CA2872898A1 - Surface features mapping - Google Patents
Surface features mapping Download PDFInfo
- Publication number
- CA2872898A1 CA2872898A1 CA2872898A CA2872898A CA2872898A1 CA 2872898 A1 CA2872898 A1 CA 2872898A1 CA 2872898 A CA2872898 A CA 2872898A CA 2872898 A CA2872898 A CA 2872898A CA 2872898 A1 CA2872898 A1 CA 2872898A1
- Authority
- CA
- Canada
- Prior art keywords
- article
- features
- photon
- operable
- photons
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000013507 mapping Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims abstract description 28
- 230000003287 optical effect Effects 0.000 description 34
- 238000003491 array Methods 0.000 description 24
- 230000007547 defect Effects 0.000 description 21
- 239000002245 particle Substances 0.000 description 16
- 238000001514 detection method Methods 0.000 description 12
- 238000007689 inspection Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012512 characterization method Methods 0.000 description 7
- 230000010287 polarization Effects 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 238000011109 contamination Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004445 quantitative analysis Methods 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9506—Optical discs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8861—Determining coordinates of flaws
- G01N2021/8864—Mapping zones of defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Geophysics And Detection Of Objects (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261644998P | 2012-05-09 | 2012-05-09 | |
| US61/644,998 | 2012-05-09 | ||
| PCT/US2013/040271 WO2013169980A1 (en) | 2012-05-09 | 2013-05-09 | Surface features mapping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2872898A1 true CA2872898A1 (en) | 2013-11-14 |
Family
ID=49548370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2872898A Abandoned CA2872898A1 (en) | 2012-05-09 | 2013-05-09 | Surface features mapping |
Country Status (12)
| Country | Link |
|---|---|
| US (3) | US9036142B2 (enExample) |
| EP (1) | EP2847556A4 (enExample) |
| JP (2) | JP6289450B2 (enExample) |
| KR (1) | KR102093108B1 (enExample) |
| CN (1) | CN104412079B (enExample) |
| CA (1) | CA2872898A1 (enExample) |
| IL (1) | IL235589A0 (enExample) |
| MY (1) | MY182531A (enExample) |
| PH (1) | PH12014502486A1 (enExample) |
| SG (1) | SG11201407341TA (enExample) |
| TW (1) | TWI592652B (enExample) |
| WO (1) | WO2013169980A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9212900B2 (en) | 2012-08-11 | 2015-12-15 | Seagate Technology Llc | Surface features characterization |
| US9297751B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Chemical characterization of surface features |
| US9297759B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Classification of surface features using fluorescence |
| JP2014077660A (ja) * | 2012-10-09 | 2014-05-01 | Fuji Xerox Co Ltd | 検出装置 |
| US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
| US9217714B2 (en) * | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
