CA2381311C - Micro-bridge structure - Google Patents
Micro-bridge structure Download PDFInfo
- Publication number
- CA2381311C CA2381311C CA002381311A CA2381311A CA2381311C CA 2381311 C CA2381311 C CA 2381311C CA 002381311 A CA002381311 A CA 002381311A CA 2381311 A CA2381311 A CA 2381311A CA 2381311 C CA2381311 C CA 2381311C
- Authority
- CA
- Canada
- Prior art keywords
- micro
- substrate
- support element
- bridge
- bolometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 96
- 238000000034 method Methods 0.000 claims abstract description 63
- 239000011540 sensing material Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 69
- 239000010410 layer Substances 0.000 claims description 57
- 230000008859 change Effects 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 229910052681 coesite Inorganic materials 0.000 claims description 9
- 229910052906 cristobalite Inorganic materials 0.000 claims description 9
- 229910052682 stishovite Inorganic materials 0.000 claims description 9
- 229910052905 tridymite Inorganic materials 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 230000004044 response Effects 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 239000010936 titanium Substances 0.000 description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 229910052719 titanium Inorganic materials 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000002955 isolation Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000005334 plasma enhanced chemical vapour deposition Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 238000004380 ashing Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 230000001066 destructive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000003331 infrared imaging Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910001935 vanadium oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J5/22—Electrical features thereof
- G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Inorganic Fibers (AREA)
- Pressure Sensors (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Fire-Detection Mechanisms (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9919877.2A GB9919877D0 (en) | 1999-08-24 | 1999-08-24 | Micro-bridge structure |
| GB9919877.2 | 1999-08-24 | ||
| PCT/GB2000/003243 WO2001014838A1 (en) | 1999-08-24 | 2000-08-23 | Micro-bridge structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2381311A1 CA2381311A1 (en) | 2001-03-01 |
| CA2381311C true CA2381311C (en) | 2009-02-03 |
Family
ID=10859608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002381311A Expired - Lifetime CA2381311C (en) | 1999-08-24 | 2000-08-23 | Micro-bridge structure |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7002153B1 (https=) |
| EP (1) | EP1206687B1 (https=) |
| JP (1) | JP4284019B2 (https=) |
| KR (1) | KR100704518B1 (https=) |
| CN (2) | CN1168960C (https=) |
| AT (1) | ATE232972T1 (https=) |
| AU (1) | AU761197B2 (https=) |
| CA (1) | CA2381311C (https=) |
| DE (1) | DE60001462T2 (https=) |
| ES (1) | ES2192539T3 (https=) |
| GB (2) | GB9919877D0 (https=) |
| TR (1) | TR200200495T2 (https=) |
| TW (1) | TW514723B (https=) |
| WO (1) | WO2001014838A1 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9919877D0 (en) * | 1999-08-24 | 1999-10-27 | Secr Defence | Micro-bridge structure |
| GB2359192B (en) * | 1999-09-16 | 2004-03-31 | Sharp Kk | Thermal-type infrared radiation detector cell and image capture device incorporating the same |
| DE10144343A1 (de) * | 2001-09-10 | 2003-03-27 | Perkinelmer Optoelectronics | Sensor zum berührugslosen Messen einer Temperatur |
| ATE352459T1 (de) | 2002-02-02 | 2007-02-15 | Qinetiq Ltd | Kopfpositionssensor |
| GB0424934D0 (en) | 2004-11-12 | 2004-12-15 | Qinetiq Ltd | Infrared detector |
| CN101249935B (zh) * | 2007-03-31 | 2011-06-22 | 浙江大立科技股份有限公司 | 一种热绝缘微桥结构及其加工方法 |
| US7746236B2 (en) * | 2007-05-01 | 2010-06-29 | Honeywell International Inc. | Fire detection system and method |
