CN101419919A - 半导体芯片安装法、半导体安装布线板制作方法及半导体安装布线板 - Google Patents

半导体芯片安装法、半导体安装布线板制作方法及半导体安装布线板 Download PDF

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Publication number
CN101419919A
CN101419919A CNA2008101729121A CN200810172912A CN101419919A CN 101419919 A CN101419919 A CN 101419919A CN A2008101729121 A CNA2008101729121 A CN A2008101729121A CN 200810172912 A CN200810172912 A CN 200810172912A CN 101419919 A CN101419919 A CN 101419919A
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China
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wiring plate
thermosetting resin
resin layer
wired circuit
semiconductor chip
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CNA2008101729121A
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吉田和孝
川井若浩
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Omron Corp
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Omron Corp
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Publication of CN101419919A publication Critical patent/CN101419919A/zh
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Abstract

一种半导体芯片安装法、半导体安装布线板制作方法及半导体安装布线板。将半导体芯片安装在上面的布线板的制作方法，包括：将铝箔粘合到树脂衬底的一个表面；在所述的铝箔上提供有预定形状的热硬化树脂层；移除从所述热硬化树脂层暴露出来的所述铝箔的部分以形成布线电路；在所述布线电路上提供热塑性树脂层。在把热施加到所述布线板和把施加了超声波的所述凸点按压到所述布线板上时，所述热硬化树脂层具有使所述布线板能够防止在所述半导体芯片与所述布线电路之间短路的强度，以及具有被降低的交联度以至于使所述凸点能够移除所述热硬化树脂层以到达所述布线电路。

Description

半导体芯片安装法、半导体安装布线板制作方法及半导体安装布线板
技术领域
本发明涉及半导体芯片安装方法，其适合应用于能够读取电磁波并用作空运货物标签，物流管理标签，无人检票闸机等等的数据载体的制作，以及涉及半导体安装布线板的制作方法和半导体安装布线板，尤其涉及半导体芯片安装方法，半导体安装布线板的制作方法，及半导体安装布线板，其能够通过应用倒装芯片的方法，利用超声波并且低成本地使半导体芯片被安装在布线板上。
背景技术
近年来，随着卡片式电子产品、物流管理标签、诸如移动电话的便携式电子产品、影像产品等的发展，迅速增加了对降低在其上安装了半导体等的印刷布线板的成本及厚度的要求。
为了近来对上面提到的减小厚度的要求，积极地提出了涉及直接将裸露的半导体芯片安装在印刷布线板上的倒装芯片方法(以下称为FC方法)的方案。图4所示的剖面图示出了根据应用FC方法的半导体芯片安装方法的安装结构。
如图4所示，在FC方法中，先前在半导体芯片10的电极上形成的凸出终端(以下称为凸点)11与树脂衬底21上的布线电路22对齐，接着通过使用导电胶等将它们焊接或连接起来。