| US9513215B2 (en) | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
| US9581554B2 (en) * | 2013-05-30 | 2017-02-28 | Seagate Technology Llc | Photon emitter array |
| US9274064B2 (en) | 2013-05-30 | 2016-03-01 | Seagate Technology Llc | Surface feature manager |
| US9201019B2 (en) | 2013-05-30 | 2015-12-01 | Seagate Technology Llc | Article edge inspection |
| US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
| CN114503326B (zh) | 2019-09-30 | 2024-06-28 | 株式会社村田制作所 | 扁平型二次电池 |
| US12216301B2 (en) * | 2022-03-29 | 2025-02-04 | Intel Corporation | Apparatuses and methods for inspecting embedded features |
| US12495214B2 (en) | 2023-03-15 | 2025-12-09 | General Electric Company | Pulse illumination imaging of a target element |
Family Cites Families (129)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4207467A (en) | 1978-09-05 | 1980-06-10 | Laser Precision Corp. | Film measuring apparatus and method |
| US4806776A (en) | 1980-03-10 | 1989-02-21 | Kley Victor B | Electrical illumination and detecting apparatus |
| US4598997A (en) | 1982-02-15 | 1986-07-08 | Rca Corporation | Apparatus and method for detecting defects and dust on a patterned surface |
| US4477890A (en) | 1982-03-01 | 1984-10-16 | Discovision Associates | Mapping disc defect detector |
| GB2130835A (en) | 1982-10-04 | 1984-06-06 | Andrzej Kamil Drukier | Apparatus for the diagnosis of body structures into which a gamma-emitting radioactive isotape has been introduced |
| US4551919A (en) * | 1982-10-27 | 1985-11-12 | Mitutoyo Mfg. Co., Ltd. | Measuring instrument |
| JPS6211151A (ja) * | 1985-07-08 | 1987-01-20 | Dainippon Screen Mfg Co Ltd | 表面欠陥検査装置 |
| JPS6313342A (ja) * | 1986-07-04 | 1988-01-20 | Hitachi Ltd | 微細異物検査装置 |
| US4794550A (en) * | 1986-10-15 | 1988-12-27 | Eastman Kodak Company | Extended-range moire contouring |
| GB8729246D0 (en) | 1987-12-15 | 1988-01-27 | Renishaw Plc | Opto-electronic scale-reading apparatus |
| US5131755A (en) * | 1988-02-19 | 1992-07-21 | Chadwick Curt H | Automatic high speed optical inspection system |
| US5066130A (en) | 1988-05-10 | 1991-11-19 | Canon Kabushiki Kaisha | Displacement measuring apparatus |
| US5058178A (en) | 1989-12-21 | 1991-10-15 | At&T Bell Laboratories | Method and apparatus for inspection of specular, three-dimensional features |
| JPH05223532A (ja) | 1991-07-10 | 1993-08-31 | Raytheon Co | 自動視覚検査システム |
| US5168322A (en) | 1991-08-19 | 1992-12-01 | Diffracto Ltd. | Surface inspection using retro-reflective light field |
| US5563702A (en) | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
| JPH0682378A (ja) * | 1992-09-01 | 1994-03-22 | Nikon Corp | 欠陥検査装置 |
| JPH06194320A (ja) * | 1992-12-25 | 1994-07-15 | Hitachi Ltd | 半導体製造ラインにおける鏡面基板の検査方法およびその装置並びに半導体製造方法 |
| JPH06241758A (ja) | 1993-02-15 | 1994-09-02 | Canon Inc | 欠陥検査装置 |
| DE69421844T2 (de) | 1993-04-23 | 2000-06-29 | Research Development Corp. Of Japan, Kawaguchi | Verfahren zur Kontrolle der Schichtdicke und/oder des Brechungsindexes |
| US5627638A (en) | 1993-07-01 | 1997-05-06 | Prolaser Ltd. | Method and apparatus for detecting defects in lenses |