| US20090014657A1 (en) * | 2007-05-01 | 2009-01-15 | Honeywell International Inc. | Infrared fire detection system |
| KR101036329B1 (ko) * | 2009-02-13 | 2011-05-23 | 조응래 | 건축용 비계의 보조결합구 |
| CN101780944B (zh) * | 2010-01-05 | 2015-04-29 | 上海集成电路研发中心有限公司 | 一种mems微桥结构的制备方法 |
| JP5706174B2 (ja) * | 2011-01-26 | 2015-04-22 | 三菱電機株式会社 | 赤外線センサおよび赤外線センサアレイ |
| JP5721597B2 (ja) * | 2011-03-15 | 2015-05-20 | 三菱電機株式会社 | 半導体光素子および半導体光装置 |
| TWI476969B (zh) * | 2012-01-13 | 2015-03-11 | Univ Nat Kaohsiung Applied Sci | Metal silicide thermal sensor and its preparation method |
| US9698281B2 (en) * | 2012-08-22 | 2017-07-04 | Robert Bosch Gmbh | CMOS bolometer |
| US9368658B2 (en) * | 2012-08-31 | 2016-06-14 | Robert Bosch Gmbh | Serpentine IR sensor |
| CN102874735B (zh) * | 2012-09-29 | 2015-01-07 | 姜利军 | 双材料微悬臂梁、电磁辐射探测器以及探测方法 |
| US9093594B2 (en) | 2012-10-17 | 2015-07-28 | Robert Bosch Gmbh | Multi-stack film bolometer |
| US9903763B2 (en) | 2013-09-27 | 2018-02-27 | Robert Bosch Gmbh | Titanium nitride for MEMS bolometers |
| CN105093356A (zh) * | 2015-07-31 | 2015-11-25 | 哈尔滨工业大学 | 一种高能量利用率的微桥结构电阻阵列 |
| CN117377378A (zh) | 2017-08-31 | 2024-01-09 | 谷歌有限责任公司 | 量子信息处理器件的形成方法 |
| KR101842955B1 (ko) | 2017-09-28 | 2018-03-29 | ㈜시리우스 | 선택식각 공정을 이용한 마이크로 볼로미터 제조방법 및 이에 따라 제조된 마이크로 볼로미터 |
| CN111960377B (zh) * | 2020-07-29 | 2024-03-15 | 上海集成电路研发中心有限公司 | Mems传感器微桥桥面的制作方法 |
| JP7485581B2 (ja) * | 2020-10-16 | 2024-05-16 | セイコーＮｐｃ株式会社 | 赤外線センサ素子及び赤外線センサ |
| CN113720479B (zh) * | 2021-03-26 | 2022-11-08 | 北京北方高业科技有限公司 | 基于cmos工艺的红外探测器像元和红外探测器 |
| JP2023028860A (ja) | 2021-08-20 | 2023-03-03 | Tdk株式会社 | 電磁波センサ |
| JP2023028859A (ja) | 2021-08-20 | 2023-03-03 | Tdk株式会社 | 電磁波センサ |
| JP2023033861A (ja) | 2021-08-30 | 2023-03-13 | Tdk株式会社 | 構造体及び電磁波センサ |
| JP2023033862A (ja) | 2021-08-30 | 2023-03-13 | Tdk株式会社 | 構造体及び電磁波センサ |
| TWI887664B (zh) * | 2023-05-31 | 2025-06-21 | 松翰科技股份有限公司 | 微輻射熱測量計及其製造方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4544441A (en) | 1980-09-04 | 1985-10-01 | Battelle-Institut E.V. | Method of making a bolometric radiation detector |
| US5300915A (en) | 1986-07-16 | 1994-04-05 | Honeywell Inc. | Thermal sensor |
| WO1988005166A1 (en) * | 1987-01-08 | 1988-07-14 | Massachusetts Institute Of Technology | Turbulent shear force microsensor |
| US5010251A (en) | 1988-08-04 | 1991-04-23 | Hughes Aircraft Company | Radiation detector array using radiation sensitive bridges |
| US5021663B1 (en) | 1988-08-12 | 1997-07-01 | Texas Instruments Inc | Infrared detector |
| US5286976A (en) | 1988-11-07 | 1994-02-15 | Honeywell Inc. | Microstructure design for high IR sensitivity |
| JPH06317475A (ja) * | 1991-07-19 | 1994-11-15 | Terumo Corp | 赤外線センサおよびその製造方法 |
| US5288649A (en) | 1991-09-30 | 1994-02-22 | Texas Instruments Incorporated | Method for forming uncooled infrared detector |
| EP0566156B1 (en) * | 1992-04-17 | 1997-08-27 | Terumo Kabushiki Kaisha | Infrared sensor and method for production thereof |
| DE69328440T3 (de) | 1992-06-19 | 2009-05-07 | Honeywell, Inc., Minneapolis | Infrarot kamera mit thermoelektrischer temperaturstabilisierung |
| WO1994001743A1 (en) * | 1992-07-08 | 1994-01-20 | Honeywell Inc. | Microstructure design for high ir sensitivity |
| US5399897A (en) | 1993-11-29 | 1995-03-21 | Raytheon Company | Microstructure and method of making such structure |
| US5446284A (en) * | 1994-01-25 | 1995-08-29 | Loral Infrared & Imaging Systems, Inc. | Monolithic detector array apparatus |
| JP2710228B2 (ja) | 1994-08-11 | 1998-02-10 | 日本電気株式会社 | ボロメータ型赤外線検知素子、その駆動方法、および検出用積分回路 |
| DE4438704C1 (de) | 1994-10-29 | 1996-04-04 | Kali & Salz Ag | Röhrenfreifallscheider zur Trennung von Kunststoffgemengen |
| US6392232B1 (en) | 1995-07-21 | 2002-05-21 | Pharmarcopeia, Inc. | High fill factor bolometer array |
| US5811815A (en) * | 1995-11-15 | 1998-09-22 | Lockheed-Martin Ir Imaging Systems, Inc. | Dual-band multi-level microbridge detector |
| US5584117A (en) * | 1995-12-11 | 1996-12-17 | Industrial Technology Research Institute | Method of making an interferometer-based bolometer |
