CN100416232C - 光散射euvl掩模 - Google Patents

光散射euvl掩模 Download PDF

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Publication number
CN100416232C
CN100416232C CNB200580014229XA CN200580014229A CN100416232C CN 100416232 C CN100416232 C CN 100416232C CN B200580014229X A CNB200580014229X A CN B200580014229XA CN 200580014229 A CN200580014229 A CN 200580014229A CN 100416232 C CN100416232 C CN 100416232C
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CN
China
Prior art keywords
mask
extreme ultraviolet
semiconductor wafer
silicon layer
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200580014229XA
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English (en)
Chinese (zh)
Other versions
CN1950680A (zh
Inventor
艾米丽·E.·加拉格尔
路易斯·M.·金特
凯里·W.·蒂尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Core Usa Second LLC
GlobalFoundries Inc
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of CN1950680A publication Critical patent/CN1950680A/zh
Application granted granted Critical
Publication of CN100416232C publication Critical patent/CN100416232C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24—Reflection masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062—Devices having a multilayer structure
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00—Arrangements for handling radiation or particles
    • G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/067—Construction details

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laminated Bodies (AREA)
CNB200580014229XA 2004-05-25 2005-05-25 光散射euvl掩模 Expired - Fee Related CN100416232C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/709,733 US7198872B2 (en) 2004-05-25 2004-05-25 Light scattering EUVL mask
US10/709,733 2004-05-25

Publications (2)

Publication Number Publication Date
CN1950680A CN1950680A (zh) 2007-04-18
CN100416232C true CN100416232C (zh) 2008-09-03

Family

ID=35425712

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200580014229XA Expired - Fee Related CN100416232C (zh) 2004-05-25 2005-05-25 光散射euvl掩模

Country Status (7)

Country Link
US (1) US7198872B2 (enExample)
EP (1) EP1753609A4 (enExample)
JP (1) JP5132306B2 (enExample)
KR (1) KR20070013313A (enExample)
CN (1) CN100416232C (enExample)
TW (1) TWI341549B (enExample)
WO (1) WO2005115743A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107367904A (zh) * 2016-04-27 2017-11-21 格罗方德半导体公司 极紫外光的光刻光罩

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TWI278903B (en) * 2005-09-09 2007-04-11 Delta Electronics Inc Microstructure and manufacturing method thereof
US7960701B2 (en) * 2007-12-20 2011-06-14 Cymer, Inc. EUV light source components and methods for producing, using and refurbishing same
KR20110065439A (ko) * 2008-09-05 2011-06-15 아사히 가라스 가부시키가이샤 Ｅｕｖ 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법
KR101576205B1 (ko) * 2008-12-11 2015-12-10 삼성전자주식회사 극자외선 포토마스크, 이를 제조하기 위한 방법 및 장치
WO2010105266A2 (en) 2009-03-13 2010-09-16 University Of Utah Research Foundation Fluid-sparged helical channel reactor and associated methods
CN103034047B (zh) * 2011-09-29 2014-10-29 上海微电子装备有限公司 一种提高分辨率的光刻工艺
JP6079110B2 (ja) * 2012-10-04 2017-02-15 凸版印刷株式会社 反射型フォトマスク
US9612521B2 (en) 2013-03-12 2017-04-04 Applied Materials, Inc. Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
US9632411B2 (en) 2013-03-14 2017-04-25 Applied Materials, Inc. Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor
US9417515B2 (en) 2013-03-14 2016-08-16 Applied Materials, Inc. Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor
US20140272684A1 (en) 2013-03-12 2014-09-18 Applied Materials, Inc. Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor
US9354508B2 (en) 2013-03-12 2016-05-31 Applied Materials, Inc. Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
CN104749871B (zh) * 2013-12-30 2019-09-03 中芯国际集成电路制造(上海)有限公司 用于反射式光刻技术的掩模版、制作方法及其使用方法
KR20160070897A (ko) * 2014-12-10 2016-06-21 삼성전자주식회사 펠리클 맴브레인 및 그의 제조방법
NL2018989A (en) * 2016-06-03 2017-12-05 Asml Netherlands Bv Patterning device
CN110546573B (zh) 2017-04-11 2022-10-04 Asml荷兰有限公司 光刻设备
SG11202103911SA (en) * 2018-10-17 2021-05-28 Astrileux Corp Photomask having reflective layer with non-reflective regions
EP3671342B1 (en) * 2018-12-20 2021-03-17 IMEC vzw Induced stress for euv pellicle tensioning
EP3764163B1 (en) * 2019-07-11 2023-04-12 IMEC vzw An extreme ultraviolet lithography device
DE102020208185B4 (de) 2020-06-30 2025-01-30 Carl Zeiss Smt Gmbh Verfahren und Vorrichtungen zum Einstellen eines Seitenwandwinkels eines Pattern-Elements und zum Untersuchen eines Defekts einer fotolithographischen Maske
US11287746B1 (en) * 2020-09-30 2022-03-29 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for overlay error reduction
CN115537766B (zh) * 2022-10-20 2024-07-19 江西乾照光电有限公司 掩膜组件及led芯片的制备方法