| IL110618A (en) | 1994-08-10 | 1996-12-05 | Optomic Techn Corp Ltd | Device for testing optical elements |
| JP3483948B2 (ja) | 1994-09-01 | 2004-01-06 | オリンパス株式会社 | 欠陥検出装置 |
| US5548403A (en) | 1994-11-28 | 1996-08-20 | The Regents Of The University Of California | Phase shifting diffraction interferometer |
| JPH08178867A (ja) | 1994-12-26 | 1996-07-12 | Aichi Steel Works Ltd | 平鋼熱間探傷装置 |
| US5726455A (en) | 1995-06-30 | 1998-03-10 | Stormedia, Inc. | Disk film optical measurement system |
| EP0766298A3 (en) * | 1995-09-27 | 1998-09-16 | Shin-Etsu Handotai Co., Ltd. | Method of and apparatus for determining residual damage to wafer edges |
| JPH09178867A (ja) | 1995-12-26 | 1997-07-11 | Casio Comput Co Ltd | アナログ時計 |
| JPH11125602A (ja) * | 1996-07-01 | 1999-05-11 | Advantest Corp | 異物分析方法及び装置 |
| US5778039A (en) | 1996-02-21 | 1998-07-07 | Advanced Micro Devices, Inc. | Method and apparatus for the detection of light elements on the surface of a semiconductor substrate using x-ray fluorescence (XRF) |
| US5661559A (en) * | 1996-03-14 | 1997-08-26 | Phase Metrics, Inc. | Optical surface detection for magnetic disks |
| US5781649A (en) | 1996-04-15 | 1998-07-14 | Phase Metrics, Inc. | Surface inspection of a disk by diffraction pattern sampling |
| US6556783B1 (en) * | 1997-01-16 | 2003-04-29 | Janet L. Gelphman | Method and apparatus for three dimensional modeling of an object |
| JP3692685B2 (ja) | 1997-02-19 | 2005-09-07 | 株式会社ニコン | 欠陥検査装置 |
| US5774212A (en) | 1997-03-19 | 1998-06-30 | General Electric Co. | Method and apparatus for detecting and analyzing directionally reflective surface flaws |
| US5898491A (en) | 1997-03-28 | 1999-04-27 | Hitachi Electronics Engineering Co. Ltd. | Surface defect test method and surface defect tester |
| AU6942998A (en) * | 1997-03-31 | 1998-10-22 | Microtherm, Llc | Optical inspection module and method for detecting particles and defects on substrates in integrated process tools |
| JPH10282009A (ja) * | 1997-04-04 | 1998-10-23 | Toshiba Corp | 微粒子評価方法・装置 |
| DE19717488C2 (de) * | 1997-04-25 | 2003-05-15 | Baumer Optronic Gmbh | Vorrichtung zur Inspektion der Oberfläche von Objekten |
| US5859698A (en) | 1997-05-07 | 1999-01-12 | Nikon Corporation | Method and apparatus for macro defect detection using scattered light |
| US6040592A (en) * | 1997-06-12 | 2000-03-21 | Intel Corporation | Well to substrate photodiode for use in a CMOS sensor on a salicide process |
| US5973839A (en) | 1998-03-05 | 1999-10-26 | Hewlett-Packard Company | Optical homogenizer |
| US20010036588A1 (en) * | 1998-05-05 | 2001-11-01 | Ims-Ionen Mikrofabrikations Systeme Gmbh | Lithographic imaging of a structure pattern onto one or more fields on a substrate |
| IL126866A (en) | 1998-11-02 | 2003-02-12 | Orbotech Ltd | Apparatus and method for fabricating flat workpieces |
| US6256097B1 (en) | 1999-01-08 | 2001-07-03 | Rudolph Technologies, Inc. | Ellipsometer and ellipsometry method |
| DE19909534B4 (de) | 1999-03-04 | 2011-07-07 | BYK-Gardner GmbH, 82538 | Vorrichtung und Verfahren zur Bestimmung der Qualität strukturierter Oberflächen |
