CN100385370C - 热接收装置和电子设备 - Google Patents

热接收装置和电子设备 Download PDF

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Publication number
CN100385370C
CN100385370C CNB2005100594655A CN200510059465A CN100385370C CN 100385370 C CN100385370 C CN 100385370C CN B2005100594655 A CNB2005100594655 A CN B2005100594655A CN 200510059465 A CN200510059465 A CN 200510059465A CN 100385370 C CN100385370 C CN 100385370C
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China
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heat
hot
guiding piece
joining
tie
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Expired - Fee Related
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CNB2005100594655A
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Chinese (zh)
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CN1690920A (zh
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畑由喜彦
富冈健太郎
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Toshiba Corp
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Toshiba Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CNB2005100594655A 2004-04-28 2005-03-25 热接收装置和电子设备 Expired - Fee Related CN100385370C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004133535 2004-04-28
JP2004133535A JP4234635B2 (ja) 2004-04-28 2004-04-28 電子機器

Publications (2)

Publication Number Publication Date
CN1690920A CN1690920A (zh) 2005-11-02
CN100385370C true CN100385370C (zh) 2008-04-30

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CNB2005100594655A Expired - Fee Related CN100385370C (zh) 2004-04-28 2005-03-25 热接收装置和电子设备

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US (2) US7301771B2 (enExample)
JP (1) JP4234635B2 (enExample)
CN (1) CN100385370C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7753662B2 (en) 2006-09-21 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump therein

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1923771B1 (en) 2003-11-07 2015-05-20 Asetek A/S Cooling system for a computer system
TWI287700B (en) * 2004-03-31 2007-10-01 Delta Electronics Inc Heat dissipation module
DK3056968T3 (en) 2005-05-06 2018-10-08 Asetek Danmark As Cooling system for a computer system
TWI296187B (en) * 2005-07-29 2008-04-21 Foxconn Tech Co Ltd Integrated liquid cooling system
US20070227707A1 (en) * 2006-03-31 2007-10-04 Machiroutu Sridhar V Method, apparatus and system for providing for optimized heat exchanger fin spacing
CN101122302B (zh) * 2006-08-11 2010-11-10 富准精密工业(深圳)有限公司 泵
US7430119B2 (en) * 2006-09-29 2008-09-30 Intel Corporation Impeller and aligned cold plate
US7404433B1 (en) * 2007-01-31 2008-07-29 Man Zai Industrial Co., Ltd. Liquid cooled heat sink
US7934540B2 (en) * 2007-02-01 2011-05-03 Delphi Technologies, Inc. Integrated liquid cooling unit for computers
TW200924625A (en) * 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
JP5170870B2 (ja) * 2007-11-06 2013-03-27 古河電気工業株式会社 冷却装置
US8988881B2 (en) * 2007-12-18 2015-03-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US9207023B2 (en) 2007-12-18 2015-12-08 Sandia Corporation Heat exchanger device and method for heat removal or transfer
JP5117287B2 (ja) * 2008-06-06 2013-01-16 株式会社日立製作所 電子機器の冷却装置
US9005417B1 (en) 2008-10-01 2015-04-14 Sandia Corporation Devices, systems, and methods for microscale isoelectric fractionation
US8522569B2 (en) * 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
US8962346B2 (en) 2010-07-08 2015-02-24 Sandia Corporation Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation
US9795961B1 (en) 2010-07-08 2017-10-24 National Technology & Engineering Solutions Of Sandia, Llc Devices, systems, and methods for detecting nucleic acids using sedimentation
WO2012118982A2 (en) 2011-03-02 2012-09-07 Sandia Corporation Axial flow heat exchanger devices and methods for heat transfer using axial flow devices
US20140027100A1 (en) * 2011-04-03 2014-01-30 Nec Corporation Piping structure of cooling device, method for making the same, and method for connecting pipes
JP5383740B2 (ja) * 2011-04-18 2014-01-08 株式会社ソニー・コンピュータエンタテインメント 電子機器
US8912645B2 (en) * 2011-06-15 2014-12-16 Toyota Jidosha Kabushiki Kaisha Semiconductor element cooling structure
JP5927539B2 (ja) * 2011-07-25 2016-06-01 パナソニックＩｐマネジメント株式会社 電子機器
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9244065B1 (en) 2012-03-16 2016-01-26 Sandia Corporation Systems, devices, and methods for agglutination assays using sedimentation
US10364809B2 (en) 2013-03-15 2019-07-30 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US12366870B2 (en) 2013-03-15 2025-07-22 Coolit Systems, Inc. Flow-path controllers and related systems
JP6331771B2 (ja) * 2014-06-28 2018-05-30 日本電産株式会社 ヒートモジュール
US10415597B2 (en) 2014-10-27 2019-09-17 Coolit Systems, Inc. Fluid heat exchange systems
US9677820B2 (en) * 2015-05-11 2017-06-13 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation structure thereof
WO2017123070A1 (ko) * 2016-01-14 2017-07-20 엘지이노텍 주식회사 팬 모터
US20170347487A1 (en) * 2016-05-25 2017-11-30 Andreas Rudnicki Reverse flow microstructure water cooling unit with included pump for cooling of an electrical or electronic component
WO2018004526A1 (en) * 2016-06-28 2018-01-04 Thomson Licensing Apparatus providing a thermal interface
CN109424551A (zh) * 2017-08-23 2019-03-05 杭州三花研究院有限公司 电动泵
US20190107122A1 (en) * 2017-10-05 2019-04-11 Asia Vital Components (China) Co., Ltd. Slim pump structure
JP7247517B2 (ja) * 2018-10-24 2023-03-29 日本電産株式会社 冷却装置
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods
US11725886B2 (en) 2021-05-20 2023-08-15 Coolit Systems, Inc. Modular fluid heat exchange systems
US12200914B2 (en) 2022-01-24 2025-01-14 Coolit Systems, Inc. Smart components, systems and methods for transferring heat
US12402275B2 (en) * 2022-09-30 2025-08-26 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer system enclosure
US20250216914A1 (en) * 2022-09-30 2025-07-03 United States Of America As Represented By The Secretary Of The Army Universal ruggedized computer enclosure with forced air cooling

