CN100468793C - 使用氮化物半导体的发光器件和其制造方法 - Google Patents

使用氮化物半导体的发光器件和其制造方法 Download PDF

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Publication number
CN100468793C
CN100468793C CNB2004800003288A CN200480000328A CN100468793C CN 100468793 C CN100468793 C CN 100468793C CN B2004800003288 A CNB2004800003288 A CN B2004800003288A CN 200480000328 A CN200480000328 A CN 200480000328A CN 100468793 C CN100468793 C CN 100468793C
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layer
gan
mixes
contact electrode
electrode contact
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Expired - Fee Related
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CN1698212A (zh
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李昔宪
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/815Bodies having stress relaxation structures, e.g. buffer layers

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CNB2004800003288A 2003-06-25 2004-06-21 使用氮化物半导体的发光器件和其制造方法 Expired - Fee Related CN100468793C (zh)

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KR1020030041409 2003-06-25
KR10-2003-0041409A KR100525545B1 (ko) 2003-06-25 2003-06-25 질화물 반도체 발광소자 및 그 제조방법

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CN1698212A CN1698212A (zh) 2005-11-16
CN100468793C true CN100468793C (zh) 2009-03-11

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CN200710196586.3A Expired - Fee Related CN101179106B (zh) 2003-06-25 2004-06-21 使用氮化物半导体的发光器件和其制造方法

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US (2) US7193236B2 (enExample)
EP (1) EP1636858B1 (enExample)
JP (2) JP2006510234A (enExample)
KR (1) KR100525545B1 (enExample)
CN (2) CN100468793C (enExample)
DE (1) DE202004021874U1 (enExample)
WO (1) WO2004114421A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107464863A (zh) * 2012-10-09 2017-12-12 佳能株式会社 氮化物半导体发光器件及其制作方法

