CN100517074C - 吸盘系统、使用该吸盘系统的光刻装置和器件制造方法 - Google Patents

吸盘系统、使用该吸盘系统的光刻装置和器件制造方法 Download PDF

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Publication number
CN100517074C
CN100517074C CNB2004800389194A CN200480038919A CN100517074C CN 100517074 C CN100517074 C CN 100517074C CN B2004800389194 A CNB2004800389194 A CN B2004800389194A CN 200480038919 A CN200480038919 A CN 200480038919A CN 100517074 C CN100517074 C CN 100517074C
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CN
China
Prior art keywords
sucker
substrate
suction cup
frame
framework
Prior art date
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Expired - Fee Related
Application number
CNB2004800389194A
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English (en)
Chinese (zh)
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CN1898611A (zh
Inventor
P·史密特斯
P·J·C·H·斯穆尔德斯
K·J·J·M·扎尔
H·H·M·科西
J·J·奥坦斯
N·J·吉利森
J·斯塔里弗尔德
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ASML Netherlands BV
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ASML Netherlands BV
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Publication of CN1898611A publication Critical patent/CN1898611A/zh
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Publication of CN100517074C publication Critical patent/CN100517074C/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2004800389194A 2003-12-24 2004-12-20 吸盘系统、使用该吸盘系统的光刻装置和器件制造方法 Expired - Fee Related CN100517074C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/744,088 US7119884B2 (en) 2003-12-24 2003-12-24 Lithographic apparatus and device manufacturing method
US10/744,088 2003-12-24

Publications (2)

Publication Number Publication Date
CN1898611A CN1898611A (zh) 2007-01-17
CN100517074C true CN100517074C (zh) 2009-07-22

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CNB2004800389194A Expired - Fee Related CN100517074C (zh) 2003-12-24 2004-12-20 吸盘系统、使用该吸盘系统的光刻装置和器件制造方法

Country Status (7)

Country Link
US (1) US7119884B2 (enExample)
EP (1) EP1702241A2 (enExample)
JP (1) JP4384181B2 (enExample)
KR (3) KR100882893B1 (enExample)
CN (1) CN100517074C (enExample)
TW (1) TWI303355B (enExample)
WO (1) WO2005064400A2 (enExample)

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US7119884B2 (en) 2006-10-10
EP1702241A2 (en) 2006-09-20
KR20080091268A (ko) 2008-10-09
JP4384181B2 (ja) 2009-12-16
KR100950069B1 (ko) 2010-03-26
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WO2005064400A3 (en) 2006-03-09
TW200530764A (en) 2005-09-16
CN1898611A (zh) 2007-01-17
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KR100882893B1 (ko) 2009-02-10
TWI303355B (en) 2008-11-21
WO2005064400A2 (en) 2005-07-14
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KR100882892B1 (ko) 2009-02-10

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