CN100478117C - 丝线焊接绝缘丝线及其毛细管 - Google Patents

丝线焊接绝缘丝线及其毛细管 Download PDF

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Publication number
CN100478117C
CN100478117C CNB2004800246379A CN200480024637A CN100478117C CN 100478117 C CN100478117 C CN 100478117C CN B2004800246379 A CNB2004800246379 A CN B2004800246379A CN 200480024637 A CN200480024637 A CN 200480024637A CN 100478117 C CN100478117 C CN 100478117C
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China
Prior art keywords
pad
insulated wire
electrically connected
capillary
welding
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Expired - Fee Related
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CNB2004800246379A
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CN1842394A (zh
Inventor
福艾达·哈龙
曾昭孟
陈兰珠
刘德明
张光美
杨素珊
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NXP USA Inc
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Freescale Semiconductor Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Abstract

一种焊接绝缘丝线(14)的改进方法，该绝缘丝线具有将第一焊盘(16)连接到第二焊盘(18)的一个端子，该方法包括移动毛细管(20)的尖头、保持焊接丝线(14)位于第二焊盘(18)的表面之上，致使焊接丝线(14)在毛细管尖头(20)和第二焊盘(18)之间产生摩擦，该方法磨损焊接丝线的绝缘物，以致丝线(14)的至少一部分金属芯接触第二焊盘(18)。由此采用热压焊接，将丝线(14)焊接到第二焊盘(18)。使毛细管(20)的尖头粗糙，以便增加焊接丝线绝缘物的磨损。