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100583163B1 (ko) * 2002-08-19 2006-05-23 엘지이노텍 주식회사 질화물 반도체 및 그 제조방법
KR100525545B1 (ko) * 2003-06-25 2005-10-31 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
KR100641989B1 (ko) 2003-10-15 2006-11-02 엘지이노텍 주식회사 질화물 반도체 발광소자
KR100661708B1 (ko) 2004-10-19 2006-12-26 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
US20060267043A1 (en) * 2005-05-27 2006-11-30 Emerson David T Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
KR100918968B1 (ko) * 2005-05-30 2009-09-25 갤럭시아포토닉스 주식회사 초접촉층을 구비한 질화갈륨 소자 제작방법 및 그 소자
US7847279B2 (en) * 2005-07-06 2010-12-07 Lg Innotek Co., Ltd. Nitride semiconductor LED and fabrication method thereof
KR101241477B1 (ko) * 2006-01-27 2013-03-08 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조 방법
EP1821347B1 (en) * 2006-02-16 2018-01-03 LG Electronics Inc. Light emitting device having vertical structure and method for manufacturing the same
US20080149946A1 (en) 2006-12-22 2008-06-26 Philips Lumileds Lighting Company, Llc Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light
KR100910365B1 (ko) * 2007-06-11 2009-08-04 고려대학교 산학협력단 수직형 질화물계 발광소자 및 그 제조방법
JP2009016467A (ja) * 2007-07-03 2009-01-22 Sony Corp 窒化ガリウム系半導体素子及びこれを用いた光学装置並びにこれを用いた画像表示装置
KR100864609B1 (ko) * 2007-07-04 2008-10-22 우리엘에스티 주식회사 화합물 반도체를 이용한 발광소자
KR100997908B1 (ko) * 2008-09-10 2010-12-02 박은현 3족 질화물 반도체 발광소자
US20100123119A1 (en) * 2008-11-20 2010-05-20 Seoul Opto Device Co., Ltd. Light emitting diode having indium nitride
KR101507130B1 (ko) * 2008-11-20 2015-03-30 서울바이오시스 주식회사 초격자층을 갖는 발광 다이오드
US8992558B2 (en) 2008-12-18 2015-03-31 Osteomed, Llc Lateral access system for the lumbar spine
DE102009040438A1 (de) * 2009-07-24 2011-01-27 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper mit einer Quantentopfstruktur
KR101710892B1 (ko) * 2010-11-16 2017-02-28 엘지이노텍 주식회사 발광소자
KR101285527B1 (ko) * 2012-05-11 2013-07-17 엘지전자 주식회사 발광 다이오드
KR102014172B1 (ko) * 2012-08-07 2019-08-26 엘지이노텍 주식회사 자외선 발광 소자 및 발광 소자 패키지
CN104981854A (zh) 2013-02-11 2015-10-14 格瑞克明尼苏达有限公司 针对流体涂覆机系统的远程监控
US10969805B2 (en) 2013-02-11 2021-04-06 Graco Minnesota Inc. Paint sprayer distributed control and output volume monitoring architectures
US9343626B2 (en) 2013-03-15 2016-05-17 Soitec Semiconductor structures having active regions comprising InGaN, methods of forming such semiconductor structures, and light emitting devices formed from such semiconductor structures
TWI626765B (zh) * 2013-03-15 2018-06-11 梭意泰科公司 具有包含InGaN之作用區域之半導體結構、形成此等半導體結構之方法及由此等半導體結構所形成之發光裝置
FR3003397B1 (fr) 2013-03-15 2016-07-22 Soitec Silicon On Insulator Structures semi-conductrices dotées de régions actives comprenant de l'INGAN
KR102120682B1 (ko) * 2013-03-15 2020-06-17 소이텍 InGaN을 포함하는 활성 영역을 가지는 반도체 구조, 그와 같은 반도체 구조를 형성하는 방법, 및 그와 같은 반도체 구조로부터 형성되는 발광 장치
WO2014140371A1 (en) * 2013-03-15 2014-09-18 Soitec Semiconductor structures having active regions comprising ingan, methods of forming such semiconductor structures, and light emitting devices formed from such semiconductor structures
TWI593135B (zh) 2013-03-15 2017-07-21 索泰克公司 具有含氮化銦鎵之主動區域之半導體結構,形成此等半導體結構之方法,以及應用此等半導體結構形成之發光元件
CN103779467A (zh) * 2014-01-14 2014-05-07 江苏新广联科技股份有限公司 可提高发光效率的外延PGaN层生长结构
CN104300047B (zh) * 2014-10-11 2017-06-23 华芯半导体科技有限公司 一种Si基GaN的LED结构及其制作方法
CN105355741B (zh) * 2015-11-02 2017-09-29 厦门市三安光电科技有限公司 一种led外延结构及制作方法
WO2018039228A1 (en) 2016-08-23 2018-03-01 Stryker European Holdings I, Llc Instrumentation for the implantation of spinal implants
CN106856217A (zh) * 2016-12-27 2017-06-16 圆融光电科技股份有限公司 N型超晶格接触层的生长方法
CN107195736B (zh) * 2017-05-27 2019-12-31 华灿光电(浙江)有限公司 一种氮化镓基发光二极管外延片及其生长方法
US10372363B2 (en) * 2017-09-14 2019-08-06 International Business Machines Corporation Thin provisioning using cloud based ranks
JPWO2019188318A1 (ja) * 2018-03-26 2021-04-08 パナソニック株式会社 半導体発光素子
EP3545857B1 (en) 2018-03-30 2024-01-03 Stryker European Operations Holdings LLC Lateral access retractor and core insertion
JP2020021798A (ja) * 2018-07-31 2020-02-06 日機装株式会社 窒化物半導体発光素子及びその製造方法
CN113906574B (zh) 2019-06-10 2025-05-30 苏州晶湛半导体有限公司 半导体结构和半导体结构的制备方法
CN110707187B (zh) * 2019-08-21 2021-01-29 华灿光电(苏州)有限公司 小间距发光二极管的外延片及其制造方法
US11564674B2 (en) 2019-11-27 2023-01-31 K2M, Inc. Lateral access system and method of use
TW202201807A (zh) * 2020-05-19 2022-01-01 美商瑞克斯姆股份有限公司 用於發光元件之應變管理層之組合
CN117476827B (zh) * 2023-12-25 2024-04-26 江西兆驰半导体有限公司 一种低接触电阻的发光二极管的外延片及其制备方法
CN117457824B (zh) * 2023-12-25 2024-03-12 江西兆驰半导体有限公司 一种发光二极管外延片及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153894A (en) * 1998-11-12 2000-11-28 Showa Denko Kabushiki Kaisha Group-III nitride semiconductor light-emitting device
JP2002111133A (ja) * 2000-09-28 2002-04-12 Nichia Chem Ind Ltd 窒化物半導体発光素子

