JP2006510234A5 - - Google Patents
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- JP2006510234A5 JP2006510234A5 JP2005518142A JP2005518142A JP2006510234A5 JP 2006510234 A5 JP2006510234 A5 JP 2006510234A5 JP 2005518142 A JP2005518142 A JP 2005518142A JP 2005518142 A JP2005518142 A JP 2005518142A JP 2006510234 A5 JP2006510234 A5 JP 2006510234A5
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- Prior art keywords
- layer
- compound semiconductor
- nitride
- electrode contact
- gan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 85
- 150000004767 nitrides Chemical class 0.000 claims description 76
- 150000001875 compounds Chemical class 0.000 claims description 75
- 229910052738 indium Inorganic materials 0.000 claims description 49
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 39
- 230000004888 barrier function Effects 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 description 27
- 230000007547 defect Effects 0.000 description 14
- 239000011777 magnesium Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0041409A KR100525545B1 (ko) | 2003-06-25 | 2003-06-25 | 질화물 반도체 발광소자 및 그 제조방법 |
| PCT/KR2004/001480 WO2004114421A1 (en) | 2003-06-25 | 2004-06-21 | A light emitting device using nitride semiconductor and fabrication method of the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008111431A Division JP2008182284A (ja) | 2003-06-25 | 2008-04-22 | 窒化物半導体の発光素子及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006510234A JP2006510234A (ja) | 2006-03-23 |
| JP2006510234A5 true JP2006510234A5 (enExample) | 2009-01-08 |
Family
ID=36165438
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005518142A Pending JP2006510234A (ja) | 2003-06-25 | 2004-06-21 | 窒化物半導体の発光素子及びその製造方法 |
| JP2008111431A Pending JP2008182284A (ja) | 2003-06-25 | 2008-04-22 | 窒化物半導体の発光素子及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008111431A Pending JP2008182284A (ja) | 2003-06-25 | 2008-04-22 | 窒化物半導体の発光素子及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7193236B2 (enExample) |
| EP (1) | EP1636858B1 (enExample) |
| JP (2) | JP2006510234A (enExample) |
| KR (1) | KR100525545B1 (enExample) |
| CN (2) | CN100468793C (enExample) |
| DE (1) | DE202004021874U1 (enExample) |
| WO (1) | WO2004114421A1 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100583163B1 (ko) * | 2002-08-19 | 2006-05-23 | 엘지이노텍 주식회사 | 질화물 반도체 및 그 제조방법 |
| KR100525545B1 (ko) * | 2003-06-25 | 2005-10-31 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| KR100641989B1 (ko) | 2003-10-15 | 2006-11-02 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 |
| KR100661708B1 (ko) * | 2004-10-19 | 2006-12-26 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| US20060267043A1 (en) * | 2005-05-27 | 2006-11-30 | Emerson David T | Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices |
| KR100918968B1 (ko) * | 2005-05-30 | 2009-09-25 | 갤럭시아포토닉스 주식회사 | 초접촉층을 구비한 질화갈륨 소자 제작방법 및 그 소자 |
| JP2008545266A (ja) * | 2005-07-06 | 2008-12-11 | エルジー イノテック カンパニー リミテッド | 窒化物半導体led及びその製造方法 |
| KR101241477B1 (ko) | 2006-01-27 | 2013-03-08 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조 방법 |
| EP1821347B1 (en) * | 2006-02-16 | 2018-01-03 | LG Electronics Inc. | Light emitting device having vertical structure and method for manufacturing the same |