然而，在这种相关技术的方法中，存在用于连接凸点11和布线电路22的焊接步骤或导电胶的供应及硬化步骤复杂并需要增加成本的问题，而且，因为为了保证凸点连接部分的抗潮湿的可靠性或者为了达到半导体安装的强度，必须在半导体芯片10和树脂衬底21之间通过填充被称为底部填充树脂23的绝缘树脂来密封凸点的连接部分，所以由于填充和硬化底部填充树脂23的工艺步骤的必要性，存在着产品成本增加的问题。
作为这个问题的解决办法，已知在日本专利No.2586154中提出了使用各向异性导电膜(以下称为ACF)来安装半导体的方法。在此相关技术的方法中，通过把细微的导电粒子分散到热塑性或热硬化树脂中而获得的ACF被插入到半导体和衬底电路之间，并且通过热压缩键合使树脂流态化，从而通过夹在凸点和衬底电路之间的细微导电粒子在厚度方向建立电气连接。这个方法使得能够在安装半导体时相对粗略地执行与衬底电路的对齐，并具有缩短树脂硬化时间到10至20秒和消除使用诸如底部填充树脂那样的密封材料的必要性的效果。
然而，各向异性导电片是相对昂贵的并有不能在非耐热衬底上使用的缺点，因为各向异性导电片要求200℃或更高的高温作为硬化温度。同样，尽管各向异性导电片需要相对短的时间来硬化树脂材料，这个时间为10至20秒，但是难以进一步简化或加快此工艺步骤。
另外，由于凸点和衬底图案之间的电气连接是经由分散在树脂材料内的细微导电粒子的接触来实现的，所以存在连接可靠性差的问题。
因此，如在JP-A-2001-156110中所公开的，提出了另一种半导体芯片安装方法，将在下面阐述此相关技术的安装方法。
图5A至5C是举例说明了超声波安装步骤细节的示意图，并且，在半导体芯片安装方法中：加热半导体安装布线板200(步骤A)，该半导体安装布线板200是通过在层叠于树脂衬底21上的金属箔的表面上以预定布线电路22的形式涂布由热塑性树脂材料(抗蚀剂)24制成的墨水材料，并且通过刻蚀来移除墨水材料中暴露出来的金属而形成的；接着，通过按压从半导体芯片10凸出到半导体安装布线板200上的凸点11，同时施加超声波100，将热塑性树脂层24移除(步骤B)；以及用超声波100在凸点11和布线电路22之间形成电极区域110(步骤C)。
可以通过使用在JP-A-2001-156110公开的相关技术的方法来在1至2秒内执行制作过程，超声波键合，以及熔化和硬化热塑性树脂，以缩短产生时间。在凸点和布线电路之间经超声振荡熔合的金属键合使内部终端可靠地连接，因而实现了提高连接的可靠性。
然而，如图6A及6B所示，由于半导体芯片10直接下面的部分和布线电路22之间的电气绝缘仅由热塑性树脂层24提供，所以，在应用于卡等的制作中的层叠按压、注塑成型等等期间，当高温度和高压力同时施加到半导体芯片10的安装部分时，半导体芯片10直接下面的部分和布线电路22可能由于热塑性树脂层24的再软化及流态化而导致电气短路(请看图6B中的参考数字31和32所指示的部分)。
发明内容
因此，本发明的目的是提供半导体芯片安装方法、半导体安装布线板制作方法及半导体安装布线板，其中在将高温度和高压力施加到半导体安装部分的情况下，半导体直接下面的部分与布线图案之间的电气短路得到预防。
为了实现这个目的，根据本发明，这里提出了其上安装了半导体芯片的布线板的制作方法，该方法包括：
将铝箔粘附在树脂衬底的一个表面；
在所述铝箔上提供具有预定形状的热硬化树脂层；
除去所述铝箔的从所述热硬化树脂层暴露出来的部分以形成布线电路；以及
在所述布线电路上提供热塑性树脂层。
根据本发明，这里提出了在所述布线板上安装所述半导体芯片的方法，其包括：
把热施加于所述布线板；
按压所述半导体芯片的凸点到被所述热软化的热塑性树脂层上，同时将超声波施加到所述凸点；
使所述凸点与所述布线电路接触；
在所述凸点与所述布线电路彼此接触的状态下，将所述超声波施加到所述凸点；以及
通过冷却固化所述热塑性树脂层，将所述半导体裸露芯片粘合到所述布线板上，
其中，在将所述热施加于所述布线板并且将被施加了所述超声波的所述凸点按压到所述的布线板上时，所述热硬化树脂层具有能够使所述布线板防止半导体芯片和布线电路之间短路的强度，并具有被降低得能够使所述凸点移除所述热硬化树脂层以到达所述布线电路的交联度。