| US5942791A (en) * | 1996-03-06 | 1999-08-24 | Gec-Marconi Limited | Micromachined devices having microbridge structure |
| FR2752299B1 (fr) | 1996-08-08 | 1998-09-11 | Commissariat Energie Atomique | Detecteur infrarouge et procede de fabication de celui-ci |
| US6137107A (en) | 1996-08-30 | 2000-10-24 | Raytheon Company | Thermal detector with inter-digitated thin film electrodes and method |
| JPH10132652A (ja) * | 1996-10-29 | 1998-05-22 | Masanori Okuyama | 熱型赤外線検出素子、熱型赤外線撮像素子およびその製造方法 |
| JPH1144582A (ja) | 1997-07-28 | 1999-02-16 | Matsushita Electric Works Ltd | 赤外線検出器及びこれを用いたガス検出器 |
| JPH11148861A (ja) * | 1997-09-09 | 1999-06-02 | Honda Motor Co Ltd | マイクロブリッジ構造 |
| US6144030A (en) | 1997-10-28 | 2000-11-07 | Raytheon Company | Advanced small pixel high fill factor uncooled focal plane array |
| GB2335077B (en) | 1998-03-04 | 2003-05-28 | Marconi Gec Ltd | Radiation detectors |
| JPH11326037A (ja) | 1998-05-12 | 1999-11-26 | Mitsubishi Electric Corp | 赤外線検出器用真空パッケージ及びその製造方法 |
| US6198098B1 (en) | 1998-05-26 | 2001-03-06 | Philips Laou | Microstructure for infrared detector and method of making same |
| WO2000004354A1 (en) | 1998-07-14 | 2000-01-27 | Daewoo Electronics Co., Ltd. | Method for manufacturing a three level bolometer |
| US6307194B1 (en) | 1999-06-07 | 2001-10-23 | The Boeing Company | Pixel structure having a bolometer with spaced apart absorber and transducer layers and an associated fabrication method |
| GB9919877D0 (en) * | 1999-08-24 | 1999-10-27 | Secr Defence | Micro-bridge structure |
| US6690014B1 (en) | 2000-04-25 | 2004-02-10 | Raytheon Company | Microbolometer and method for forming |
| US6541772B2 (en) | 2000-12-26 | 2003-04-01 | Honeywell International Inc. | Microbolometer operating system |
-
1999
- 1999-08-24 GB GBGB9919877.2A patent/GB9919877D0/en not_active Ceased
-
2000
- 2000-08-23 CA CA002381311A patent/CA2381311C/en not_active Expired - Lifetime
- 2000-08-23 CN CNB008120234A patent/CN1168960C/zh not_active Expired - Lifetime
- 2000-08-23 DE DE60001462T patent/DE60001462T2/de not_active Expired - Lifetime
- 2000-08-23 ES ES00954753T patent/ES2192539T3/es not_active Expired - Lifetime
- 2000-08-23 WO PCT/GB2000/003243 patent/WO2001014838A1/en not_active Ceased
- 2000-08-23 JP JP2001519147A patent/JP4284019B2/ja not_active Expired - Fee Related
- 2000-08-23 AU AU67110/00A patent/AU761197B2/en not_active Ceased
- 2000-08-23 CN CNB2004100029241A patent/CN100383504C/zh not_active Expired - Lifetime
- 2000-08-23 KR KR1020027002183A patent/KR100704518B1/ko not_active Expired - Fee Related
- 2000-08-23 EP EP00954753A patent/EP1206687B1/en not_active Expired - Lifetime
- 2000-08-23 GB GB0201115A patent/GB2370156A/en not_active Withdrawn
- 2000-08-23 US US10/069,363 patent/US7002153B1/en not_active Expired - Lifetime
- 2000-08-23 AT AT00954753T patent/ATE232972T1/de not_active IP Right Cessation
- 2000-08-23 TR TR2002/00495T patent/TR200200495T2/xx unknown
- 2000-09-08 TW TW089118419A patent/TW514723B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100704518B1 (ko) | 2007-04-09 |
| JP4284019B2 (ja) | 2009-06-24 |
| GB2370156A (en) | 2002-06-19 |
| WO2001014838A1 (en) | 2001-03-01 |
| CA2381311A1 (en) | 2001-03-01 |
| GB0201115D0 (en) | 2002-03-06 |
| AU6711000A (en) | 2001-03-19 |
| HK1070940A1 (zh) | 2005-06-30 |
| TW514723B (en) | 2002-12-21 |
| KR20020060692A (ko) | 2002-07-18 |
| DE60001462T2 (de) | 2003-12-04 |
| DE60001462D1 (de) | 2003-03-27 |
| CN1168960C (zh) | 2004-09-29 |
| EP1206687B1 (en) | 2003-02-19 |
| CN1371474A (zh) | 2002-09-25 |
| CN100383504C (zh) | 2008-04-23 |
| ATE232972T1 (de) | 2003-03-15 |
| TR200200495T2 (tr) | 2002-06-21 |
| ES2192539T3 (es) | 2003-10-16 |
| JP2003507904A (ja) | 2003-02-25 |
| AU761197B2 (en) | 2003-05-29 |
| CN1558193A (zh) | 2004-12-29 |
| US7002153B1 (en) | 2006-02-21 |
| EP1206687A1 (en) | 2002-05-22 |
| GB9919877D0 (en) | 1999-10-27 |
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