CH627877A5 - Substrat d'interconnexion de composants electroniques a circuits integres. - Google Patents

Substrat d'interconnexion de composants electroniques a circuits integres. Download PDF

Info

Publication number
CH627877A5
CH627877A5 CH1028178A CH1028178A CH627877A5 CH 627877 A5 CH627877 A5 CH 627877A5 CH 1028178 A CH1028178 A CH 1028178A CH 1028178 A CH1028178 A CH 1028178A CH 627877 A5 CH627877 A5 CH 627877A5
Authority
CH
Switzerland
Prior art keywords
conductive
insulating
pad
substrate
repair
Prior art date
Application number
CH1028178A
Other languages
English (en)
French (fr)
Inventor
Bernard Badet
Karel Kurzweil
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of CH627877A5 publication Critical patent/CH627877A5/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H10W70/611—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H10W70/682—
    • H10W72/075—
    • H10W72/533—
    • H10W72/534—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CH1028178A 1977-10-03 1978-10-03 Substrat d'interconnexion de composants electroniques a circuits integres. CH627877A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729687A FR2404990A1 (fr) 1977-10-03 1977-10-03 Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation

Publications (1)

Publication Number Publication Date
CH627877A5 true CH627877A5 (fr) 1982-01-29

Family

ID=9196039

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1028178A CH627877A5 (fr) 1977-10-03 1978-10-03 Substrat d'interconnexion de composants electroniques a circuits integres.

Country Status (11)

Country Link
US (1) US4371744A (cg-RX-API-DMAC10.html)
JP (1) JPS5461669A (cg-RX-API-DMAC10.html)
BE (1) BE870879A (cg-RX-API-DMAC10.html)
CA (1) CA1115853A (cg-RX-API-DMAC10.html)
CH (1) CH627877A5 (cg-RX-API-DMAC10.html)
DE (1) DE2843144A1 (cg-RX-API-DMAC10.html)
FR (1) FR2404990A1 (cg-RX-API-DMAC10.html)
GB (1) GB2009516B (cg-RX-API-DMAC10.html)
IT (1) IT1159117B (cg-RX-API-DMAC10.html)
NL (1) NL7809276A (cg-RX-API-DMAC10.html)
SE (1) SE441880B (cg-RX-API-DMAC10.html)