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1228872A (zh) * 1996-06-24 1999-09-15 英特尔公司 热油脂的引入和保留
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
CN1299993A (zh) * 1999-12-13 2001-06-20 株式会社东芝 用于冷却发热电路组件的冷却单元及包括该冷却单元的电子设备
JP2003067087A (ja) * 2001-08-22 2003-03-07 Hitachi Ltd 可搬型情報処理装置の液冷システム

Family Cites Families (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158575U (enExample) 1979-05-02 1980-11-14
JPH0241472Y2 (enExample) 1985-10-24 1990-11-05
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5283468A (en) * 1988-05-30 1994-02-01 Canon Kabushiki Kaisha Electric circuit apparatus
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
JPH0749725B2 (ja) 1989-09-05 1995-05-31 三菱化学株式会社 補強用長繊維の巻回装置
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
JPH06334076A (ja) 1993-05-25 1994-12-02 Sony Corp 半導体実装構造
EP0654176B1 (de) * 1993-06-07 1998-05-20 Melcher Ag Befestigungsvorrichtung für halbleiter-schaltelemente
JPH0749725A (ja) 1993-08-06 1995-02-21 Sharp Corp 情報処理装置
JP3385482B2 (ja) 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US6232152B1 (en) * 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
JP3392527B2 (ja) 1994-08-01 2003-03-31 富士通株式会社 ヒートシンクの取付構造及び固定具
US5594617A (en) * 1994-12-06 1997-01-14 Digital Equipment Corporation Rotating battery hinge for a notebook computer
JP3258198B2 (ja) * 1995-04-28 2002-02-18 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器
US5969940A (en) 1995-06-08 1999-10-19 International Business Machines Corporation Mechanical structure of information processing device
KR100230253B1 (ko) 1996-02-14 1999-11-15 윤종용 대물렌즈 장치 및 이의 제작방법 및 이를 적용한 광픽업장치
US6094180A (en) * 1996-04-05 2000-07-25 Fakespace, Inc. Gimbal-mounted virtual reality display system
JPH104161A (ja) 1996-06-14 1998-01-06 Nippon Keiki Seisakusho:Kk ヒートシンク取り付け装置
JPH1055227A (ja) 1996-08-09 1998-02-24 Sharp Corp 情報処理装置
US5825087A (en) * 1996-12-03 1998-10-20 International Business Machines Corporation Integral mesh flat plate cooling module
JPH10261884A (ja) 1997-03-17 1998-09-29 Nec Home Electron Ltd 情報処理装置の冷却構造
JPH10303582A (ja) 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
WO1998059278A1 (en) * 1997-06-20 1998-12-30 Hitachi, Ltd. Display and display optical system
JPH1139058A (ja) 1997-07-14 1999-02-12 Ricoh Co Ltd ペン入力型電子機器
US6005767A (en) * 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
KR100286375B1 (ko) * 1997-10-02 2001-04-16 윤종용 전자 시스템의 방열장치 및 방열장치가 사용된 컴퓨터 시스템
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
JPH11166500A (ja) 1997-12-03 1999-06-22 Toshiba Ave Co Ltd ポンプ
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US5903436A (en) * 1997-12-30 1999-05-11 Intel Corporation Emulative lid/heatspreader for processor die attached to an organic substrate
JP3366244B2 (ja) 1998-02-04 2003-01-14 富士通株式会社 電子機器
US6281573B1 (en) * 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
JP4128660B2 (ja) 1998-07-27 2008-07-30 株式会社東芝 電子機器
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
TW399309B (en) * 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
US6050785A (en) * 1998-11-04 2000-04-18 Sunonwealth Electric Machine Industry Co., Ltd. Axle balance plates for miniature heat dissipating fan assemblies
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6483445B1 (en) * 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
GB2348459B (en) * 1999-03-27 2003-03-19 Ibm Lid restraint for portable computer