| US20080149946A1 (en) * | 2006-12-22 | 2008-06-26 | Philips Lumileds Lighting Company, Llc | Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light |
| KR100910365B1 (ko) * | 2007-06-11 | 2009-08-04 | 고려대학교 산학협력단 | 수직형 질화물계 발광소자 및 그 제조방법 |
| JP2009016467A (ja) * | 2007-07-03 | 2009-01-22 | Sony Corp | 窒化ガリウム系半導体素子及びこれを用いた光学装置並びにこれを用いた画像表示装置 |
| KR100864609B1 (ko) * | 2007-07-04 | 2008-10-22 | 우리엘에스티 주식회사 | 화합물 반도체를 이용한 발광소자 |
| KR100997908B1 (ko) * | 2008-09-10 | 2010-12-02 | 박은현 | 3족 질화물 반도체 발광소자 |
| US20100123119A1 (en) * | 2008-11-20 | 2010-05-20 | Seoul Opto Device Co., Ltd. | Light emitting diode having indium nitride |
| KR101507130B1 (ko) * | 2008-11-20 | 2015-03-30 | 서울바이오시스 주식회사 | 초격자층을 갖는 발광 다이오드 |
| US8992558B2 (en) | 2008-12-18 | 2015-03-31 | Osteomed, Llc | Lateral access system for the lumbar spine |
| DE102009040438A1 (de) * | 2009-07-24 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper mit einer Quantentopfstruktur |
| KR101710892B1 (ko) * | 2010-11-16 | 2017-02-28 | 엘지이노텍 주식회사 | 발광소자 |
| KR101285527B1 (ko) * | 2012-05-11 | 2013-07-17 | 엘지전자 주식회사 | 발광 다이오드 |
| KR102014172B1 (ko) * | 2012-08-07 | 2019-08-26 | 엘지이노텍 주식회사 | 자외선 발광 소자 및 발광 소자 패키지 |
| JP6223075B2 (ja) * | 2012-10-09 | 2017-11-01 | キヤノン株式会社 | 発光素子の製造方法及び発光素子 |
| US10969805B2 (en) | 2013-02-11 | 2021-04-06 | Graco Minnesota Inc. | Paint sprayer distributed control and output volume monitoring architectures |
| KR20150130978A (ko) | 2013-02-11 | 2015-11-24 | 그라코 미네소타 인크. | 유체 도포기 시스템을 위한 원격 모니터링 |
| JP2016517627A (ja) * | 2013-03-15 | 2016-06-16 | ソイテックSoitec | InGaNを含んでいる活性領域を有している半導体構造、このような半導体構造を形成する方法、及びこのような半導体構造から形成された発光デバイス |
| KR20150130331A (ko) * | 2013-03-15 | 2015-11-23 | 소이텍 | Ingan을 포함하는 활성 영역을 가지는 발광 다이오드 반도체 구조 |
| TWI593135B (zh) | 2013-03-15 | 2017-07-21 | 索泰克公司 | 具有含氮化銦鎵之主動區域之半導體結構,形成此等半導體結構之方法,以及應用此等半導體結構形成之發光元件 |
| FR3003397B1 (fr) | 2013-03-15 | 2016-07-22 | Soitec Silicon On Insulator | Structures semi-conductrices dotées de régions actives comprenant de l'INGAN |
| TWI626765B (zh) * | 2013-03-15 | 2018-06-11 | 梭意泰科公司 | 具有包含InGaN之作用區域之半導體結構、形成此等半導體結構之方法及由此等半導體結構所形成之發光裝置 |
| TWI648872B (zh) * | 2013-03-15 | 2019-01-21 | 法商梭意泰科公司 | 具有包含InGaN之作用區域之半導體結構、形成此等半導體結構之方法及由此等半導體結構所形成之發光裝置 |
| CN103779467A (zh) * | 2014-01-14 | 2014-05-07 | 江苏新广联科技股份有限公司 | 可提高发光效率的外延PGaN层生长结构 |
| CN104300047B (zh) * | 2014-10-11 | 2017-06-23 | 华芯半导体科技有限公司 | 一种Si基GaN的LED结构及其制作方法 |
| CN105355741B (zh) * | 2015-11-02 | 2017-09-29 | 厦门市三安光电科技有限公司 | 一种led外延结构及制作方法 |
| EP3503814B1 (en) | 2016-08-23 | 2024-07-10 | Stryker European Operations Holdings LLC | Instrumentation for the implantation of spinal implants |
| CN106856217A (zh) * | 2016-12-27 | 2017-06-16 | 圆融光电科技股份有限公司 | N型超晶格接触层的生长方法 |
| CN107195736B (zh) * | 2017-05-27 | 2019-12-31 | 华灿光电(浙江)有限公司 | 一种氮化镓基发光二极管外延片及其生长方法 |
| US10372363B2 (en) * | 2017-09-14 | 2019-08-06 | International Business Machines Corporation | Thin provisioning using cloud based ranks |
| JPWO2019188318A1 (ja) * | 2018-03-26 | 2021-04-08 | パナソニック株式会社 | 半導体発光素子 |
| EP3545857B1 (en) | 2018-03-30 | 2024-01-03 | Stryker European Operations Holdings LLC | Lateral access retractor and core insertion |
| JP2020021798A (ja) * | 2018-07-31 | 2020-02-06 | 日機装株式会社 | 窒化物半導体発光素子及びその製造方法 |
| CN113906574B (zh) | 2019-06-10 | 2025-05-30 | 苏州晶湛半导体有限公司 | 半导体结构和半导体结构的制备方法 |
| CN110707187B (zh) * | 2019-08-21 | 2021-01-29 | 华灿光电(苏州)有限公司 | 小间距发光二极管的外延片及其制造方法 |
