所述底部填充粘合剂以流动并使所述封装键合到所述印刷电路板上；
其中游离薄膜是“L”形状的，并且被放置在所述阵列的角处。
5.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电迹线；
表面安装集成电路封装，在其主表面上具有导电焊盘的阵列，所述封装安装在所述印刷电路板上，使得导电焊盘的阵列的至少一部分接触导电迹线的相应部分；
底部填充粘合剂，沿所述封装主表面的周边的至少一部分设置在所述封装和所述印刷电路板之间，以粘附性地使所述封装键合到所述印刷电路板上；以及
其中，在使所述封装附着到所述板上之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，而在涂敷之后，软化所述底部填充粘合剂以流动并使所述封装键合到所述印刷电路板上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
6.如权利要求5中所述的印刷电路组件，其中一部分底部填充粘合剂延伸到封装边缘以外。
7.如权利要求5中所述的印刷电路组件，其中底部填充粘合剂含有选自由无机填充物、染料、颜料和固化层构成的组中的一种或多种添加剂。
8.如权利要求5中所述的印刷电路组件，其中底部填充粘合剂是热固性粘合剂。
9.如权利要求5中所述的印刷电路组件，其中底部填充粘合剂是热塑性粘合剂。
10.一种印刷电路组件，包括：
印刷电路板，在其主表面上具有多条导电焊盘；
表面安装集成电路封装，在其主表面上具有焊接凸起的阵列，所述凸起焊接到导电焊盘上；
底部填充粘合剂，沿所述封装主表面的周边的一部分设置在所述封装和所述印刷电路板之间，使得底部填充粘合剂使所述封装键合到所述印刷电路板上；以及
其中，在焊接所述凸起到所述导电焊盘之前，涂敷所述底部填充粘合剂作为游离薄膜到所述印刷电路板主表面上，其中所述底部填充粘合剂不完全在封装周边的周围延伸。
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JP4724652B2 (ja) 2011-07-13
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US20040150967A1 (en) 2004-08-05
KR101054239B1 (ko) 2011-08-08
KR20050092456A (ko) 2005-09-21
CN1742369A (zh) 2006-03-01
US7265994B2 (en) 2007-09-04
WO2004071140A2 (en) 2004-08-19

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