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FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
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EP0219627B1 (de) * 1985-09-24 1991-06-05 Oerlikon-Contraves AG Mehrschichtige gedruckte Schaltungsplatte
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes
US4652974A (en) * 1985-10-28 1987-03-24 International Business Machines Corporation Method and structure for effecting engineering changes in a multiple device module package
JPS62136098A (ja) * 1985-12-09 1987-06-19 富士通株式会社 高密度配線基板
EP0247575B1 (en) * 1986-05-30 1993-07-21 Furukawa Denki Kogyo Kabushiki Kaisha Multilayer printed wiring board and method for producing the same
US5229548A (en) * 1986-10-27 1993-07-20 Black & Decker Inc. Circuit board having a stamped substrate
US4829404A (en) * 1987-04-27 1989-05-09 Flexmark, Inc. Method of producing a flexible circuit and master grid therefor
US4935584A (en) * 1988-05-24 1990-06-19 Tektronix, Inc. Method of fabricating a printed circuit board and the PCB produced
EP0361985B1 (en) * 1988-09-30 1994-12-07 Raychem Limited Hybrid microchip bonding article
KR930010076B1 (ko) * 1989-01-14 1993-10-14 티디케이 가부시키가이샤 다층혼성집적회로
JPH02265243A (ja) * 1989-04-05 1990-10-30 Nec Corp 多層配線およびその形成方法
US5231304A (en) * 1989-07-27 1993-07-27 Grumman Aerospace Corporation Framed chip hybrid stacked layer assembly
MY105486A (en) * 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5224022A (en) * 1990-05-15 1993-06-29 Microelectronics And Computer Technology Corporation Reroute strategy for high density substrates
US5132648A (en) * 1990-06-08 1992-07-21 Rockwell International Corporation Large array MMIC feedthrough
US5093708A (en) * 1990-08-20 1992-03-03 Grumman Aerospace Corporation Multilayer integrated circuit module
US5220490A (en) * 1990-10-25 1993-06-15 Microelectronics And Computer Technology Corporation Substrate interconnect allowing personalization using spot surface links
US5338900A (en) * 1991-03-06 1994-08-16 International Business Machines Corporation Structures for electrically conductive decals filled with inorganic insulator material
US5306872A (en) * 1991-03-06 1994-04-26 International Business Machines Corporation Structures for electrically conductive decals filled with organic insulator material
US5128749A (en) * 1991-04-08 1992-07-07 Grumman Aerospace Corporation Fused high density multi-layer integrated circuit module
JP3197022B2 (ja) * 1991-05-13 2001-08-13 ティーディーケイ株式会社 ノイズサプレッサ用積層セラミック部品
US5209798A (en) * 1991-11-22 1993-05-11 Grunman Aerospace Corporation Method of forming a precisely spaced stack of substrate layers
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5436412A (en) * 1992-10-30 1995-07-25 International Business Machines Corporation Interconnect structure having improved metallization
US5308926A (en) * 1992-12-08 1994-05-03 Premisys Communications, Inc. Compact isolating backplane for routing electronic signals
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US5609704A (en) 1993-09-21 1997-03-11 Matsushita Electric Industrial Co., Ltd. Method for fabricating an electronic part by intaglio printing
US5834705A (en) * 1994-03-04 1998-11-10 Silicon Graphics, Inc. Arrangement for modifying eletrical printed circuit boards
US5995325A (en) * 1994-04-20 1999-11-30 Seagate Technology, Inc. Transducer signal wire termination
US5929517A (en) 1994-12-29 1999-07-27 Tessera, Inc. Compliant integrated circuit package and method of fabricating the same
US5856235A (en) * 1995-04-12 1999-01-05 Northrop Grumman Corporation Process of vacuum annealing a thin film metallization on high purity alumina
US5809641A (en) * 1996-04-25 1998-09-22 International Business Machines Corporation Method for printed circuit board repair
US5909011A (en) * 1996-08-01 1999-06-01 International Business Machines Corporation Method and apparatus for modifying circuit having ball grid array interconnections
US6329594B1 (en) 1998-01-16 2001-12-11 Bae Systems Information And Electronic Systems Integration, Inc. Integrated circuit package
WO2000076281A1 (fr) * 1999-06-02 2000-12-14 Ibiden Co., Ltd. Carte a circuit imprime multicouche et procede de fabrication d'une telle carte
JP3865115B2 (ja) * 1999-09-13 2007-01-10 Ｈｏｙａ株式会社 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード
US7088002B2 (en) * 2000-12-18 2006-08-08 Intel Corporation Interconnect
US6885106B1 (en) 2001-01-11 2005-04-26 Tessera, Inc. Stacked microelectronic assemblies and methods of making same
WO2003032370A2 (en) * 2001-10-09 2003-04-17 Tessera, Inc. Stacked packages
US7335995B2 (en) * 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
US6977440B2 (en) * 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
US6765288B2 (en) * 2002-08-05 2004-07-20 Tessera, Inc. Microelectronic adaptors, assemblies and methods
US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies
DE102019215471B4 (de) * 2019-10-09 2022-05-25 Vitesco Technologies GmbH Elektronisches Bauteil mit einer Kontaktieranordnung und Verfahren zur Herstellung eines elektronischen Bauteils

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US3541223A (en) * 1966-09-23 1970-11-17 Texas Instruments Inc Interconnections between layers of a multilayer printed circuit board
US3691290A (en) * 1970-12-14 1972-09-12 Ibm Deletable conductor line structure
GB1356632A (en) * 1971-07-09 1974-06-12 Plessey Co Ltd Multiplayer printed-circuit boards
US3968193A (en) * 1971-08-27 1976-07-06 International Business Machines Corporation Firing process for forming a multilayer glass-metal module
US3803483A (en) * 1972-05-05 1974-04-09 Ibm Semiconductor structure for testing of metallization networks on insulative substrates supporting semiconductor chips
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
FR2241946B1 (cg-RX-API-DMAC10.html) * 1973-08-24 1976-11-19 Honeywell Bull Soc Ind
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat

Also Published As

Publication number Publication date
JPS5461669A (en) 1979-05-18
IT7828018A0 (it) 1978-09-25
US4371744A (en) 1983-02-01
CA1115853A (fr) 1982-01-05
DE2843144A1 (de) 1979-04-12
DE2843144C2 (cg-RX-API-DMAC10.html) 1989-07-13
IT1159117B (it) 1987-02-25
NL7809276A (nl) 1979-04-05
GB2009516A (en) 1979-06-13
GB2009516B (en) 1982-03-24
SE441880B (sv) 1985-11-11
BE870879A (fr) 1979-01-15
FR2404990A1 (fr) 1979-04-27
SE7810314L (sv) 1979-04-04
FR2404990B1 (cg-RX-API-DMAC10.html) 1980-02-15

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PL Patent ceased