CN102111964B - 电路板制作方法 - Google Patents
电路板制作方法 Download PDFInfo
- Publication number
- CN102111964B CN102111964B CN200910312463A CN200910312463A CN102111964B CN 102111964 B CN102111964 B CN 102111964B CN 200910312463 A CN200910312463 A CN 200910312463A CN 200910312463 A CN200910312463 A CN 200910312463A CN 102111964 B CN102111964 B CN 102111964B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- wet process
- board manufacturing
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 85
- 230000008569 process Effects 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000011241 protective layer Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000003792 electrolyte Substances 0.000 claims abstract description 5
- 239000011247 coating layer Substances 0.000 claims description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 230000003628 erosive effect Effects 0.000 claims description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 18
- 238000007747 plating Methods 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009740 moulding (composite fabrication) Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 208000002193 Pain Diseases 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007785 strong electrolyte Substances 0.000 description 1
- 235000019157 thiamine Nutrition 0.000 description 1
- 150000003544 thiamines Chemical class 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
电路板 | 10 |
绝缘层 | 11 |
导电层 | 12 |
覆盖层 | 13 |
镀覆层 | 14 |
导电图形 | 120 |
导电线路 | 121 |
焊盘 | 122 |
接触盘 | 1221 |
组装盘 | 1222 |
过渡层 | 15 |
保护层 | 20 |
有机保焊层 | 30 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910312463A CN102111964B (zh) | 2009-12-29 | 2009-12-29 | 电路板制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910312463A CN102111964B (zh) | 2009-12-29 | 2009-12-29 | 电路板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102111964A CN102111964A (zh) | 2011-06-29 |
CN102111964B true CN102111964B (zh) | 2012-10-17 |
Family
ID=44175938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910312463A Expired - Fee Related CN102111964B (zh) | 2009-12-29 | 2009-12-29 | 电路板制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102111964B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102843856A (zh) * | 2012-09-11 | 2012-12-26 | 厦门爱谱生电子科技有限公司 | 一种焊接有多个导电触块的柔性电路板及其制造方法 |
KR101307163B1 (ko) * | 2012-11-29 | 2013-09-11 | 주식회사 에스아이 플렉스 | 인쇄회로기판의 내층회로 보호공법 |
CN107635357A (zh) * | 2017-09-13 | 2018-01-26 | 东莞联桥电子有限公司 | 一种易清理的pcb板金手指保护方法 |
CN110265762B (zh) * | 2019-05-10 | 2021-07-16 | 华为技术有限公司 | 电子设备及其制备方法 |
CN114394415B (zh) * | 2021-12-28 | 2023-12-12 | 赤壁市万皇智能设备有限公司 | 一种基于agv自动搬运系统的fpc自动化生产线 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
CN1353450A (zh) * | 2000-11-07 | 2002-06-12 | 赫飞科技开发股份有限公司 | 形成透明导电基板的方法 |
CN1620224A (zh) * | 2003-11-21 | 2005-05-25 | 三井金属矿业株式会社 | 安装电子元件的印刷线路板、其制作方法和半导体设备 |
CN1988768A (zh) * | 2005-12-19 | 2007-06-27 | 三星电机株式会社 | 印刷电路板及其制造方法 |
-
2009
- 2009-12-29 CN CN200910312463A patent/CN102111964B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
CN1353450A (zh) * | 2000-11-07 | 2002-06-12 | 赫飞科技开发股份有限公司 | 形成透明导电基板的方法 |
CN1620224A (zh) * | 2003-11-21 | 2005-05-25 | 三井金属矿业株式会社 | 安装电子元件的印刷线路板、其制作方法和半导体设备 |
CN1988768A (zh) * | 2005-12-19 | 2007-06-27 | 三星电机株式会社 | 印刷电路板及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102111964A (zh) | 2011-06-29 |
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C06 | Publication | ||
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C53 | Correction of patent of invention or patent application | ||
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Co-applicant before: Hongsheng Technology Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee after: Peng Ding Polytron Technologies Inc. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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Effective date of registration: 20170801 Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc. Patentee after: AVARY HOLDING (SHENZHEN) Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 |