CN100475419C - 裂痕形成方法及裂痕形成装置 - Google Patents

裂痕形成方法及裂痕形成装置 Download PDF

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Publication number
CN100475419C
CN100475419C CNB2005800365599A CN200580036559A CN100475419C CN 100475419 C CN100475419 C CN 100475419C CN B2005800365599 A CNB2005800365599 A CN B2005800365599A CN 200580036559 A CN200580036559 A CN 200580036559A CN 100475419 C CN100475419 C CN 100475419C
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CN
China
Prior art keywords
substrate
cooling
beam spot
crack
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2005800365599A
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English (en)
Chinese (zh)
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CN101048255A (zh
Inventor
五户统悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN101048255A publication Critical patent/CN101048255A/zh
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/16—Transversely of continuously fed work
    • Y10T225/18—Progressively to or from one side edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CNB2005800365599A 2004-10-25 2005-10-25 裂痕形成方法及裂痕形成装置 Expired - Fee Related CN100475419C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004309958 2004-10-25
JP309958/2004 2004-10-25

Publications (2)

Publication Number Publication Date
CN101048255A CN101048255A (zh) 2007-10-03
CN100475419C true CN100475419C (zh) 2009-04-08

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Family Applications (1)

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CNB2005800365599A Expired - Fee Related CN100475419C (zh) 2004-10-25 2005-10-25 裂痕形成方法及裂痕形成装置

Country Status (9)

Country Link
US (1) US7726532B2 (OSRAM)
EP (1) EP1806202B1 (OSRAM)
JP (1) JP4722054B2 (OSRAM)
KR (1) KR100821937B1 (OSRAM)
CN (1) CN100475419C (OSRAM)
AT (1) ATE520495T1 (OSRAM)
MX (1) MX2007005018A (OSRAM)
TW (1) TW200621661A (OSRAM)
WO (1) WO2006046525A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107755904A (zh) * 2013-03-21 2018-03-06 康宁激光技术有限公司 借助激光从平坦基板中切割轮廓的设备及方法

