JP2006517348A - 印刷配線アセンブリ用のアンダーフィル薄膜 - Google Patents
印刷配線アセンブリ用のアンダーフィル薄膜 Download PDFInfo
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10621—Components characterised by their electrical contacts
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Abstract
Description
は、前記基板に加工する前に、前記ICパッケージ上にアンダーフィルを供給する工程を備える。半田付けの前に予備供給されるアンダーフィルは融剤を有しているか、又は、半田接合形成を促進する特性があるのがよい。回路上のランドはしばしば酸化するし、ICパッケージ上のスズ/鉛半田バンプは通常酸化されるので、前記融剤及び前記アンダーフィルは、これらの酸化物被覆を減少させ、半田接合形成を促進するように設計されねばならない。前記ICパッケージアセンブリ工程を簡素化できる一方で、この方法では追加の工程が要求される。ICパッケージのアンダーフィル技術によってもたらされる数々の利点にも拘わらず、アンダーフィルを用いた更に簡易な方法が必要とされる。アンダーフィル適用に伴い要求される工程数を減少させる工程方法論もまた必要である。
導電性ランドに近く、しかし前記ランドに接することなく注意深く位置決めされ、前記ICパッケージの前記PCBへの半田付けを妨げないようにされている。前記PCBへの接合の後でアンダーフィルを供給する従来技術と異なり、並びに、前記ICパッケージ上にアンダーフィルを予備供給する従来技術とも異なり、本発明は、前記ICパッケージが前記PCB上に載置されるよりも前に、前記PCB上に載置される接着剤の自己支持型薄膜を用いる。前記アンダーフィル接着剤は自己支持型薄膜の形状をなすので、例えば予めテープ及び巻物状の形態の包装とし、あらゆる他の電子部品と全く同様に、部品供給用の機械又はロボットによって容易に取り扱うことができる。実際には、前記薄膜は、前記ICパッケージ載置前に1つ以上の部品供給機によって前記PCB上に載置される。そしてその場に静止し、その後前記ICパッケージがその場所上に投入される。前記ICパッケージが前記PCB上に載置される時には、前記薄膜及び前記パッケージはその場に静止している。半田リフロー工程中には、前記ICパッケージの前記半田バンプは溶融してPCB導電性ランド13に半田付けされる。同時にアンダーフィル接着剤薄膜18は軟化し、図1に示されるような前記ICパッケージの外側端面周囲の隅肉を形成する。前記の軟化及び流動の程度は、勿論前記アンダーフィル薄膜として選択された接着剤の特性に依存する。例えば、熱可塑性接着剤は半田付け工程中に軟化し流動する。その後、室温まで冷却されて硬化する。例えば、エポキシ類、ポリエステル類ポリウレタン類及びポリイミド類などの熱硬化性接着剤は、ほとんど又は全く軟化を示さず、一般に熱可塑性物よりも流動性が乏しい。しかしそれでも、堅い固体に硬化する前に小さな隅肉を生成する。いずれの場合にも、冷却すると接着剤は硬化し前記ICパッケージをしっかりとその場に固定し、前記電子製品の生涯に起こり得るその後の機械的衝撃の間において、ずれを防止する。
実装ICパッケージの為のアンダーフィルを提供する新規な方法は、前記ICパッケージを載置するより前に、前記PCB上に載置された接着剤の自己支持型薄膜を用いる。前記薄膜はその後、半田リフロー工程の間に硬化され、又は、軟化され、前記ICパッケージを前記PCBに接着し、機械的衝撃からの応力が前記半田接合部に集中するのを防止する。本発明は、ガラス強化印刷回路基板上の半田バンプを有するボールグリッドアレーの使用に基づく例示的な実施態様に関して説明されてきたことは、当業者は認識するであろう。しかし、本発明はそのように限定されるべきものではない。何故なら、ここに教示されていることを考慮すると、当業者には他の様々な変更は思い浮かぶであろうからである。例えば、本発明は半田はバンプ型及びリフロー型のICパッケージの使用を基本的には教示しているが、導電性インク、導電性弾性体、金めっきランドなどの、他の半田ではない型の接着方法論での本発明も採用され得るのであり、これらの型のシステムは添付の本発明の請求の範囲にあるものと判断される。また他に、軟化も流動もしないが接触により前記ICパッケージを容易にその場に固定する感圧接着剤、若しくは、電磁放射線によって軟化し、又は、硬化する接着剤も使用し得る。
Claims (4)
- 主面上に複数の導電性トレースを有する印刷回路基板と、
主面上にアレー状導電性ランドを有する表面実装集積回路パッケージであって、少なくとも前記アレー状導電性ランドの一部が前記導電性トレースの対応する部分と接触するように、前記パッケージは前記印刷回路基板上に載置されることを特徴とするパッケージと、
前記パッケージと前記印刷回路基板との間に配置され、前記パッケージを前記印刷回路基板に接着により接合させるアンダーフィル接着剤とを備え、
前記アンダーフィル接着剤は、前記パッケージの前記印刷回路基板に対する接着に先立ち、前記印刷回路基板の主面に対して固着していない薄膜として供用されることを特徴とする印刷配線アセンブリ。 - 前記アンダーフィル接着剤は、前記パッケージ外周の全長には延在していない請求項1に記載の印刷配線アセンブリ。