| US11564674B2 (en) | 2019-11-27 | 2023-01-31 | K2M, Inc. | Lateral access system and method of use |
| TW202201807A (zh) * | 2020-05-19 | 2022-01-01 | 美商瑞克斯姆股份有限公司 | 用於發光元件之應變管理層之組合 |
| CN117476827B (zh) * | 2023-12-25 | 2024-04-26 | 江西兆驰半导体有限公司 | 一种低接触电阻的发光二极管的外延片及其制备方法 |
| CN117457824B (zh) * | 2023-12-25 | 2024-03-12 | 江西兆驰半导体有限公司 | 一种发光二极管外延片及其制备方法 |
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| JP2828002B2 (ja) * | 1995-01-19 | 1998-11-25 | 松下電器産業株式会社 | 半導体発光素子およびその製造方法 |
| EP0762516B1 (en) * | 1995-08-28 | 1999-04-21 | Mitsubishi Cable Industries, Ltd. | Group-III nitride based light emitter |
| JPH09232629A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 半導体素子 |
| JPH09304272A (ja) * | 1996-05-10 | 1997-11-28 | Fuji Electric Co Ltd | 液体の吸光度測定装置 |
| JP3753793B2 (ja) | 1996-06-14 | 2006-03-08 | 豊田合成株式会社 | 3族窒化物化合物半導体発光素子 |
| JPH10189944A (ja) * | 1996-12-24 | 1998-07-21 | Furukawa Electric Co Ltd:The | 高電子移動度トランジスタ |
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| JPH10214999A (ja) * | 1997-01-30 | 1998-08-11 | Toyota Central Res & Dev Lab Inc | Iii−v族窒化物半導体素子 |
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| JP3680558B2 (ja) * | 1998-05-25 | 2005-08-10 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6194742B1 (en) | 1998-06-05 | 2001-02-27 | Lumileds Lighting, U.S., Llc | Strain engineered and impurity controlled III-V nitride semiconductor films and optoelectronic devices |
| US6608330B1 (en) * | 1998-09-21 | 2003-08-19 | Nichia Corporation | Light emitting device |
| US6153894A (en) * | 1998-11-12 | 2000-11-28 | Showa Denko Kabushiki Kaisha | Group-III nitride semiconductor light-emitting device |
| US6838705B1 (en) * | 1999-03-29 | 2005-01-04 | Nichia Corporation | Nitride semiconductor device |
| JP3551101B2 (ja) * | 1999-03-29 | 2004-08-04 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3763701B2 (ja) * | 1999-05-17 | 2006-04-05 | 株式会社東芝 | 窒化ガリウム系半導体発光素子 |
| JP3719047B2 (ja) * | 1999-06-07 | 2005-11-24 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP3609661B2 (ja) * | 1999-08-19 | 2005-01-12 | 株式会社東芝 | 半導体発光素子 |
| JP3497790B2 (ja) * | 1999-11-29 | 2004-02-16 | 星和電機株式会社 | P型窒化ガリウム系半導体の製造方法及びp型窒化ガリウム系半導体を用いた発光素子 |
| JP2001185493A (ja) * | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 |
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| KR100525545B1 (ko) * | 2003-06-25 | 2005-10-31 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
-
2003
- 2003-06-25 KR KR10-2003-0041409A patent/KR100525545B1/ko not_active Expired - Fee Related
-
2004
- 2004-06-21 DE DE202004021874U patent/DE202004021874U1/de not_active Expired - Lifetime
- 2004-06-21 CN CNB2004800003288A patent/CN100468793C/zh not_active Expired - Fee Related
- 2004-06-21 US US10/517,819 patent/US7193236B2/en not_active Expired - Lifetime
- 2004-06-21 JP JP2005518142A patent/JP2006510234A/ja active Pending
- 2004-06-21 WO PCT/KR2004/001480 patent/WO2004114421A1/en not_active Ceased
- 2004-06-21 CN CN200710196586.3A patent/CN101179106B/zh not_active Expired - Fee Related
- 2004-06-21 EP EP04737100.0A patent/EP1636858B1/en not_active Expired - Lifetime
-
2005
- 2005-11-29 US US11/288,310 patent/US7691657B2/en not_active Expired - Lifetime
-
2008
- 2008-04-22 JP JP2008111431A patent/JP2008182284A/ja active Pending
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