| US6529270B1 (en) | 1999-03-31 | 2003-03-04 | Ade Optical Systems Corporation | Apparatus and method for detecting defects in the surface of a workpiece |
| EP1116932A3 (de) * | 2000-01-14 | 2003-04-16 | Leica Microsystems Wetzlar GmbH | Messgerät und Verfahren zun Vermessen von Strukturen auf einem Substrat |
| US6476908B1 (en) * | 2000-04-10 | 2002-11-05 | Eclipse Optics, Inc. | Optical probe |
| US6483584B1 (en) | 2000-04-14 | 2002-11-19 | National Science Council | Device for measuring the complex refractive index and thin film thickness of a sample |
| US7751609B1 (en) * | 2000-04-20 | 2010-07-06 | Lsi Logic Corporation | Determination of film thickness during chemical mechanical polishing |
| US6392745B1 (en) | 2000-06-13 | 2002-05-21 | American Air Liquide, Inc. | Method and apparatus for the fast detection of surface characteristics |
| DE10031558A1 (de) | 2000-06-28 | 2002-01-10 | Clariant Gmbh | Verfahren zur Konditionierung von organischen Pigmenten |
| FR2811761B1 (fr) | 2000-07-17 | 2002-10-11 | Production Rech S Appliquees | Ellipsometre a haute resolution spatiale fonctionnant dans l'infrarouge |
| US6731383B2 (en) * | 2000-09-12 | 2004-05-04 | August Technology Corp. | Confocal 3D inspection system and process |
| JP2002190444A (ja) * | 2000-10-10 | 2002-07-05 | Canon Inc | パターン露光装置、パターン作製方法、及びこれらを用いて作製したデバイス |
| WO2002040970A1 (en) | 2000-11-15 | 2002-05-23 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6809809B2 (en) | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| US6515742B1 (en) | 2000-11-28 | 2003-02-04 | Memc Electronic Materials, Inc. | Defect classification using scattered light intensities |
| US6509966B2 (en) | 2000-12-27 | 2003-01-21 | Hitachi Electronics Engineering Co., Ltd. | Optical system for detecting surface defect and surface defect tester using the same |
| US6617603B2 (en) | 2001-03-06 | 2003-09-09 | Hitachi Electronics Engineering Co., Ltd. | Surface defect tester |
| WO2002079760A2 (en) | 2001-03-30 | 2002-10-10 | Therma-Wave, Inc. | Polarimetric scatterometer for critical dimension measurements of periodic structures |
| AU2002338353B2 (en) * | 2001-04-06 | 2006-05-25 | Akzo Nobel Coatings International B.V. | Method and device for surface evaluation |
| JP2002340811A (ja) * | 2001-05-21 | 2002-11-27 | Silicon Technology Co Ltd | 表面評価装置 |
| US6617087B1 (en) * | 2001-06-27 | 2003-09-09 | Advanced Micro Devices, Inc. | Use of scatterometry to measure pattern accuracy |
| JP2003202214A (ja) | 2002-01-04 | 2003-07-18 | Mitsubishi Electric Corp | 形状計測装置および形状計測方法 |
| JP4102081B2 (ja) * | 2002-02-28 | 2008-06-18 | 株式会社荏原製作所 | 研磨装置及び研磨面の異物検出方法 |
| KR100798320B1 (ko) * | 2002-03-06 | 2008-01-28 | 엘지.필립스 엘시디 주식회사 | 액정 패널의 검사 장치 및 그 방법 |
| US20040207836A1 (en) * | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
| US6847907B1 (en) | 2002-12-31 | 2005-01-25 | Active Optical Networks, Inc. | Defect detection and repair of micro-electro-mechanical systems (MEMS) devices |
| DE10313038B4 (de) * | 2003-03-24 | 2005-02-17 | Klingelnberg Gmbh | Vorrichtung zur Erfassung der Lage eines Tastelements in einem Mehrkoordinatenmessgerät |
