KR20070046727A - 반송처리장치 - Google Patents
반송처리장치 Download PDFInfo
- Publication number
- KR20070046727A KR20070046727A KR1020060104941A KR20060104941A KR20070046727A KR 20070046727 A KR20070046727 A KR 20070046727A KR 1020060104941 A KR1020060104941 A KR 1020060104941A KR 20060104941 A KR20060104941 A KR 20060104941A KR 20070046727 A KR20070046727 A KR 20070046727A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- chamber
- liquid
- decompression chamber
- developer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Abstract
Description
Claims (3)
- 기판을 반송하면서 상기 기판에 대해 각종 처리를 행하는 반송처리장치에 있어서,상기 기판면에 처리액을 공급하는 웨트 유닛이 삽입되고, 상기 웨트 유닛에 인접하여 또는 상기 웨트 유닛을 둘러싸듯이 감압 챔버가 설치되며,상기 감압 챔버에는 상기 기판의 반입구 및 반출구가 형성되고, 상기 반입구 및 반출구 중 적어도 한쪽의 위 가장자리부가 상기 기판 표면에 공급된 처리액에 접촉하지 않는 범위에서 낮게 설정되며, 또한 상기 감압 챔버의 저부에는 상기 기판으로부터 낙하된 처리액의 회수구가 형성되어 있는 것을 특징으로 하는 반송처리장치.
- 제1항의 반송처리장치에 있어서, 상기 웨트 유닛은 현상액의 공급 유닛인 것을 특징으로 하는 반송처리장치.
- 제1항의 반송처리장치에 있어서, 상기 웨트 유닛은 세정 유닛인 것을 특징으로 하는 기판의 반송처리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00316881 | 2005-10-31 | ||
JP2005316881A JP4817802B2 (ja) | 2005-10-31 | 2005-10-31 | 搬送処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070046727A true KR20070046727A (ko) | 2007-05-03 |
KR100834702B1 KR100834702B1 (ko) | 2008-06-02 |
Family
ID=38071554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060104941A KR100834702B1 (ko) | 2005-10-31 | 2006-10-27 | 반송처리장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4817802B2 (ko) |
KR (1) | KR100834702B1 (ko) |
CN (1) | CN100466216C (ko) |
TW (1) | TW200746251A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407270B (zh) * | 2009-12-30 | 2013-09-01 | Au Optronics Corp | 顯影設備 |
CN101718963B (zh) * | 2010-01-14 | 2011-10-05 | 友达光电股份有限公司 | 显影设备 |
JP5641989B2 (ja) * | 2011-03-17 | 2014-12-17 | 三菱電機ビルテクノサービス株式会社 | フィルタ洗浄装置 |
JPWO2014069577A1 (ja) * | 2012-11-05 | 2016-09-08 | 日本電気硝子株式会社 | 板ガラス洗浄装置および板ガラス洗浄方法 |
US20150118012A1 (en) * | 2013-10-31 | 2015-04-30 | Lam Research Corporation | Wafer entry port with gas concentration attenuators |
CN104538332B (zh) * | 2014-12-12 | 2017-06-27 | 深圳市华星光电技术有限公司 | 一种湿制程机台的腔室结构 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08203858A (ja) * | 1995-01-31 | 1996-08-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH11334870A (ja) * | 1998-05-26 | 1999-12-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2001135702A (ja) * | 1999-11-04 | 2001-05-18 | Canon Inc | 基板搬送装置および基板処理装置ならびにデバイス製造方法 |
JP4316767B2 (ja) * | 2000-03-22 | 2009-08-19 | 株式会社半導体エネルギー研究所 | 基板処理装置 |
JP4056858B2 (ja) * | 2001-11-12 | 2008-03-05 | 東京エレクトロン株式会社 | 基板処理装置 |
KR100904278B1 (ko) * | 2001-11-12 | 2009-06-25 | 도쿄엘렉트론가부시키가이샤 | 기판처리장치 |
JP4044047B2 (ja) * | 2002-02-04 | 2008-02-06 | 住友精密工業株式会社 | 搬送式基板処理装置 |
JP2004299850A (ja) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | 処理方法及び処理装置 |
JP4346967B2 (ja) * | 2003-06-13 | 2009-10-21 | 住友精密工業株式会社 | レジスト剥離装置 |
-
2005
- 2005-10-31 JP JP2005316881A patent/JP4817802B2/ja active Active
-
2006
- 2006-09-14 TW TW095134057A patent/TW200746251A/zh not_active IP Right Cessation
- 2006-10-27 KR KR1020060104941A patent/KR100834702B1/ko active IP Right Grant
- 2006-10-27 CN CNB2006101498503A patent/CN100466216C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4817802B2 (ja) | 2011-11-16 |
CN1959951A (zh) | 2007-05-09 |
KR100834702B1 (ko) | 2008-06-02 |
TWI306272B (ko) | 2009-02-11 |
TW200746251A (en) | 2007-12-16 |
JP2007117953A (ja) | 2007-05-17 |
CN100466216C (zh) | 2009-03-04 |
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