CN100466312C - 半导体发光器件制造方法 - Google Patents

半导体发光器件制造方法 Download PDF

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Publication number
CN100466312C
CN100466312C CNB2007100047826A CN200710004782A CN100466312C CN 100466312 C CN100466312 C CN 100466312C CN B2007100047826 A CNB2007100047826 A CN B2007100047826A CN 200710004782 A CN200710004782 A CN 200710004782A CN 100466312 C CN100466312 C CN 100466312C
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CN
China
Prior art keywords
lead frame
metal body
led chip
light emitting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007100047826A
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English (en)
Chinese (zh)
Other versions
CN1992365A (zh
Inventor
竹中靖二
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Sharp Corp
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Sharp Corp
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Filing date
Publication date
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Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN1992365A publication Critical patent/CN1992365A/zh
Application granted granted Critical
Publication of CN100466312C publication Critical patent/CN100466312C/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Led Device Packages (AREA)
CNB2007100047826A 2003-01-06 2003-12-12 半导体发光器件制造方法 Expired - Fee Related CN100466312C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003000216A JP3910144B2 (ja) 2003-01-06 2003-01-06 半導体発光装置およびその製造方法
JP2003000216 2003-01-06

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101205693A Division CN1306626C (zh) 2003-01-06 2003-12-12 半导体发光器件

Publications (2)

Publication Number Publication Date
CN1992365A CN1992365A (zh) 2007-07-04
CN100466312C true CN100466312C (zh) 2009-03-04

Family

ID=32708764

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2007100047826A Expired - Fee Related CN100466312C (zh) 2003-01-06 2003-12-12 半导体发光器件制造方法
CNB2003101205693A Expired - Fee Related CN1306626C (zh) 2003-01-06 2003-12-12 半导体发光器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB2003101205693A Expired - Fee Related CN1306626C (zh) 2003-01-06 2003-12-12 半导体发光器件

Country Status (3)

Country Link
US (1) US7012277B2 (enExample)
JP (1) JP3910144B2 (enExample)
CN (2) CN100466312C (enExample)

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* Cited by examiner, † Cited by third party
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JP4174823B2 (ja) * 2003-03-27 2008-11-05 サンケン電気株式会社 半導体発光装置
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CN100340008C (zh) * 2004-09-30 2007-09-26 中国科学院半导体研究所 背孔结构氮化镓基发光二极管的制作方法
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Also Published As

Publication number Publication date
US20040135156A1 (en) 2004-07-15
JP2004214436A (ja) 2004-07-29
CN1518135A (zh) 2004-08-04
JP3910144B2 (ja) 2007-04-25
US7012277B2 (en) 2006-03-14
CN1306626C (zh) 2007-03-21
CN1992365A (zh) 2007-07-04

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