Description

丝线焊接绝缘丝线及其毛细管
发明背景
本发明涉及用于将集成电路(IC)管芯连接到引线的丝线和丝线焊接，更具体地，本发明涉及一种丝线焊接绝缘丝线的方法。
IC管芯是一种在半导体晶片例如硅晶片上形成的微小器件。这种管芯典型地从晶片上进行切割并粘接到衬底或用于互连再分布的基板载体上。管芯上的焊盘被电连接到具有通过丝线焊接的丝线的衬底之上的引线。丝线还可以用于使芯片的连接焊盘交叉或使衬底的连接引线交叉。然后，封装管芯、丝线和衬底，从而形成封装器件。
由于不断需要更高密度的集成电路，然而在封装器件的尺寸或管脚却不能相应地增加。还需要对IC更多的输入和输出，导致了在IC管芯和衬底之间的高密度互连，由此就需要更细的间距(pitch)和超微细的间距丝线焊接。同样就降低了焊接丝线的直径。例如，63μm应用采用25μm直径的丝线，同时52μm和44μm应用就采用20.3μm直径的丝线。对于37μm应用，正在开发采用17μm直径的丝线。
间距和丝线直径的降低就会难于进行处理并进行丝线焊接。例如，丝线可以尽可能短地到达封装器件的其他导体结构，诸如其他丝线、焊盘、引线或管芯。在IC管芯包封期间这种缩短会发生例如“回扫(sweeping)”，此处注入或转移的液体模铸包封剂就会排斥其他丝线结构而移动丝线。采用更小直径丝线的部分就会趋向于具有更大的丝线回扫抑制。采用绝缘或涂覆的丝线就可以降低这种丝线回扫和缩短。然而，当采用涂覆丝线时，特别是对于第二焊接，却难于获得良好的焊接质量。即，丝线焊接机能够进行芯片焊盘处的第一焊接和载体引线处的第二焊接。利用绝缘丝线，引线上的无黏附就会成为普遍的问题。克服第二焊接弱的一种努力是采用电子灭火(EFO)来去除绝缘体。然而，第二焊接处完成EFO则需要特殊的丝线焊接机器并需要额外的时间。
本发明提供一种采用标准丝线焊接机以提高第二焊接的焊接质量的丝线焊接绝缘或涂覆丝线的方法。
附图说明
当结合附图进行阅读时，将更好地理解本发明的以上简要概述以及以下优选实施例的详细描述。为了说明本发明的目的，各附图中示出了展示出的优选实施例。然而，应当理解，本发明不限于示出的精确排列和结构。在各附图中：
图1是根据本发明的电互连的放大侧视图；
图2A-2C是根据本发明的一个实施例的说明一种将绝缘丝线焊接到焊盘的方法的丝线焊接机毛细管的剖面图；以及
图3是根据本发明的一个实施例的毛细管尖头的放大透视图。
具体实施方式
以下根据附图所进行的详细说明希望作为本发明所展示的优选实施例的说明，且不希望代表其中实施本发明的唯一方式。应当理解，可以通过不同的实施例来实施相同或等同的功能，且相同或等同的功能将包含于本发明的精神和范围之内。
为了易于说明，已经放大了各附图中的某些特征，并且附图及其实施例不必按适当比例。然而，本领域普通技术人员易于理解这些细节。在各附图中，所有相同的数字表示相同的元件。
本发明提供一种利用绝缘丝线将第一器件电连接到第二器件的方法。该方法包括步骤：
通过将绝缘丝线的第一端子丝线焊接到第一器件的第一焊盘，形成第一焊接，由此电连接焊接丝线和第一器件；
移动毛细管的尖头，使焊接丝线保持在第二器件的第二焊盘之上，致使在毛细管尖头和第二焊盘之间摩擦焊接丝线，由此磨损焊接丝线的绝缘物，以致丝线的至少一部分金属芯接触第二焊盘；以及
通过热压焊接，将焊接丝线的至少暴露部分焊接到第二焊盘，由此电连接第一器件和第二器件。
本发明还提供一种用于其中毛细管具有柱状尖头的丝线焊接机的毛细管，通过该柱状尖头焊接丝线突出，其中为了磨损涂覆丝线上的绝缘涂覆物，粗糙毛细管的外表面。
现在，参照图1，图1是在包封之前、利用涂覆或绝缘丝线14而粘接到第二器件12的第一器件10的放大的局部侧视图。第一器件10可以是半导体器件、诸如在硅衬底上形成的集成电路。第二器件12也可以是半导体器件、诸如叠置管芯结构方式下的底管芯或下层管芯。然而，在本发明的优选实施例中，第二器件12是一种载体或衬底。更具体地，图1示出了电连接到第二器件12的引线指18的第一器件的管芯焊盘，在此情况下，它是一种引线架。第一和第二器件10、12以及它们的焊盘16、18是本领域普通技术人员所公知的类型，并且为了完整地理解本发明也不必对它们进行详细的描述。
本发明的绝缘焊接丝线14包括涂覆有电绝缘材料的导体芯且适合用于微细间距和超微细间距的丝线焊接。绝缘材料防止丝线与其他丝线或其他导体结构短路。通常，金和铝最普遍用于元件以便制造焊接丝线14的导体芯。金和铝两者都强硬且可延伸，并且在绝大部分环境下具有相同的电阻。为了使金丝线稳定，有时用掺杂剂诸如铍、钙来掺杂金丝线。小直径的铝丝线通常用硅或者有时用镁来掺杂，以便提高它的折断负载和拉伸参数。除了金和铝之外，还公知有铜、钯合金、铂和银焊接丝线。本领域普通技术人员公知，各种尺寸丝线都适合于将芯片连接到衬底，丝线尺寸的选择基于在其他方面、焊盘间距之间。尽管可以采用其他直径的焊接丝线，焊接丝线14具有在大约15μm～大约55μm之间的直径，并且本发明不限于具体的焊接丝线直径。在优选的实施例中，绝缘丝线14具有小于或等于大约25μm的直径。绝缘涂覆物优选具有大约0.5μm～大约2.0μm厚度的在无空气球形成期间可以进行热分解的有机绝缘涂覆物。此外，丝线14优选具有大约180°～350°的熔点温度(Tg)。