| DE10330005B4 (de) * | 2003-07-03 | 2006-12-21 | Leica Microsystems Semiconductor Gmbh | Vorrichtung zur Inspektion eines Wafers |
| US20050067740A1 (en) | 2003-09-29 | 2005-03-31 | Frederick Haubensak | Wafer defect reduction by short pulse laser ablation |
| FR2860869B1 (fr) * | 2003-10-10 | 2007-04-20 | Optis | Dispositif portable de mesure de l'intensite lumineuse d'un objet et utilisation d'un tel dispositif |
| US7433031B2 (en) * | 2003-10-29 | 2008-10-07 | Core Tech Optical, Inc. | Defect review system with 2D scanning and a ring detector |
| DE10359722A1 (de) * | 2003-12-19 | 2005-07-14 | Leica Microsystems Semiconductor Gmbh | Verfahren zur Inspektion eines Wafers |
| TWI302756B (en) * | 2004-04-19 | 2008-11-01 | Phoseon Technology Inc | Imaging semiconductor structures using solid state illumination |
| DE102004029014B4 (de) * | 2004-06-16 | 2006-06-22 | Leica Microsystems Semiconductor Gmbh | Verfahren und System zur Inspektion eines Wafers |
| US7580126B2 (en) | 2004-06-30 | 2009-08-25 | Chemimage Corp. | Method and apparatus for producing a streaming Raman image of nucleation, aggregation, and chemical interaction |
| US7489399B1 (en) | 2004-08-20 | 2009-02-10 | Kla-Tencor Corporation | Spectroscopic multi angle ellipsometry |
| US7417722B2 (en) | 2004-12-19 | 2008-08-26 | Kla-Tencor Technologies Corporation | System and method for controlling light scattered from a workpiece surface in a surface inspection system |
| US20060147814A1 (en) | 2005-01-03 | 2006-07-06 | Ted Liang | Methods for repairing an alternating phase-shift mask |
| JP2006308511A (ja) | 2005-05-02 | 2006-11-09 | Canon Inc | 化学分析装置及びその分析方法 |
| US8243272B2 (en) | 2005-09-19 | 2012-08-14 | Jmar Llc | Systems and methods for detecting normal levels of bacteria in water using a multiple angle light scattering (MALS) instrument |
| US7463369B2 (en) | 2006-03-29 | 2008-12-09 | Kla-Tencor Technologies Corp. | Systems and methods for measuring one or more characteristics of patterned features on a specimen |
| WO2007121208A2 (en) * | 2006-04-11 | 2007-10-25 | Massachusetts Institute Of Technology | Nanometer-precision tip-to-substrate control and pattern registration for scanning-probe lithography |
| US20090122304A1 (en) | 2006-05-02 | 2009-05-14 | Accretech Usa, Inc. | Apparatus and Method for Wafer Edge Exclusion Measurement |
| JP4959225B2 (ja) * | 2006-05-17 | 2012-06-20 | 株式会社日立ハイテクノロジーズ | 光学式検査方法及び光学式検査装置 |
| JP5138268B2 (ja) * | 2006-06-14 | 2013-02-06 | 株式会社タニタ | 寸法測定装置 |
| US20080191137A1 (en) | 2006-06-29 | 2008-08-14 | Cdex, Inc. | Methods and apparatus for molecular species detection, inspection and classification using ultraviolet to near infrared Enhanced Photoemission Spectroscopy |
| TWI429896B (zh) | 2006-07-27 | 2014-03-11 | Rudolph Technologies Inc | 橢圓偏光測定儀器及監控製程之方法 |
| JP4843399B2 (ja) | 2006-07-31 | 2011-12-21 | 株式会社日立ハイテクノロジーズ | 検査装置及び検査方法 |
| KR100763942B1 (ko) | 2006-09-04 | 2007-10-05 | (주)포씨스 | 표면검사장치 |
| US7508508B2 (en) * | 2006-09-19 | 2009-03-24 | Seethrough Ltd. | Device and method for inspecting a hair sample |