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007018674A1 (de) * 2007-04-18 2008-10-23 Lzh Laserzentrum Hannover E.V. Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas
EP2151149A1 (de) * 2007-04-25 2010-02-10 CeramTec AG Chip-resistor-substrat
KR101453587B1 (ko) * 2007-04-30 2014-11-03 코닝 인코포레이티드 이동 유리 리본을 스코어링하기 위한 장치, 시스템, 및 방법
JP5011048B2 (ja) 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
CN101468875A (zh) 2007-12-24 2009-07-01 鸿富锦精密工业（深圳）有限公司 脆性非金属基材及其切割方法
KR101139306B1 (ko) * 2007-12-27 2012-04-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 크랙 형성 방법
CN101497150B (zh) * 2008-02-01 2012-10-10 鸿富锦精密工业（深圳）有限公司 激光切割装置
KR100848854B1 (ko) * 2008-04-21 2008-07-30 주식회사 탑 엔지니어링 취성기판의 스크라이빙 장치 및 그 방법
IT1394891B1 (it) * 2008-07-25 2012-07-20 Matteo Baistrocchi Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
TWI517922B (zh) * 2009-05-13 2016-01-21 康寧公司 切割脆性材料之方法
JP5636423B2 (ja) * 2009-05-27 2014-12-03 コーニング インコーポレイテッド 高温でのガラスのレーザ・スコアリング
US20110011227A1 (en) * 2009-07-15 2011-01-20 Tingley Iii William Q Method and apparatus for non-rotary holemaking by means of controlled fracturing
US11235395B2 (en) * 2009-07-15 2022-02-01 Tennine Corp. Controlled fracture machining method for producing through-holes
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2011155314A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 ガラス板の切断方法
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR101358672B1 (ko) * 2012-08-13 2014-02-11 한국과학기술원 극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9092187B2 (en) 2013-01-08 2015-07-28 Apple Inc. Ion implant indicia for cover glass or display component
US9623628B2 (en) * 2013-01-10 2017-04-18 Apple Inc. Sapphire component with residual compressive stress
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
CN104145320B (zh) 2013-02-12 2018-02-02 苹果公司 多步骤离子注入
CN105142853B (zh) * 2013-02-28 2017-07-04 Ipg光子公司 用于加工蓝宝石的激光系统和方法
US10286487B2 (en) * 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
US9416442B2 (en) 2013-03-02 2016-08-16 Apple Inc. Sapphire property modification through ion implantation
US9508570B2 (en) * 2013-10-21 2016-11-29 Asm Technology Singapore Pte Ltd Singulation apparatus and method
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10343237B2 (en) 2014-02-28 2019-07-09 Ipg Photonics Corporation System and method for laser beveling and/or polishing
US9764427B2 (en) 2014-02-28 2017-09-19 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
EP3110592B1 (en) 2014-02-28 2020-01-15 IPG Photonics Corporation Multple-laser distinct wavelengths and pulse durations processing
JP6269830B2 (ja) * 2014-06-11 2018-01-31 株式会社Ihi 脆性材料基板の割断方法及び脆性材料基板の割断装置
KR101881708B1 (ko) * 2014-07-03 2018-07-24 신닛테츠스미킨 카부시키카이샤 레이저 가공 장치
CN106687419A (zh) 2014-07-08 2017-05-17 康宁股份有限公司 用于激光处理材料的方法和设备
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
EP3169635B2 (en) 2014-07-14 2025-11-12 4JET microtech GmbH Method and system for forming perforations
JP6788571B2 (ja) 2014-07-14 2020-11-25 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
CN114603249A (zh) 2014-08-28 2022-06-10 Ipg光子公司 用于切割和切割后加工硬质电介质材料的多激光器系统和方法
WO2016033494A1 (en) 2014-08-28 2016-03-03 Ipg Photonics Corporation System and method for laser beveling and/or polishing
JP6303950B2 (ja) * 2014-09-19 2018-04-04 旭硝子株式会社 ガラス板の加工方法
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
WO2016125609A1 (ja) * 2015-02-03 2016-08-11 セントラル硝子株式会社 脆性材料の切断方法、脆性材料の切断装置、切断脆性材料の製造方法及び切断脆性材料
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
US10280504B2 (en) 2015-09-25 2019-05-07 Apple Inc. Ion-implanted, anti-reflective layer formed within sapphire material
DE102016000051A1 (de) 2016-01-05 2017-07-06 Siltectra Gmbh Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
EP4166270B1 (de) 2016-03-22 2024-10-16 Siltectra GmbH Verfahren zum abtrennen durch laserbestrahlung einer festkörperschicht von einem festkörper
KR20220078719A (ko) 2016-05-06 2022-06-10 코닝 인코포레이티드 투명 기판들로부터의 윤곽 형상들의 레이저 절단 및 제거
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
WO2018108938A1 (de) 2016-12-12 2018-06-21 Siltectra Gmbh Verfahren zum dünnen von mit bauteilen versehenen festkörperschichten
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
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US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN110293310A (zh) * 2018-03-22 2019-10-01 孟晋科技股份有限公司 避免铝分子渗入镀铝硅高张力钢板焊道的加工方法
TWI706614B (zh) * 2018-11-10 2020-10-01 鴻超環保能源股份有限公司 雷射光源模組
CN109680448B (zh) * 2019-01-21 2024-04-19 苏州大喆智能科技有限公司 一种切线热粘装置
CN112828474B (zh) * 2020-12-31 2022-07-05 武汉华工激光工程有限责任公司 用于透明脆性材料的斜向切割补偿方法及系统
JP7713186B2 (ja) * 2021-08-18 2025-07-25 エンシュウ株式会社 レーザ加工装置
US12387307B2 (en) 2022-10-26 2025-08-12 Saudi Arabian Oil Company Determining severity of stepwise cracking in a pressurized vessel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2178584Y (zh) * 1993-11-09 1994-10-05 北京工业大学 可产生宽带激光束的转镜装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置
CN1529648A (zh) * 2001-07-16 2004-09-15 三星宝石工业株式会社 脆性材料基板的划线装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3195050B2 (ja) 1992-06-18 2001-08-06 マツダ株式会社 エンジンの吸入空気量検出装置
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
WO1997007927A1 (en) * 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
US6407360B1 (en) * 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
AU1096701A (en) * 1999-11-12 2001-06-06 P.T.G. Precision Technology Center Llc Laser glass cutting with super cooled gas chill
KR100631304B1 (ko) * 1999-12-24 2006-10-04 삼성전자주식회사 레이저 빔을 이용한 유리기판 절단 장치 및 그 방법
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
JP3802442B2 (ja) * 2000-12-01 2006-07-26 エルジー電子株式会社 ガラス切断方法および装置
TW583046B (en) * 2001-08-10 2004-04-11 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing brittle material substrate
JP2005231035A (ja) * 2001-08-23 2005-09-02 Mitsuboshi Diamond Industrial Co Ltd 脆性材料の加工方法及び加工装置
KR100794284B1 (ko) * 2001-09-29 2008-01-11 삼성전자주식회사 비금속 기판 절단 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2178584Y (zh) * 1993-11-09 1994-10-05 北京工业大学 可产生宽带激光束的转镜装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
CN1529648A (zh) * 2001-07-16 2004-09-15 三星宝石工业株式会社 脆性材料基板的划线装置
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107755904A (zh) * 2013-03-21 2018-03-06 康宁激光技术有限公司 借助激光从平坦基板中切割轮廓的设备及方法
CN107755904B (zh) * 2013-03-21 2020-03-13 康宁激光技术有限公司 借助激光从平坦基板中切割轮廓的设备及方法

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ATE520495T1 (de) 2011-09-15
EP1806202A4 (en) 2009-05-06
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