在此，管芯焊盘16处的互连丝线14称作为第一焊接，并且在引线指18处的互连丝线14作为第二焊接。在本优选实施例中，第一焊接是球焊，且第二焊接是锲形焊。术语“丝线焊接”通常表示通过芯片和衬底的丝线互连。在球型焊接中，毛细管支撑丝线。焊球被形成在丝线的一端并受到毛细管表面的压制。焊球可以利用氢气火焰或火花来形成。毛细管将焊球推向焊盘，然后，同时相对第一焊盘支撑焊球，施加超声波震动，将焊球粘接到管芯。一旦焊球粘接到管芯焊盘，就将仍然保持丝线的毛细管移动到第二焊盘诸如引线架指18之上，到达第二焊盘的第一焊盘就形成了电连接。相对于第二焊盘压制丝线，再一次施加超声波能量，直至将丝线粘接到第二焊盘。然后毛细管从丝线提起焊接、无断裂。本领域普通技术人员公知锲形焊和球焊。
虽然锲形焊是公知的，但是当采用绝缘丝线时，则难于获得良好的第二丝线焊接。有时，差的第二焊接是由于仍然存在于丝线和焊接引线之间的丝线绝缘物，从而阻止了良好的粘接性。即，在丝线和引线之间仅存在一个小的接触区域，它是第二焊接的尾部区域。在丝线的相对侧，在锲形形成期间，绝缘体的较大部分则被去除了。在丝线剥离测试结果中，证明了粘接性差。在丝线剥离测试中，在邻近第二焊接的丝线之下放置一个钩叉(hook)，并施加一个提升力，由此测试粘接到引线/接线柱的第二焊接的强度。绝缘的微细丝线和绝缘的超微细丝线通常呈现出非常低的丝线剥离强度。为了克服非常低的剥离强度的问题，本发明提供一种锲形焊接绝缘丝线的方法，该方法包括机械磨损步骤，该机械磨损步骤包含移动毛细管的尖头、将焊接丝线保持在第二焊盘的表面之上致使在毛细管尖头和第二焊盘之间摩擦焊接丝线、由此磨损焊接丝线的绝缘物，以致丝线的至少一部分金属芯接触第二焊盘。在优选实施例中，采用特定的、粗糙的毛细管尖头来提高机械磨损。
现在，参照图2A-2C，图2A-2C示出了根据本发明的一个实施例的说明一种将绝缘丝线14焊接到引线指18的方法的丝线焊接机毛细管的剖面图。丝线14通过毛细管20中的通孔22延伸。图2A示出了通过毛细管20相对于引线指18挤压的丝线14。根据本发明，然后在引线指18的表面之上水平地移动毛细管20，致使在毛细管20的尖头和引线指18之间摩擦焊接丝线14。图2B示出了在与引线指18交叉地从右至左移动了丝线14之后的丝线14。相对于引线指18的这种丝线14的运动就会导致焊接丝线绝缘物的磨损，以致丝线14的至少一部分金属芯接触引线指18。在焊接丝线14移动横过引线指18之后，进行热压焊，以便将丝线14焊接到引线指18上，由此电连接第一器件10和第二器件12。为了获得磨损丝线14上的绝缘涂覆物所必须的大量机械磨损，丝线14可以在引线指18之上一次或多次地来回移动。在本优选实施例中，丝线14按照这样一种方式水平地移动两次至三次，即在进行任何热压、热超声丝焊或超声丝焊步骤之前、毛细管运动具有在引线指18表面之上的正偏移移动(远离第二焊接位置)和两个负偏移移动(朝向第二焊接位置)的组合。超声焊接所需的能量非常低，并且大致为用于超声焊接所采用的超声能量的最小值。图2C示出了在机械运动和热压焊接之后提升焊盘18的毛细管20。毛细管20的提升在焊接处切断丝线14。
热压焊接步骤包括热和压的组合，以便将丝线14粘接到引线指18。可以采用其上放置有引线架的加热毛细管或加热底座(未示出)中的任何一种或两种。在本发明中，温度范围从100℃～200℃。如下文中所述，可以采用最适合的具有按照所需仅仅对毛细管尖头改进了的焊接机诸如ESEC 3088iP和Kulicke & Soffa 8086来进行丝焊。在可选的实施例中，为了提高如上所述的通过机械运动来磨损绝缘物的效率，可以在相对于引线指18移动丝线14之前、利用定位热源24来加热引线指18。
现在，参照图3，图3示出了毛细管20的尖头的异常放大透视图。如附图中所示，毛细管20可以具有圆柱形尖头，该圆柱形尖端有一个焊接丝线从中突出的孔。当作为典型使用时，毛细管20可以由陶瓷、钨或红宝石材料来制造。然而，根据本发明，此处典型的毛细管完全光滑以便制造光亮的焊接，为了在移动步骤期间提高绝缘物的磨损，粗糙毛细管20的尖头。更具体地，使毛细管20的外表面粗糙并具有常规毛细管的表面粗糙度的大约两倍至五倍之间的粗糙度。
已经做出了本发明，从而提供以下优点：(a)当利用标准丝焊机而采用绝缘丝线时、由于在第二焊接处的非引线粘接而几乎消除了局部障碍；(b)提高了第二焊接处的具有改进了丝线拉伸强度/丝线剥离强度的绝缘丝线的焊接性；(c)除了毛细管尖头之外，不需要新的或改进的丝焊设备；(d)降低了模具处的丝线缩短的障碍；(e)不需要具有非常精细填充物的昂贵模具组合物；(f)利用微细涂覆丝线就能够与焊接进行交叉；(g)焊盘/管芯设计规则不必只对外围焊盘进行限制；以及(h)降低了电开路的障碍。
为了说明和描述的目的，已经展现了本发明的优选实施例的描述，但不希望是限制性的或者使本发明受限于所公开的形式。本领域普通技术人员应当清楚，在不脱离本发明的宽泛的发明概念之下，可以对如上所述的实施例进行修改。本发明应用于所有丝线焊接封装类型，包括但不限于球栅阵列(BGA)、带型球栅阵列(TBGA)、塑料球栅阵列(PBGA)、无引线方形扁平封装(QFN)、四方扁平封装(QFP)、小外廓集成电路(SOIC)和芯片尺寸封装(CSP)。此外，还可以采用具有绝缘体涂覆物的丝线，以便在封装IC中连接导电结构的其他类型。因此，应当理解，本发明不限于所公开的具体实施例，但本发明覆盖了由附加权利要求所限定的在本发明的精神和范围之内的各种修改。