根据本发明，这里还提出了其上要安装半导体芯片的布线板，所述布线板包括：
树脂衬底；
在所述树脂衬底的一个表面上提供的布线电路；
在所述布线电路上提供的热硬化树脂层；以及
在所述热硬化树脂层上提供的热塑性树脂层。
在将所述热施加于所述布线板并且将被施加了所述超声波的所述凸点按压到所述布线板时，所述热硬化树脂层具有能够使所述布线板防止所述半导体芯片和所述布线电路之间短路的强度，并具有被降低得能够使半导体芯片的凸点移除所述的热硬化树脂层以到达所述的布线电路的交联度。
所述热硬化树脂层可能包括其中加入了诸如胺类、酸酐类和酚类的硬化剂以及诸如胺类的硬化催化剂的环氧基树脂。
如在此处所用到的，所述热硬化树脂是指有空间晶格结构的聚合物材料，在加热具有小聚合程度的被称之为预聚物的粉粒或液体或者加热通过诸如硬化剂的物质加入预聚物中而获得的物质时，其被硬化为在分子之间形成三维桥接键合(交联)。由于所述的三维交联结构，所以诸如耐热性和抗化学性的物理属性优于热塑性树脂。热硬化树脂的代表示例包括酚醛树脂、环氧基树脂、脲醛树脂、三聚氰胺树脂、不饱和聚酯树脂、聚氨酯、聚酰亚胺，等等。
在热硬化树脂中，环氧树脂用于电子部件(用于密封印刷布线板、电阻器及电容器)，用于半导体密封(用于密封晶体管、IC、LSI、COB、PPGA、TAB等)，以及脲醛树脂被用作例如布线/照明部件、布线工具部件、控制部件、滑动部件、日用品、电容器等等。因而，每一种热硬化树脂都有适合的应用和不适合的应用。
同样，根据所述热硬化树脂的类型，所述的内容及硬化方法也发生变化。比如，环氧树脂是具有可通过双酚A和环氯氯丙烷的缩合等而获得的环氧基团的树脂，且被分为缩水甘油类和非缩水甘油类，并在和硬化剂反应而硬化时形成三维结构。
在本发明中，通过从相关技术数量降低热硬化树脂中包括的硬化剂的数量，从而降低了交联的程度。如这里用到的，术语“相关技术数量”是一种程度，利用它将不会导致半导体芯片直接下面的部分和布线电路发生电气短路，且不为软化状态的坚硬的热硬化树脂层将残留在布线电路的表面上以防止抑制凸点和布线电路之间电极区域的形成。
作为粘合剂的环氧基树脂的属性由其硬化程度描述，而且可能通过分子的交联程度来估计有机聚合物的硬化程度。从而，在使用环氧基树脂作为热硬化树脂的情况下，为了抑制交联的程度从而使得可能容易地剥离环氧树脂并促进在半导体芯片的凸点和衬底上的铝之间金属的键合，通过从相关技术数量降低硬化剂数量来降低硬化程度，优选地为相关技术数量的一半。
附图说明
图1是示出了本发明中半导体芯片的安装结构的剖面视图。
图2A、2B、2C及2D是图解了根据本发明的半导体安装布线板制作步骤的示意图。
图3是示出了相关技术中的热硬化树脂和本发明中的热硬化树脂的剪切强度的比较结果的示意图。
图4是示出了根据相关技术的安装方法的安装结构的剖面视图。
图5A、5B及5C是图解了相关技术的超声安装步骤的细节的示意图。
图6A用6B是图解了根据相关技术的安装方法的问题的示意图。
具体实施方式
以下将基于附图来描述本发明的实施例。
本发明的半导体安装布线板结构几乎与图6A所示的布线板结构相同，所不同的是在布线电路22和热塑性树脂层24之间提供的热硬化树脂层40。因此，与图6A示出的半导体安装布线板200相同的结构用相同的参考数字表示，并且忽略它的详细描述。
如图1所示，根据本发明的半导体安装布线板20由两个功能层形成，作为刻蚀工艺的抗蚀膜的热硬化树脂层40和层叠在热硬化树脂层40表面上而获得的热塑性树脂层24。热硬化树脂层40是在层叠于树脂衬底21上的布线电路22的表面而形成的。热硬化树脂层40包括通过将相关技术数量的一半数量的硬化剂(比如胺类、酸酐类、酚类等)添加到环氧基材料中而获得的树脂，或者在如上面所提到的树脂中，通过将硬化催化剂(如胺类)降低到相关技术数量的一半数量而获得的树脂。
环氧基热硬化树脂通常用作电子部件(用于密封印刷布线板、电阻器或电容器)，用于密封半导体(用于密封晶体管、IC、LSI、COB、PPGA，TAB等)，等等，以及，如在这里用到的，术语“相关技术数量的一半”是指上面每一种用法中包括的硬化剂的普通使用数量的一半数量。
