CN100466216C - 运送处理装置 - Google Patents

运送处理装置 Download PDF

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Publication number
CN100466216C
CN100466216C CNB2006101498503A CN200610149850A CN100466216C CN 100466216 C CN100466216 C CN 100466216C CN B2006101498503 A CNB2006101498503 A CN B2006101498503A CN 200610149850 A CN200610149850 A CN 200610149850A CN 100466216 C CN100466216 C CN 100466216C
Authority
CN
China
Prior art keywords
substrate
decompression chamber
unit
chamber
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101498503A
Other languages
English (en)
Chinese (zh)
Other versions
CN1959951A (zh
Inventor
岛井太
河田茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN1959951A publication Critical patent/CN1959951A/zh
Application granted granted Critical
Publication of CN100466216C publication Critical patent/CN100466216C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CNB2006101498503A 2005-10-31 2006-10-27 运送处理装置 Expired - Fee Related CN100466216C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005316881 2005-10-31
JP2005316881A JP4817802B2 (ja) 2005-10-31 2005-10-31 搬送処理装置

Publications (2)

Publication Number Publication Date
CN1959951A CN1959951A (zh) 2007-05-09
CN100466216C true CN100466216C (zh) 2009-03-04

Family

ID=38071554

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101498503A Expired - Fee Related CN100466216C (zh) 2005-10-31 2006-10-27 运送处理装置

Country Status (4)

Country Link
JP (1) JP4817802B2 (https=)
KR (1) KR100834702B1 (https=)
CN (1) CN100466216C (https=)
TW (1) TW200746251A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407270B (zh) * 2009-12-30 2013-09-01 Au Optronics Corp 顯影設備
CN101718963B (zh) * 2010-01-14 2011-10-05 友达光电股份有限公司 显影设备
JP5641989B2 (ja) * 2011-03-17 2014-12-17 三菱電機ビルテクノサービス株式会社 フィルタ洗浄装置
CN204544839U (zh) * 2012-11-05 2015-08-12 日本电气硝子株式会社 平板玻璃清洗装置
US20150118012A1 (en) * 2013-10-31 2015-04-30 Lam Research Corporation Wafer entry port with gas concentration attenuators
CN104538332B (zh) * 2014-12-12 2017-06-27 深圳市华星光电技术有限公司 一种湿制程机台的腔室结构
CN116198779A (zh) * 2023-03-31 2023-06-02 西安奕斯伟材料科技股份有限公司 一种用于包装硅片盒的设备及方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08203858A (ja) * 1995-01-31 1996-08-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001135702A (ja) * 1999-11-04 2001-05-18 Canon Inc 基板搬送装置および基板処理装置ならびにデバイス製造方法
US20020020496A1 (en) * 2000-03-22 2002-02-21 Hisato Shinohara Substrate treatment apparatus
CN1503758A (zh) * 2002-02-04 2004-06-09 ס�Ѿ��ܹ�ҵ��ʽ���� 传送式基板处理装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置
JP2005005587A (ja) * 2003-06-13 2005-01-06 Sumitomo Precision Prod Co Ltd レジスト剥離装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11334870A (ja) * 1998-05-26 1999-12-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4056858B2 (ja) * 2001-11-12 2008-03-05 東京エレクトロン株式会社 基板処理装置
KR100904278B1 (ko) * 2001-11-12 2009-06-25 도쿄엘렉트론가부시키가이샤 기판처리장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08203858A (ja) * 1995-01-31 1996-08-09 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001135702A (ja) * 1999-11-04 2001-05-18 Canon Inc 基板搬送装置および基板処理装置ならびにデバイス製造方法
US20020020496A1 (en) * 2000-03-22 2002-02-21 Hisato Shinohara Substrate treatment apparatus
CN1503758A (zh) * 2002-02-04 2004-06-09 ס�Ѿ��ܹ�ҵ��ʽ���� 传送式基板处理装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置
JP2005005587A (ja) * 2003-06-13 2005-01-06 Sumitomo Precision Prod Co Ltd レジスト剥離装置

Also Published As

Publication number Publication date
KR100834702B1 (ko) 2008-06-02
CN1959951A (zh) 2007-05-09
JP4817802B2 (ja) 2011-11-16
JP2007117953A (ja) 2007-05-17
TW200746251A (en) 2007-12-16
KR20070046727A (ko) 2007-05-03
TWI306272B (https=) 2009-02-11

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090304

Termination date: 20171027