Claims (20)

1.一种利用绝缘丝线将第一器件电连接到第二器件的方法，该方法包括步骤：
通过将该绝缘丝线的第一端子丝线焊接到该第一器件的第一焊盘、由此电连接该绝缘丝线和第一器件，形成第一焊接；
移动毛细管尖头、在第二器件的第二焊盘的表面之上保持该绝缘丝线，致使在该毛细管尖头和第二焊盘之间水平地摩擦该绝缘丝线，由此磨损该绝缘丝线绝缘物，以致该绝缘丝线的至少一部分金属芯接触第二焊盘，其中，所述毛细管具有粗糙尖头，在所说的移动步骤期间该粗糙尖头提高了该绝缘物的磨损；以及
通过热压焊接，将该绝缘丝线的至少暴露部分焊接到第二焊盘，由此电连接第一器件和第二器件。
2.根据权利要求1的电连接方法，其中该移动步骤包括：移动该毛细管尖头，以致该毛细管运动具有在第二焊盘之上的第一方向上的正偏移运动和在第二焊盘之上的第二方向上的负偏移运动的组合。
3.根据权利要求1的电连接方法，其中，将该绝缘丝线的至少暴露部分焊接到第二焊盘的步骤包括热压焊接和非常低的超声能量。
4.根据权利要求1的电连接方法，其中第一焊接包括球焊。
5.根据权利要求4的电连接方法，其中，焊接到第二焊盘的焊接包括自动点焊。
6.根据权利要求1的电连接方法，其中第二器件包括载体并且第二焊盘是引线指。
7.根据权利要求1的电连接方法，还包括在所说的移动步骤之前加热第二焊盘的步骤。
8.根据权利要求1的电连接方法，其中所述绝缘丝线包括具有有机绝缘涂覆物的金、铜或铝丝线中的一种。
9.根据权利要求8的电连接方法，其中所述绝缘丝线具有小于25μm的直径。
10.根据权利要求9的电连接方法，其中所述绝缘涂覆物具有0.5μm～2.0μm的厚度。
11.一种将具有连接到第一焊盘的一个端子的绝缘丝线焊接到第二焊盘的改进方法，该改进方法包括步骤：
移动毛细管尖头、在第二焊盘的表面之上保持该绝缘丝线，致使在该毛细管尖头和第二焊盘之间摩擦该绝缘丝线，由此磨损该绝缘丝线绝缘物，以致该绝缘丝线的至少一部分金属芯接触第二焊盘，其中，所述毛细管具有粗糙尖头，在所说的移动步骤期间该粗糙尖头提高了该绝缘物的磨损；以及
通过热压焊接，将该绝缘丝线的暴露部分焊接到第二焊盘。
12.根据权利要求11的电连接方法，其中该移动步骤包括移动该毛细管尖头，以致该毛细管运动具有在第二焊盘之上的第一方向上的正偏移运动和在第二焊盘之上的第二方向上的负偏移运动的组合。
13.根据权利要求11的电连接方法，其中该热压焊接采用非常小的超声能量。
14.根据权利要求11的电连接方法，其中，焊接到第二焊盘的焊接包括自动点焊。
15.根据权利要求14的电连接方法，其中第二焊盘包括引线指。
16.根据权利要求11的电连接方法，还包括在所说的移动步骤之前加热第二焊盘的步骤。
17.根据权利要求11的电连接方法，其中所述绝缘丝线包括具有有机绝缘涂覆物的金、铜或铝丝线中的一种。
18.一种将具有连接到第一焊盘的一个端子的绝缘丝线焊接到第二焊盘的改进方法，该改进方法包括步骤：
提供用于支撑该绝缘丝线的具有粗糙尖头的毛细管；
在第二焊盘的表面之上移动毛细管尖头，致使在该毛细管尖头和第二焊盘之间摩擦该绝缘丝线，由此磨损该绝缘丝线的绝缘物，以致该绝缘丝线的至少一部分金属芯接触第二焊盘；以及
通过热压焊接，将该绝缘丝线的暴露部分焊接到第二焊盘。
19.根据权利要求18的电连接方法，还包括在所说的移动步骤之前加热第二焊盘的步骤。
20.根据权利要求18的电连接方法，其中该绝缘丝线包括具有有机绝缘涂覆物的金、铜或铝丝线中的一种。
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Patentee before: Fisical Semiconductor Inc.

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Granted publication date: 20090415

Termination date: 20190715

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