JP4724652B2 - アンダーフィル薄膜を有する印刷配線アセンブリ - Google Patents

アンダーフィル薄膜を有する印刷配線アセンブリ Download PDF

Info

Publication number
JP4724652B2
JP4724652B2 JP2006503178A JP2006503178A JP4724652B2 JP 4724652 B2 JP4724652 B2 JP 4724652B2 JP 2006503178 A JP2006503178 A JP 2006503178A JP 2006503178 A JP2006503178 A JP 2006503178A JP 4724652 B2 JP4724652 B2 JP 4724652B2
Authority
JP
Japan
Prior art keywords
package
circuit board
printed circuit
array
underfill adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006503178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006517348A5 (enExample
JP2006517348A (ja
Inventor
ダンビル、ジャニス
デバニー、キャサリン
ヤラ、ナディア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2006517348A publication Critical patent/JP2006517348A/ja
Publication of JP2006517348A5 publication Critical patent/JP2006517348A5/ja
Application granted granted Critical
Publication of JP4724652B2 publication Critical patent/JP4724652B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H10W72/348—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2006503178A 2003-01-31 2004-01-30 アンダーフィル薄膜を有する印刷配線アセンブリ Expired - Lifetime JP4724652B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/356,419 2003-01-31
US10/356,419 US7265994B2 (en) 2003-01-31 2003-01-31 Underfill film for printed wiring assemblies
PCT/US2004/002615 WO2004071140A2 (en) 2003-01-31 2004-01-30 Underfill film for printed wiring assemblies

Publications (3)

Publication Number Publication Date
JP2006517348A JP2006517348A (ja) 2006-07-20
JP2006517348A5 JP2006517348A5 (enExample) 2007-03-15
JP4724652B2 true JP4724652B2 (ja) 2011-07-13

Family

ID=32770803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006503178A Expired - Lifetime JP4724652B2 (ja) 2003-01-31 2004-01-30 アンダーフィル薄膜を有する印刷配線アセンブリ

Country Status (5)

Country Link
US (1) US7265994B2 (enExample)
JP (1) JP4724652B2 (enExample)
KR (1) KR101054239B1 (enExample)
CN (1) CN100524707C (enExample)
WO (1) WO2004071140A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020053326A (ko) * 2000-12-27 2002-07-05 이일희 폐옥을 이용한 건축자재 제조방법
KR100475540B1 (ko) * 2002-05-27 2005-03-10 양원모 건축물 마감재의 제조 방법
US6978540B2 (en) 2003-05-23 2005-12-27 National Starch And Chemical Investment Holding Corporation Method for pre-applied thermoplastic reinforcement of electronic components
US7004375B2 (en) 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
CN100499101C (zh) * 2006-08-02 2009-06-10 南茂科技股份有限公司 具有延长引脚的薄膜覆晶封装构造
US7889959B2 (en) * 2008-02-07 2011-02-15 Lockheed Martin Corporation Composite material for cable floatation jacket
JP2010103336A (ja) * 2008-10-24 2010-05-06 Fujitsu Ltd 基板ユニット、情報処理装置及び基板ユニットの製造方法
US20110115099A1 (en) * 2009-05-14 2011-05-19 Vertical Circuits, Inc. Flip-chip underfill
KR20110024291A (ko) * 2009-09-01 2011-03-09 삼성전기주식회사 회로 기판, 반도체 패키지 및 회로 기판의 제조 방법
US20110067910A1 (en) * 2009-09-18 2011-03-24 International Business Machines Corporation Component securing system and associated method
US10429929B2 (en) 2010-09-24 2019-10-01 Blackberry Limited Piezoelectric actuator apparatus and methods
FR2994768B1 (fr) 2012-08-21 2016-02-05 Commissariat Energie Atomique Hybridation face contre face de deux composants microelectroniques a l'aide d'un recuit uv
US20150064851A1 (en) * 2013-09-03 2015-03-05 Rohm And Haas Electronic Materials Llc Pre-applied underfill
KR20170064594A (ko) 2015-12-01 2017-06-12 삼성디스플레이 주식회사 전자 소자의 실장 방법 및 이에 사용되는 언더 필 필름
CN107025481B (zh) * 2016-02-02 2021-08-20 上海伯乐电子有限公司 柔性印制电路板及应用其的智能卡模块和智能卡
KR102694680B1 (ko) 2016-08-01 2024-08-14 삼성디스플레이 주식회사 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법
US11153970B1 (en) * 2020-07-20 2021-10-19 Atl Technology, Llc Apparatus with electrical components end mounted to printed circuit board
CN113438826B (zh) * 2021-06-29 2022-10-28 荣成歌尔微电子有限公司 底填胶封装方法及设备
US20250081349A1 (en) * 2023-09-05 2025-03-06 Nvidia Corporation Secure electronic component assembly