根据本发明，在半导体安装布线板20中，在半导体安装布线板20的热塑性树脂层24和布线电路22之间的边界表面上提供热硬化树脂层40。用这种构造，如图6B所示，在应用于卡等的制作中的层叠按压、注塑成型等等过程期间，在高温度和高压力同时施加到半导体芯片10的安装部分的情况下，可能实现防止在半导体芯片10直接下面的部分与布线电路22之间电气短路问题的效果。
用作热硬化树脂层40的热硬化树脂是相关技术中类型的情况中，即其包含满足用于电子部件(用于密封印刷布线板、电阻器或电容器)，用于密封半导体(用于密封晶体管，IC、LSI、COB、PPGA、TAB)等等的普通质量要求所需数量的硬化剂，下面的问题可能发生在应用JP-A-2001-156110提出的安装方法的情况下。也就是，在以下状态下，其中，在通过按压从半导体芯片10凸出到半导体安装布线板200上的凸点，从布线电路22的表面上移除作为两个功能层的热塑树脂层24以及热硬化树脂层40的步骤中，在图5B中的步骤B中将超声波100施加到半导体芯片10，不处于软化状态的坚硬的热硬化树脂层40残留在布线电路22的表面，因而产生抑制凸点11和布线电路22之间电极区域形成的问题。
因此，本发明者进行了大量的研究，并通过实验发现，在布线电路22上热硬化树脂层40的残留主要是由它高交联度和硬度造成的，并且，本发明者基于确定的原因，发明了降低交联度的对策，其通过将在形成热硬化树脂层40的环氧基材料中的硬化剂降低到相关技术数量一半的数量，或者进一步将硬化催化剂降低到相关技术数量一半的数量。用这样的构成，可能彻底地移除热硬化树脂层40同时防止短路以及可能实现防止抑制凸点11和布线电路22之间电极区域的形成的效果。
以下将根据附图描述根据本发明的一个示例。
<示例>
如前面所描述，根据本发明的半导体芯片安装方法是下述过程，其包括：在形成于树脂衬底21的布线电路22上，为交联度被降低了的热硬化树脂层40提供绝缘粒子，其中通过将环氧基材料中的硬化剂降低到相关技术数量一半的数量或者进一步将硬化催化剂降低到相关技术数量一半的数量，来降低热硬化树脂层40的交联度；在将超声波100施加到凸点11的同时热塑性树脂层通过加热被软化了的状态下，通过将从半导体芯片10凸出的凸点11按压到热塑性树脂层24的表面，来从半导体安装布线板20移除布线电路22上的作为绝缘膜的热塑性树脂层24和热硬化树脂层40，所述半导体安装布线板20是通过用热塑性树脂层24覆盖热硬化树脂层40的表面而获得的；以及在凸点11和布线电路22之间形成电极区域110。
本例的半导体安装布线板20具有的结构是，在25微米的PET(聚对苯二甲酸乙二酯)膜(树脂衬底21)的一个表面上形成由35微米硬铝制成的布线电路22，在通过向其中增加硬化剂和硬化催化剂而获得的环氧基热硬化树脂层40及布线电路上形成具有90℃到100℃再软化温度的聚烯烃基热塑性树脂层24。
以下将根据图2A至2D描述本例的半导体安装布线板的制造步骤。
(步骤1)作为第一步，制备Al-PET层叠的基料。作为一个示例，厚度为35微米的硬铝箔51通过聚氨酯基粘合剂重叠在厚度为25微米的PET薄膜(树脂衬底21)的一个表面上，接着，通过在150℃和5kg/cm2的压力的条件下的热层叠来进行层叠键合。因此，其中硬铝箔51被粘附在PET膜表面上的Al-PET层叠材料就完成了。
(步骤2)下一步，在层叠材料的硬铝箔51表面上形成具有预定布线图案的环氧基热硬化树脂层40。
通过诸如凹版印刷等形成厚度大约4至6微米的热硬化树脂层40，该方法在Al-PET层叠材料上应用在包含30％甲苯、6.1％甲乙酮和12％乙二醇二丁醚的溶液中经混合和分散环氧树脂、硬化剂及硬化催化剂而获得的墨水。接着，在130℃到200℃下干燥20秒至1分钟。作为墨水，可以使用在包括30％甲苯、6.1％甲乙酮和12％乙二醇二丁醚的溶液中经混合和分散环氧树脂及硬化剂而获得的油墨。
通过以预定布线图案印刷热硬化树脂层40，可能为后面的布线电路的形成步骤获得刻蚀抗蚀剂。
(步骤3)从上面描述的步骤中形成的刻蚀抗蚀剂中暴露出来的铝箔部分通过进行刻蚀工艺被移除以形成布线电路22。就是说，在这个刻蚀工艺中，NaOH(120克/升)被用作刻蚀液体，在50℃的条件下移除不必要的铝。
(步骤4)最后，用诸如凹版印刷等的方法，厚度约4到6微米的、在大约为90℃至100℃的温度下熔化的聚烯烃基热塑性粘合剂等被施加到布线电路22的表面(在热硬化树脂层40上)以完成本发明中用到的半导体安装布线板20。
