CN100515162C - 印刷电路板及其制造方法 - Google Patents

印刷电路板及其制造方法 Download PDF

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Publication number
CN100515162C
CN100515162C CNB2006101457151A CN200610145715A CN100515162C CN 100515162 C CN100515162 C CN 100515162C CN B2006101457151 A CNB2006101457151 A CN B2006101457151A CN 200610145715 A CN200610145715 A CN 200610145715A CN 100515162 C CN100515162 C CN 100515162C
Authority
CN
China
Prior art keywords
resin
substrate
fluorine ion
pcb
copper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101457151A
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English (en)
Chinese (zh)
Other versions
CN1988768A (zh
Inventor
宋宗锡
金泰勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN1988768A publication Critical patent/CN1988768A/zh
Application granted granted Critical
Publication of CN100515162C publication Critical patent/CN100515162C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
CNB2006101457151A 2005-12-19 2006-11-14 印刷电路板及其制造方法 Expired - Fee Related CN100515162C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20050125249 2005-12-19
KR1020050125249 2005-12-19
KR1020060063370 2006-07-06

Publications (2)

Publication Number Publication Date
CN1988768A CN1988768A (zh) 2007-06-27
CN100515162C true CN100515162C (zh) 2009-07-15

Family

ID=38185355

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101457151A Expired - Fee Related CN100515162C (zh) 2005-12-19 2006-11-14 印刷电路板及其制造方法

Country Status (2)

Country Link
KR (1) KR100797691B1 (ko)
CN (1) CN100515162C (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100797692B1 (ko) 2006-06-20 2008-01-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100887675B1 (ko) 2007-09-21 2009-03-11 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조 방법
KR100914337B1 (ko) * 2007-12-10 2009-08-27 삼성전기주식회사 인쇄회로기판 제조 방법
KR100952483B1 (ko) 2008-02-18 2010-04-13 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20090117249A (ko) 2008-05-09 2009-11-12 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101019154B1 (ko) * 2008-12-03 2011-03-04 삼성전기주식회사 인쇄회로기판 제조방법
KR101042102B1 (ko) * 2009-06-17 2011-06-16 주식회사 코리아써키트 캐리어 기판의 제조방법 및 이 캐리어기판을 이용한 베리드 인쇄회로기판의 제조방법
CN102111964B (zh) * 2009-12-29 2012-10-17 富葵精密组件(深圳)有限公司 电路板制作方法
CN103031528B (zh) * 2011-09-29 2015-08-26 比亚迪股份有限公司 一种防指纹薄膜的制备方法及由该方法制备的防指纹薄膜
KR101321305B1 (ko) * 2011-11-25 2013-10-28 삼성전기주식회사 빌드업 인쇄회로기판 및 그의 제조방법
CN103287017B (zh) * 2012-03-01 2016-12-14 深圳光启高等理工研究院 一种超材料片层及加工方法、制备的超材料
EP2847363B1 (en) * 2012-05-07 2016-09-07 Cuptronic Technology Ltd. A process for application of metal
CN108243575B (zh) * 2016-12-27 2020-04-17 Bgt材料有限公司 聚合物印刷电路板的制造方法
JP7145428B2 (ja) * 2017-03-28 2022-10-03 東レＫｐフィルム株式会社 金属化フィルムおよびその製造方法
KR101809985B1 (ko) 2017-03-30 2017-12-18 와이엠티 주식회사 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박
KR102064370B1 (ko) * 2017-05-30 2020-01-13 주식회사 아모그린텍 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판
KR102088033B1 (ko) * 2017-05-30 2020-03-11 주식회사 아모그린텍 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판
KR102088000B1 (ko) * 2017-05-30 2020-03-11 주식회사 아모그린텍 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판
CN110754141A (zh) 2017-05-30 2020-02-04 阿莫绿色技术有限公司 用于制造柔性印刷电路板的方法及由该方法制造的柔性印刷电路板
CN112248595A (zh) * 2020-09-22 2021-01-22 瑞声新能源发展(常州)有限公司科教城分公司 绝缘板及其制备方法、层压板及其制备方法、和应用
KR102469768B1 (ko) * 2021-10-26 2022-11-22 도레이첨단소재 주식회사 동박적층필름 및 이를 포함하는 전자소자
CN114137022A (zh) * 2021-11-30 2022-03-04 重庆大学 一种热电堆型热流密度传感器
KR102482417B1 (ko) * 2021-12-20 2022-12-28 도레이첨단소재 주식회사 동박적층필름 및 이를 포함하는 전자소자

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100247559B1 (ko) * 1997-02-24 2000-03-15 김윤 불소계수지 함유 지지체를 이용한 인쇄회로 기판의 제조방법
KR20020022477A (ko) * 2000-09-20 2002-03-27 정해원 물리적 기상 증착법을 이용한 빌드업 다층 인쇄회로판제조방법
KR20020028597A (ko) * 2000-10-11 2002-04-17 이형도 다층인쇄회로기판의 제조방법, 이에 의해 제조되는 기판및 ｆｃｉｐ
KR100502179B1 (ko) * 2002-02-25 2005-08-08 스마트알앤씨 주식회사 인쇄회로기판용 금속 피복 적층체의 제조 방법

Also Published As

Publication number Publication date
KR100797691B1 (ko) 2008-01-23
KR20070065196A (ko) 2007-06-22
CN1988768A (zh) 2007-06-27

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Granted publication date: 20090715

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