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859470A (en) * 1992-11-12 1999-01-12 International Business Machines Corporation Interconnection of a carrier substrate and a semiconductor device
GB9502178D0 (en) * 1995-02-03 1995-03-22 Plessey Semiconductors Ltd MCM-D Assemblies
US5836715A (en) * 1995-11-19 1998-11-17 Clark-Schwebel, Inc. Structural reinforcement member and method of utilizing the same to reinforce a product
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US5796169A (en) * 1996-11-19 1998-08-18 International Business Machines Corporation Structurally reinforced ball grid array semiconductor package and systems
JPH10163386A (ja) * 1996-12-03 1998-06-19 Toshiba Corp 半導体装置、半導体パッケージおよび実装回路装置
WO1998028788A1 (fr) * 1996-12-24 1998-07-02 Nitto Denko Corporation Production dun dispositif a semi-conducteur
JP3604248B2 (ja) * 1997-02-25 2004-12-22 沖電気工業株式会社 半導体装置の製造方法
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6139705A (en) * 1998-05-06 2000-10-31 Eltech Systems Corporation Lead electrode
WO2000033375A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Couche conductrice anisotrope, puce a semi-conducteur et procede de conditionnement
US6657313B1 (en) * 1999-01-19 2003-12-02 International Business Machines Corporation Dielectric interposer for chip to substrate soldering
US6291899B1 (en) * 1999-02-16 2001-09-18 Micron Technology, Inc. Method and apparatus for reducing BGA warpage caused by encapsulation
JP3447620B2 (ja) * 1999-07-05 2003-09-16 Ｎｅｃエレクトロニクス株式会社 フリップチップ実装型半導体装置の製造方法
JP3654116B2 (ja) * 2000-03-10 2005-06-02 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6570259B2 (en) * 2001-03-22 2003-05-27 International Business Machines Corporation Apparatus to reduce thermal fatigue stress on flip chip solder connections
US20020162679A1 (en) * 2001-05-04 2002-11-07 Nael Hannan Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies
JP4417596B2 (ja) * 2001-09-19 2010-02-17 富士通株式会社 電子部品の実装方法
US6696748B1 (en) * 2002-08-23 2004-02-24 Micron Technology, Inc. Stress balanced semiconductor packages, method of fabrication and modified mold segment
US6877964B2 (en) * 2002-11-06 2005-04-12 The United States Of America As Represented By The Secretary Of The Air Force Multifunction microfluidics device

Also Published As

Publication number Publication date
KR101054239B1 (ko) 2011-08-08
US7265994B2 (en) 2007-09-04
CN1742369A (zh) 2006-03-01
WO2004071140A2 (en) 2004-08-19
JP2006517348A (ja) 2006-07-20
KR20050092456A (ko) 2005-09-21
CN100524707C (zh) 2009-08-05
WO2004071140A3 (en) 2005-04-28
US20040150967A1 (en) 2004-08-05

Similar Documents

Publication Publication Date Title
JP2006517348A (ja) 印刷配線アセンブリ用のアンダーフィル薄膜
US5435732A (en) Flexible circuit member
US5133495A (en) Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US6821878B2 (en) Area-array device assembly with pre-applied underfill layers on printed wiring board
US5203075A (en) Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
JP5079646B2 (ja) 半導体パッケージ及びその製造方法と半導体装置
KR101010159B1 (ko) 얇은 언더필 및 두꺼운 솔더 마스크를 가지는 플립-칩어셈블리
JP2001217514A (ja) 多層配線基板
US20240055385A1 (en) Package structure and method for fabricating the same
US7118940B1 (en) Method of fabricating an electronic package having underfill standoff
EP1430532A2 (en) Encapsulation of pin solder for maintaining accuracy in pin position
CN111919520A (zh) 电子电路装置以及电路基板的制造方法
KR100748558B1 (ko) 칩 사이즈 패키지 및 그 제조 방법
JP3085265B2 (ja) ボールグリッドアレイ実装構造
US6911726B2 (en) Microelectronic packaging and methods for thermally protecting package interconnects and components
US20030202332A1 (en) Second level packaging interconnection method with improved thermal and reliability performance
CN1168617A (zh) 塑性网格焊球阵列组件
JP7846121B2 (ja) 半導体パッケージおよびその製造方法
US7019403B2 (en) Adhesive film and tacking pads for printed wiring assemblies
JP4650269B2 (ja) 積層型半導体装置の製造方法
KR101145483B1 (ko) 접합 접착제를 가진 부품
JP7656826B2 (ja) 実装基板および実装基板の製造方法
JP2011066122A (ja) 回路基板
TW202410219A (zh) 減少表面黏著封裝與印刷電路板之間焊橋的方法
JP5170123B2 (ja) 積層型半導体装置及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090731

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100126

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100426

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110225

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110322

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110411

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140415

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4724652

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term