JP4203782B2 (ja) * 1999-05-19 2009-01-07 ソニー株式会社 情報処理装置及びバッテリ
KR100553677B1 (ko) * 1999-06-11 2006-02-24 삼성전자주식회사 커버를 지지하기 위한 구조를 갖는 휴대용 컴퓨터
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
JP4270667B2 (ja) 1999-08-17 2009-06-03 株式会社東芝 回路部品の冷却装置および電子機器
JP3283853B2 (ja) * 1999-09-17 2002-05-20 米沢日本電気株式会社 ドッキングステーション
US6166907A (en) 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
DE20001236U1 (de) 2000-01-25 2000-04-27 Hsieh Hsin Mao Ventilator
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
JP2001230356A (ja) 2000-02-17 2001-08-24 Showa Denko Kk クリップ付き放熱器
JP2001251079A (ja) 2000-03-03 2001-09-14 Diamond Electric Mfg Co Ltd ヒートパイプを用いたヒートシンクとヒートパイプの製造方法
US6658472B1 (en) 2000-03-28 2003-12-02 Hewlett-Packard Development Company, L.P. Communication systems, firewall devices, and communication methods
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
JP2001318732A (ja) * 2000-05-09 2001-11-16 Sony Corp 情報処理装置
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP3302350B2 (ja) * 2000-06-29 2002-07-15 株式会社東芝 電子機器
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
JP4018978B2 (ja) * 2000-08-03 2007-12-05 富士通株式会社 半導体装置および半導体装置上に配置されるヒートシンクを載置し、基板に固定する取付け具およびその取付け方法
US6327145B1 (en) 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
JP2002099356A (ja) 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
JP2002151638A (ja) 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
JP3607608B2 (ja) * 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
JP2002232174A (ja) * 2001-02-06 2002-08-16 Hitachi Ltd 電子装置
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
US6798429B2 (en) * 2001-03-29 2004-09-28 Intel Corporation Intuitive mobile device interface to virtual spaces
JP3640347B2 (ja) * 2001-04-27 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション コンピュータ装置、電気機器、筐体およびカバー
JP2002344186A (ja) 2001-05-15 2002-11-29 Sharp Corp 電子機器
JP2002353670A (ja) 2001-05-25 2002-12-06 Toshiba Home Technology Corp ヒートシンク装置
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
US6488483B1 (en) 2001-06-14 2002-12-03 Hsieh Hsin-Mao Low power loss heat dissipation fan
FR2827115B1 (fr) * 2001-07-06 2003-09-05 Alstom Coffre pour convertisseur de puissance
TW558611B (en) * 2001-07-18 2003-10-21 Matsushita Electric Industrial Co Ltd Small pump, cooling system and portable equipment
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US6480373B1 (en) * 2001-07-24 2002-11-12 Compaq Information Technologies Group, L.P. Multifunctional foldable computer
JP2003044169A (ja) 2001-07-31 2003-02-14 Casio Comput Co Ltd 電子機器
JP3925126B2 (ja) 2001-08-28 2007-06-06 日産自動車株式会社 燃料電池
JP2003078270A (ja) * 2001-09-07 2003-03-14 Hitachi Ltd 電子装置
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
JP3519710B2 (ja) 2001-09-21 2004-04-19 株式会社東芝 冷却装置及び冷却装置を内蔵した電子機器
TW561226B (en) * 2001-09-25 2003-11-11 Matsushita Electric Industrial Co Ltd Ultra-thin pump and cooling system including the pump
JP3741092B2 (ja) 2001-09-25 2006-02-01 松下電器産業株式会社 超薄型ポンプとこれを備えた冷却システム
US20030124000A1 (en) * 2001-12-28 2003-07-03 Po-Jen Shih Heat dissipation fan
JP2003223238A (ja) * 2002-01-28 2003-08-08 Internatl Business Mach Corp <Ibm> コンピュータ装置、モニタユニットおよび対面ユニットの支持構造物
JP3961843B2 (ja) 2002-02-08 2007-08-22 株式会社日立製作所 液体冷却システムを有する小型電子計算機
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6668911B2 (en) 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