- 主面上に複数の導電性トレースを有する印刷回路基板と、
主面上にアレー状導電性ランドを有する表面実装集積回路パッケージであって、少なくとも前記アレー状導電性ランドの一部が前記導電性トレースの対応する部分と接触するように、前記パッケージは前記印刷回路基板上に載置されることを特徴とするパッケージと、
前記パッケージと前記印刷回路基板との間に、前記パッケージの主面の外周の少なくとも一部分に沿って配置され、前記パッケージを前記印刷回路基板に接着により接合させるアンダーフィル接着剤とを備え、
前記アンダーフィル接着剤は、前記パッケージの前記基板に対する接着に先立ち、前記印刷回路基板の主面に対して固着していない薄膜として供用され、前記供用の後、前記アンダーフィル接着剤は軟化されて流動し、前記パッケージを前記印刷回路基板に接着することを特徴とする印刷配線アセンブリ。 - 主面上に複数の導電性ランドを有する印刷回路基板と、
前記導電性ランドに半田付けされるアレー状半田バンプを主面上に有する表面実装集積回路パッケージと、
前記パッケージと前記印刷回路基板との間に、前記パッケージの主面の外周の一部分に沿って配置され、これにより、前記パッケージを前記印刷回路基板に接着により接合させるアンダーフィル接着剤とを備え、
前記アンダーフィル接着剤は、前記バンプを前記導電性ランドに対して半田付けするのに先立ち、前記印刷回路基板の主面に対して固着していない薄膜として供用されることを特徴とする印刷配線アセンブリ。
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US10/356,419 US7265994B2 (en) | 2003-01-31 | 2003-01-31 | Underfill film for printed wiring assemblies |
US10/356,419 | 2003-01-31 | ||
PCT/US2004/002615 WO2004071140A2 (en) | 2003-01-31 | 2004-01-30 | Underfill film for printed wiring assemblies |
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JP2006517348A true JP2006517348A (ja) | 2006-07-20 |
JP2006517348A5 JP2006517348A5 (ja) | 2007-03-15 |
JP4724652B2 JP4724652B2 (ja) | 2011-07-13 |
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US (1) | US7265994B2 (ja) |
JP (1) | JP4724652B2 (ja) |
KR (1) | KR101054239B1 (ja) |
CN (1) | CN100524707C (ja) |
WO (1) | WO2004071140A2 (ja) |
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US20150064851A1 (en) * | 2013-09-03 | 2015-03-05 | Rohm And Haas Electronic Materials Llc | Pre-applied underfill |
KR20170064594A (ko) | 2015-12-01 | 2017-06-12 | 삼성디스플레이 주식회사 | 전자 소자의 실장 방법 및 이에 사용되는 언더 필 필름 |
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KR20180014903A (ko) | 2016-08-01 | 2018-02-12 | 삼성디스플레이 주식회사 | 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법 |
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- 2004-01-30 KR KR1020057014068A patent/KR101054239B1/ko active IP Right Grant
- 2004-01-30 CN CNB2004800028872A patent/CN100524707C/zh not_active Expired - Fee Related
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JP4724652B2 (ja) | 2011-07-13 |
KR20050092456A (ko) | 2005-09-21 |
WO2004071140A3 (en) | 2005-04-28 |
US20040150967A1 (en) | 2004-08-05 |
CN1742369A (zh) | 2006-03-01 |
US7265994B2 (en) | 2007-09-04 |
CN100524707C (zh) | 2009-08-05 |
WO2004071140A2 (en) | 2004-08-19 |
KR101054239B1 (ko) | 2011-08-08 |
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