Citations (3)

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US6368942B1 (en) * 2000-03-31 2002-04-09 Euv Llc Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer
US6479195B1 (en) * 2000-09-15 2002-11-12 Intel Corporation Mask absorber for extreme ultraviolet lithography
WO2003019291A2 (en) * 2001-08-24 2003-03-06 Intel Corporation Damascene extreme ultraviolet lithography alternative phase shift photomask and method of making

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US4548883A (en) * 1983-05-31 1985-10-22 At&T Bell Laboratories Correction of lithographic masks
JP2542652B2 (ja) * 1987-12-10 1996-10-09 株式会社東芝 Ｘ線露光用マスクの製造方法
JPH0396220A (ja) * 1989-09-08 1991-04-22 Seiko Epson Corp パターン形成用反射型ｘ線マスク
JP2979667B2 (ja) 1991-01-23 1999-11-15 株式会社ニコン 反射型のｘ線露光用マスク
JPH06120125A (ja) * 1991-11-12 1994-04-28 Hitachi Ltd 光学素子およびそれを用いた投影露光装置
JP3341403B2 (ja) * 1993-10-28 2002-11-05 住友電気工業株式会社 反射型マスクおよびその製造方法
JP3336514B2 (ja) * 1994-04-06 2002-10-21 株式会社ニコン Ｘ線反射型マスク及びｘ線投影露光装置
JPH08222497A (ja) * 1995-02-09 1996-08-30 Nikon Corp 反射型マスク
AU5597000A (en) * 1999-06-07 2000-12-28 Regents Of The University Of California, The Coatings on reflective mask substrates
US6229871B1 (en) 1999-07-20 2001-05-08 Euv Llc Projection lithography with distortion compensation using reticle chuck contouring
US6410193B1 (en) * 1999-12-30 2002-06-25 Intel Corporation Method and apparatus for a reflective mask that is inspected at a first wavelength and exposed during semiconductor manufacturing at a second wavelength
US6392792B1 (en) * 2000-12-05 2002-05-21 The Regents Of The University Of California Method of fabricating reflection-mode EUV diffraction elements
US6861273B2 (en) * 2001-04-30 2005-03-01 Euv Llc Method of fabricating reflection-mode EUV diffusers
DE10123768C2 (de) 2001-05-16 2003-04-30 Infineon Technologies Ag Verfahren zur Herstellung einer lithographischen Reflexionsmaske insbesondere für die Strukturierung eines Halbleiterwafers sowie Reflexionsmaske
DE10134231B4 (de) * 2001-07-13 2006-06-14 Infineon Technologies Ag EUV-Reflektionsmaske
US6641959B2 (en) * 2001-08-09 2003-11-04 Intel Corporation Absorberless phase-shifting mask for EUV
DE60309238T2 (de) * 2002-03-08 2007-06-06 Asml Netherlands B.V. Lithographische Maske, lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
JP2004095924A (ja) * 2002-09-02 2004-03-25 Nikon Corp マスク、露光装置及び露光方法
US20050250019A1 (en) * 2004-05-04 2005-11-10 United Microelectronics Corp. Mask device for photolithography and application thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368942B1 (en) * 2000-03-31 2002-04-09 Euv Llc Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer
US6479195B1 (en) * 2000-09-15 2002-11-12 Intel Corporation Mask absorber for extreme ultraviolet lithography
WO2003019291A2 (en) * 2001-08-24 2003-03-06 Intel Corporation Damascene extreme ultraviolet lithography alternative phase shift photomask and method of making
US6607862B2 (en) * 2001-08-24 2003-08-19 Intel Corporation Damascene extreme ultraviolet lithography alternative phase shift photomask and method of making

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107367904A (zh) * 2016-04-27 2017-11-21 格罗方德半导体公司 极紫外光的光刻光罩

Also Published As

Publication number Publication date
EP1753609A2 (en) 2007-02-21
JP2008500736A (ja) 2008-01-10
US20050266317A1 (en) 2005-12-01
WO2005115743A2 (en) 2005-12-08
JP5132306B2 (ja) 2013-01-30
WO2005115743A3 (en) 2006-04-27
KR20070013313A (ko) 2007-01-30
US7198872B2 (en) 2007-04-03
CN1950680A (zh) 2007-04-18
TW200539299A (en) 2005-12-01
EP1753609A4 (en) 2011-11-30
TWI341549B (en) 2011-05-01

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20171121

Address after: Grand Cayman, Cayman Islands

Patentee after: GLOBALFOUNDRIES INC.

Address before: American New York

Patentee before: Core USA second LLC

Effective date of registration: 20171121

Address after: American New York

Patentee after: Core USA second LLC

Address before: American New York

Patentee before: International Business Machines Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080903

Termination date: 20210525