| US7714996B2 (en) | 2007-01-23 | 2010-05-11 | 3i Systems Corporation | Automatic inspection system for flat panel substrate |
| WO2008139735A1 (ja) | 2007-05-14 | 2008-11-20 | Nikon Corporation | 表面検査装置および表面検査方法 |
| US7636156B2 (en) | 2007-06-15 | 2009-12-22 | Qimonda Ag | Wafer inspection system and method |
| JP2009014510A (ja) | 2007-07-04 | 2009-01-22 | Hitachi High-Technologies Corp | 検査方法及び検査装置 |
| CN201069386Y (zh) * | 2007-09-06 | 2008-06-04 | 复旦大学 | Led光通量测试装置 |
| JP2009139248A (ja) | 2007-12-07 | 2009-06-25 | Hitachi High-Technologies Corp | 欠陥検出光学系および欠陥検出画像処理を搭載した表面欠陥検査装置 |
| IL188825A0 (en) * | 2008-01-16 | 2008-11-03 | Orbotech Ltd | Inspection of a substrate using multiple cameras |
| KR100913484B1 (ko) | 2008-02-19 | 2009-08-25 | 에스엔유 프리시젼 주식회사 | 암시야 검사장치 |
| JP5198189B2 (ja) | 2008-08-29 | 2013-05-15 | 富士フイルム株式会社 | ハードディスク検査装置 |
| WO2010030698A1 (en) * | 2008-09-09 | 2010-03-18 | Cornell University | Optical grid for high precision and high resolution method of wafer scale nanofabrication |
| JP5341440B2 (ja) | 2008-09-10 | 2013-11-13 | 株式会社日立ハイテクノロジーズ | 検査装置 |
| JP5469839B2 (ja) * | 2008-09-30 | 2014-04-16 | 株式会社日立ハイテクノロジーズ | 物体表面の欠陥検査装置および方法 |
| JP5027775B2 (ja) | 2008-10-03 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | 基板表面形状検出方法及びその装置 |
| JP4719284B2 (ja) | 2008-10-10 | 2011-07-06 | トヨタ自動車株式会社 | 表面検査装置 |
| SE533454C2 (sv) * | 2008-12-18 | 2010-10-05 | Portendo Ab | Detektion av små mängder av ämnen |
| JPWO2011001678A1 (ja) * | 2009-07-01 | 2012-12-10 | 株式会社ニコン | 露光条件設定方法および表面検査装置 |
| KR101123638B1 (ko) | 2009-08-26 | 2012-03-20 | 주식회사 케이엔제이 | 스크래치 검사장치 및 방법 |
| JP5282002B2 (ja) | 2009-09-30 | 2013-09-04 | 株式会社日立ハイテクノロジーズ | 磁気ディスクの両面欠陥検査方法及びその装置 |
| JP5321490B2 (ja) | 2010-02-08 | 2013-10-23 | 新日鐵住金株式会社 | 微粒子分析方法 |
| JP2012026862A (ja) | 2010-07-23 | 2012-02-09 | Konica Minolta Business Technologies Inc | 表面検査装置、表面検査方法 |
| JP2012078140A (ja) * | 2010-09-30 | 2012-04-19 | Hitachi High-Technologies Corp | 基板表面欠陥検査方法およびその装置 |
| JP5721070B2 (ja) | 2011-03-08 | 2015-05-20 | 国立研究開発法人産業技術総合研究所 | 光学特性測定装置 |
| US9075934B2 (en) | 2011-09-24 | 2015-07-07 | Globalfoundries Inc. | Reticle defect correction by second exposure |
| JP5875812B2 (ja) | 2011-09-27 | 2016-03-02 | オリンパス株式会社 | 顕微鏡システムおよび照明強度調整方法 |
| US9212900B2 (en) | 2012-08-11 | 2015-12-15 | Seagate Technology Llc | Surface features characterization |
| US9297759B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Classification of surface features using fluorescence |
| US9297751B2 (en) | 2012-10-05 | 2016-03-29 | Seagate Technology Llc | Chemical characterization of surface features |
| US9377394B2 (en) | 2012-10-16 | 2016-06-28 | Seagate Technology Llc | Distinguishing foreign surface features from native surface features |
| US20140129179A1 (en) | 2012-11-08 | 2014-05-08 | Datacolor, Inc. | System and apparatus for multi channel gloss measurements |
| US9217714B2 (en) | 2012-12-06 | 2015-12-22 | Seagate Technology Llc | Reflective surfaces for surface features of an article |
| US9201019B2 (en) | 2013-05-30 | 2015-12-01 | Seagate Technology Llc | Article edge inspection |