JP3431024B1 (ja) 2003-01-15 2003-07-28 松下電器産業株式会社 冷却装置
JP3452059B1 (ja) 2002-05-15 2003-09-29 松下電器産業株式会社 冷却装置とそれを備えた電子機器
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6652223B1 (en) * 2002-05-30 2003-11-25 Sunonwealth Electric Machine Industry Fan structure having horizontal convection
JP4168669B2 (ja) 2002-05-31 2008-10-22 松下電工株式会社 薄型ポンプ
DE10225993A1 (de) * 2002-06-12 2003-12-24 Bosch Gmbh Robert Kühlkörper
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
JP3885679B2 (ja) * 2002-06-28 2007-02-21 株式会社日立製作所 電子機器
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
JP2004071882A (ja) * 2002-08-07 2004-03-04 Toshiba Corp 電子機器
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6788530B2 (en) * 2002-09-24 2004-09-07 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6829139B1 (en) 2002-10-01 2004-12-07 Danger, Inc. Adjustable data processing display
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
TW545104B (en) * 2002-11-28 2003-08-01 Quanta Comp Inc Cooling apparatus
JP2003216278A (ja) 2002-12-10 2003-07-31 Toshiba Corp 電子機器
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
TW551790U (en) 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd Securing device
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
JP2004246403A (ja) * 2003-02-10 2004-09-02 Toshiba Corp 情報処理装置、電子機器及び電子機器の冷却方法
US6702007B1 (en) * 2003-04-30 2004-03-09 Kuan-Da Pan Heat sink structure
JP2004348650A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 電子機器
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
US7035090B2 (en) * 2003-09-04 2006-04-25 Kabushiki Kaisha Toshiba Interlocking mechanism for a display
JP2005107122A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 電子機器
JP2005116762A (ja) * 2003-10-07 2005-04-28 Fujitsu Ltd 半導体装置の保護方法及び半導体装置用カバー及び半導体装置ユニット及び半導体装置の梱包構造
US6958910B2 (en) * 2003-11-18 2005-10-25 Kabushiki Kaisha Toshiba Cooling apparatus for electronic apparatus
US7019979B2 (en) * 2003-11-21 2006-03-28 Waffer Technology Corp. Heat dissipating device having improved fastening structure
JP2005190316A (ja) * 2003-12-26 2005-07-14 Toshiba Corp 電子機器
JP2005228237A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
US7006353B2 (en) * 2004-03-11 2006-02-28 International Business Machines Corporation Apparatus and method for attaching a heat sink to an integrated circuit module
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
CN2701074Y (zh) 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 液冷散热装置
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate
US7077189B1 (en) * 2005-01-21 2006-07-18 Delphi Technologies, Inc. Liquid cooled thermosiphon with flexible coolant tubes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1228872A (zh) * 1996-06-24 1999-09-15 英特尔公司 热油脂的引入和保留
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
CN1299993A (zh) * 1999-12-13 2001-06-20 株式会社东芝 用于冷却发热电路组件的冷却单元及包括该冷却单元的电子设备
JP2003067087A (ja) * 2001-08-22 2003-03-07 Hitachi Ltd 可搬型情報処理装置の液冷システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7753662B2 (en) 2006-09-21 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump therein

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US20050243518A1 (en) 2005-11-03
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US7548425B2 (en) 2009-06-16
CN1690920A (zh) 2005-11-02
US20080259558A1 (en) 2008-10-23

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