以下将描述在上面描述的步骤中获得的半导体安装布线板20上安装半导体芯片10的步骤。
(步骤11)半导体芯片10形成所谓的表面贴装型部件，其具有为了连接而从其底部表面凸出的金属终端(凸点)11，以及，在将63KHz的超声振荡施加到从底部部分凸出的凸点11(例如，由金制成)的状态下，在压力低于0.2Kg/mm2的载荷下，半导体芯片10被按压到加热至150℃而被软化的热塑性树脂层24中。
(步骤12)通过凸点11的超声振荡100，轻易地从凸点11的顶部位置移除软化的热塑性树脂层24，所以，凸点11到达热硬化树脂层40的表面。
(步骤13)在将超声振荡加载到凸点上时，通过进一步按压凸点到热硬化树脂层40，热硬化树脂层40被凸点11的顶部给移除了，并且凸点到达布线电路22的表面。
存在于布线电路22表面上的诸如氧化层的绝缘层经超声振荡被机械地移除了，以把金属(凸点11和布线电路22)彼此接触在一起。金属被这种状态下施加到此处的超声振荡引起的摩擦热熔合了，从而形成了电极区域110。
在这种安装方法中，超声振荡加载的时间大约为0.5秒，因而能够在相当短的时间内安装了半导体芯片。
另外，在上面所述的步骤之后，当施加到半导体安装布线板20上的150℃的热消除时，熔化的热塑性树脂层24被重新硬化，因此半导体芯片10和布线电路22彼此坚固地粘合在一起。
为了研究本例中半导体芯片10的凸点11和半导体电路22之间的键合强度，制备了其中作为粘合剂的热塑性树脂层24还没有形成的半导体安装布线板20，然后通过改变热硬化树脂层40所用的材料，通过比较安装步骤之后的剪切强度，获得的结果在图3示出。如图3所示，在其中降低了硬化剂和硬化催化剂的环氧层所达到的剪切强度几乎是相关技术中环氧层剪切强度的两倍，并且通过将硬化剂和硬化催化剂的每种的数量降低到一半，键合边界的电极区域110的面积得到增加。
在本发明中，在布线电路和热塑性树脂层之间提供热硬化树脂层，并且通过将硬化剂的使用数量从相关技术中的数量降下来，降低了这个热硬化树脂层上的交联度。用这样的构造，可能防止在高温度和高压力被施加到半导体安装部分的情况下半导体直接下面的部分与布线图案的电气短路。

Claims (6)

1.一种制作布线板的方法，其中半导体芯片要被安装在所述布线板上，所述方法包括：
将铝箔粘合到树脂衬底的一个表面；
在所述铝箔上提供具有预定形状的热硬化树脂层；
移除所述铝箔的从所述热硬化树脂层暴露出来的部分以形成布线电路；以及
在所述布线电路上提供热塑性树脂层。
2.一种在通过根据权利要求1所述的方法制作的布线板上安装半导体芯片的方法，包括：
把热施加于所述布线板；
按压所述半导体芯片的凸点到被所述热软化的所述热塑性树脂层，同时将超声波施加到所述凸点；
使所述凸点接触所述布线电路；
在所述凸点与所述布线电路彼此接触状态下，将所述超声波施加到所述凸点；以及
通过冷却固化所述热塑性树脂层将所述半导体芯片粘合到所述布线板上，
其中，当将所述热施加于所述布线板并且把被施加了所述超声波的所述凸点按压到所述布线板时，所述热硬化树脂层具有能够使所述布线板防止在所述半导体芯片和所述布线电路之间短路的强度，并且具有被降低得能够使所述凸点移除所述热硬化树脂层以到达所述布线电路的交联度。
3.根据权利要求2所述的方法，其中，所述热硬化树脂层包括环氧基树脂，所述环氧基树脂中加入诸如胺类、酸酐类和酚类的硬化剂以及诸如胺类的硬化催化剂。
4.一种布线板，其中半导体芯片要被安装在所述布线板上，所述布线板包括：
树脂衬底；
在所述树脂衬底的一个表面上提供的布线电路；
在所述布线电路上提供的热硬化树脂层；以及
在所述热硬化树脂层上提供的热塑性树脂层。
5.根据权利要求4所述的布线板，其中
其中，在把热施加于所述布线板和把被施加了超声波的凸点按压到所述布线板时，所述热硬化树脂层具有能够使所述布线板防止在所述半导体芯片与所述布线电路之间短路的强度，并且具有被降低得能够使所述半导体芯片的所述凸点移除所述热硬化树脂层以到达所述布线电路的交联度。
6.根据权利要求5所述的布线板，其中所述热硬化树脂层包括环氧基树脂，所述环氧基树脂中加入诸如胺类、酸酐类和酚类的硬化剂以及诸如胺类的硬化催化剂。
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