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2828002B2 (ja) * 1995-01-19 1998-11-25 松下電器産業株式会社 半導体発光素子およびその製造方法
EP0762516B1 (en) * 1995-08-28 1999-04-21 Mitsubishi Cable Industries, Ltd. Group-III nitride based light emitter
JPH09232629A (ja) * 1996-02-26 1997-09-05 Toshiba Corp 半導体素子
JPH09304272A (ja) * 1996-05-10 1997-11-28 Fuji Electric Co Ltd 液体の吸光度測定装置
JP3753793B2 (ja) * 1996-06-14 2006-03-08 豊田合成株式会社 3族窒化物化合物半導体発光素子
JPH10189944A (ja) * 1996-12-24 1998-07-21 Furukawa Electric Co Ltd:The 高電子移動度トランジスタ
US6677619B1 (en) * 1997-01-09 2004-01-13 Nichia Chemical Industries, Ltd. Nitride semiconductor device
JPH10214999A (ja) 1997-01-30 1998-08-11 Toyota Central Res & Dev Lab Inc Iii−v族窒化物半導体素子
JPH10303458A (ja) 1997-04-24 1998-11-13 Toyoda Gosei Co Ltd 窒化ガリウム系化合物半導体素子
US6266355B1 (en) * 1997-09-12 2001-07-24 Sdl, Inc. Group III-V nitride laser devices with cladding layers to suppress defects such as cracking
JP3080155B2 (ja) * 1997-11-05 2000-08-21 サンケン電気株式会社 窒化ガリウム半導体層を有する半導体装置及びその製造方法
JP3680558B2 (ja) * 1998-05-25 2005-08-10 日亜化学工業株式会社 窒化物半導体素子
AU2746899A (en) 1998-03-12 1999-09-27 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US6194742B1 (en) * 1998-06-05 2001-02-27 Lumileds Lighting, U.S., Llc Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices
US6608330B1 (en) * 1998-09-21 2003-08-19 Nichia Corporation Light emitting device
JP3551101B2 (ja) * 1999-03-29 2004-08-04 日亜化学工業株式会社 窒化物半導体素子
US6838705B1 (en) * 1999-03-29 2005-01-04 Nichia Corporation Nitride semiconductor device
JP3763701B2 (ja) * 1999-05-17 2006-04-05 株式会社東芝 窒化ガリウム系半導体発光素子
JP3719047B2 (ja) * 1999-06-07 2005-11-24 日亜化学工業株式会社 窒化物半導体素子
JP3609661B2 (ja) * 1999-08-19 2005-01-12 株式会社東芝 半導体発光素子
JP3497790B2 (ja) * 1999-11-29 2004-02-16 星和電機株式会社 P型窒化ガリウム系半導体の製造方法及びp型窒化ガリウム系半導体を用いた発光素子
JP2001185493A (ja) * 1999-12-24 2001-07-06 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子
US6906352B2 (en) * 2001-01-16 2005-06-14 Cree, Inc. Group III nitride LED with undoped cladding layer and multiple quantum well
TW493287B (en) * 2001-05-30 2002-07-01 Epistar Corp Light emitting diode structure with non-conductive substrate
US6958497B2 (en) * 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
CN101834245B (zh) * 2001-06-15 2013-05-22 克里公司 在SiC衬底上形成的GaN基LED
JP2003110197A (ja) * 2001-09-28 2003-04-11 Toshiba Corp 窒化物半導体発光装置、窒化物半導体装置及びその製造方法
US6833564B2 (en) * 2001-11-02 2004-12-21 Lumileds Lighting U.S., Llc Indium gallium nitride separate confinement heterostructure light emitting devices
JP4150527B2 (ja) 2002-02-27 2008-09-17 日鉱金属株式会社 結晶の製造方法
US6720570B2 (en) * 2002-04-17 2004-04-13 Tekcore Co., Ltd. Gallium nitride-based semiconductor light emitting device
US7058105B2 (en) * 2002-10-17 2006-06-06 Samsung Electro-Mechanics Co., Ltd. Semiconductor optoelectronic device
KR100525545B1 (ko) * 2003-06-25 2005-10-31 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153894A (en) * 1998-11-12 2000-11-28 Showa Denko Kabushiki Kaisha Group-III nitride semiconductor light-emitting device
JP2002111133A (ja) * 2000-09-28 2002-04-12 Nichia Chem Ind Ltd 窒化物半導体発光素子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107464863A (zh) * 2012-10-09 2017-12-12 佳能株式会社 氮化物半导体发光器件及其制作方法
CN107464863B (zh) * 2012-10-09 2020-02-11 佳能株式会社 氮化物半导体发光器件及其制作方法

Also Published As

Publication number Publication date
EP1636858B1 (en) 2016-11-16
JP2006510234A (ja) 2006-03-23
CN101179106B (zh) 2013-01-23
WO2004114421A1 (en) 2004-12-29
JP2008182284A (ja) 2008-08-07
US7193236B2 (en) 2007-03-20
DE202004021874U1 (de) 2012-01-18
US7691657B2 (en) 2010-04-06
KR100525545B1 (ko) 2005-10-31
EP1636858A4 (en) 2007-01-24
EP1636858A1 (en) 2006-03-22
US20050236631A1 (en) 2005-10-27
US20060081831A1 (en) 2006-04-20
KR20050000846A (ko) 2005-01-06
CN101179106A (zh) 2008-05-14
CN1698212A (zh) 2005-11-16

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