| US9513215B2 (en) | 2013-05-30 | 2016-12-06 | Seagate Technology Llc | Surface features by azimuthal angle |
| US9217715B2 (en) | 2013-05-30 | 2015-12-22 | Seagate Technology Llc | Apparatuses and methods for magnetic features of articles |
| US9581554B2 (en) | 2013-05-30 | 2017-02-28 | Seagate Technology Llc | Photon emitter array |
| US9274064B2 (en) | 2013-05-30 | 2016-03-01 | Seagate Technology Llc | Surface feature manager |
-
2013
- 2013-05-09 TW TW102116546A patent/TWI592652B/zh not_active IP Right Cessation
- 2013-05-09 MY MYPI2014703311A patent/MY182531A/en unknown
- 2013-05-09 WO PCT/US2013/040271 patent/WO2013169980A1/en not_active Ceased
- 2013-05-09 KR KR1020147034291A patent/KR102093108B1/ko not_active Expired - Fee Related
- 2013-05-09 CA CA2872898A patent/CA2872898A1/en not_active Abandoned
- 2013-05-09 JP JP2015511681A patent/JP6289450B2/ja not_active Expired - Fee Related
- 2013-05-09 CN CN201380035014.0A patent/CN104412079B/zh not_active Expired - Fee Related
- 2013-05-09 SG SG11201407341TA patent/SG11201407341TA/en unknown
- 2013-05-09 EP EP13787014.3A patent/EP2847556A4/en not_active Ceased
- 2013-05-09 US US13/890,470 patent/US9036142B2/en active Active
-
2014
- 2014-11-07 PH PH12014502486A patent/PH12014502486A1/en unknown
- 2014-11-09 IL IL235589A patent/IL235589A0/en unknown
-
2015
- 2015-04-14 US US14/685,899 patent/US9488593B2/en not_active Expired - Fee Related
-
2016
- 2016-08-23 US US15/245,049 patent/US20160363540A1/en not_active Abandoned
-
2018
- 2018-02-06 JP JP2018019281A patent/JP6486515B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| PH12014502486B1 (en) | 2015-01-12 |
| KR20150008453A (ko) | 2015-01-22 |
| US20160363540A1 (en) | 2016-12-15 |
| JP2015516090A (ja) | 2015-06-04 |
| EP2847556A1 (en) | 2015-03-18 |
| US9488593B2 (en) | 2016-11-08 |
| US20130301040A1 (en) | 2013-11-14 |
| WO2013169980A1 (en) | 2013-11-14 |
| EP2847556A4 (en) | 2016-01-27 |
| MY182531A (en) | 2021-01-25 |
| US9036142B2 (en) | 2015-05-19 |
| CN104412079A (zh) | 2015-03-11 |
| US20150219569A1 (en) | 2015-08-06 |
| TWI592652B (zh) | 2017-07-21 |
| KR102093108B1 (ko) | 2020-03-25 |
| CN104412079B (zh) | 2018-03-27 |
| PH12014502486A1 (en) | 2015-01-12 |
| IL235589A0 (en) | 2015-01-29 |
| JP6289450B2 (ja) | 2018-03-07 |
| TW201411119A (zh) | 2014-03-16 |
| JP6486515B2 (ja) | 2019-03-20 |
| JP2018105877A (ja) | 2018-07-05 |
| SG11201407341TA (en) | 2014-12-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9488593B2 (en) | Surface features mapping | |
| US9766184B2 (en) | Surface features characterization | |
| US9863876B2 (en) | Reflective surfaces for surface features of an article | |
| US9297759B2 (en) | Classification of surface features using fluorescence | |
| US9201019B2 (en) | Article edge inspection | |
| US9952151B2 (en) | Surface features by azimuthal angle | |
| US9766179B2 (en) | Chemical characterization of surface features | |
| US9863892B2 (en) | Distinguishing foreign surface features from native surface features |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20190509 |