CN1168960C - 测热辐射计及其制造方法 - Google Patents

测热辐射计及其制造方法 Download PDF

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Publication number
CN1168960C
CN1168960C CNB008120234A CN00812023A CN1168960C CN 1168960 C CN1168960 C CN 1168960C CN B008120234 A CNB008120234 A CN B008120234A CN 00812023 A CN00812023 A CN 00812023A CN 1168960 C CN1168960 C CN 1168960C
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China
Prior art keywords
substrate
sensing material
radiation
radiometer
support component
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Expired - Lifetime
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CNB008120234A
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English (en)
Chinese (zh)
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CN1371474A (zh
Inventor
J��P��������ķ
J·P·吉尔哈姆
R·瓦顿
J·C·阿尔德曼
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Qinetiq Ltd
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Qinetiq Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22—Electrical features thereof
    • G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Inorganic Fibers (AREA)
  • Pressure Sensors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Fire-Detection Mechanisms (AREA)
  • Thermistors And Varistors (AREA)
CNB008120234A 1999-08-24 2000-08-23 测热辐射计及其制造方法 Expired - Lifetime CN1168960C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9919877.2A GB9919877D0 (en) 1999-08-24 1999-08-24 Micro-bridge structure
GB9919877.2 1999-08-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100029241A Division CN100383504C (zh) 1999-08-24 2000-08-23 微桥结构

Publications (2)

Publication Number Publication Date
CN1371474A CN1371474A (zh) 2002-09-25
CN1168960C true CN1168960C (zh) 2004-09-29

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CNB008120234A Expired - Lifetime CN1168960C (zh) 1999-08-24 2000-08-23 测热辐射计及其制造方法
CNB2004100029241A Expired - Lifetime CN100383504C (zh) 1999-08-24 2000-08-23 微桥结构

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CNB2004100029241A Expired - Lifetime CN100383504C (zh) 1999-08-24 2000-08-23 微桥结构

Country Status (14)

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US (1) US7002153B1 (https=)
EP (1) EP1206687B1 (https=)
JP (1) JP4284019B2 (https=)
KR (1) KR100704518B1 (https=)
CN (2) CN1168960C (https=)
AT (1) ATE232972T1 (https=)
AU (1) AU761197B2 (https=)
CA (1) CA2381311C (https=)
DE (1) DE60001462T2 (https=)
ES (1) ES2192539T3 (https=)
GB (2) GB9919877D0 (https=)
TR (1) TR200200495T2 (https=)
TW (1) TW514723B (https=)
WO (1) WO2001014838A1 (https=)

Cited By (1)

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CN100383504C (zh) * 1999-08-24 2008-04-23 秦内蒂克有限公司 微桥结构

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CN101249935B (zh) * 2007-03-31 2011-06-22 浙江大立科技股份有限公司 一种热绝缘微桥结构及其加工方法
US7746236B2 (en) * 2007-05-01 2010-06-29 Honeywell International Inc. Fire detection system and method
US20090014657A1 (en) * 2007-05-01 2009-01-15 Honeywell International Inc. Infrared fire detection system
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CN101780944B (zh) * 2010-01-05 2015-04-29 上海集成电路研发中心有限公司 一种mems微桥结构的制备方法
JP5706174B2 (ja) * 2011-01-26 2015-04-22 三菱電機株式会社 赤外線センサおよび赤外線センサアレイ
JP5721597B2 (ja) * 2011-03-15 2015-05-20 三菱電機株式会社 半導体光素子および半導体光装置
TWI476969B (zh) * 2012-01-13 2015-03-11 Univ Nat Kaohsiung Applied Sci Metal silicide thermal sensor and its preparation method
US9698281B2 (en) * 2012-08-22 2017-07-04 Robert Bosch Gmbh CMOS bolometer
US9368658B2 (en) * 2012-08-31 2016-06-14 Robert Bosch Gmbh Serpentine IR sensor
CN102874735B (zh) * 2012-09-29 2015-01-07 姜利军 双材料微悬臂梁、电磁辐射探测器以及探测方法
US9093594B2 (en) 2012-10-17 2015-07-28 Robert Bosch Gmbh Multi-stack film bolometer
US9903763B2 (en) 2013-09-27 2018-02-27 Robert Bosch Gmbh Titanium nitride for MEMS bolometers
CN105093356A (zh) * 2015-07-31 2015-11-25 哈尔滨工业大学 一种高能量利用率的微桥结构电阻阵列
CN117377378A (zh) 2017-08-31 2024-01-09 谷歌有限责任公司 量子信息处理器件的形成方法
KR101842955B1 (ko) 2017-09-28 2018-03-29 ㈜시리우스 선택식각 공정을 이용한 마이크로 볼로미터 제조방법 및 이에 따라 제조된 마이크로 볼로미터
CN111960377B (zh) * 2020-07-29 2024-03-15 上海集成电路研发中心有限公司 Mems传感器微桥桥面的制作方法
JP7485581B2 (ja) * 2020-10-16 2024-05-16 セイコーＮｐｃ株式会社 赤外線センサ素子及び赤外線センサ
CN113720479B (zh) * 2021-03-26 2022-11-08 北京北方高业科技有限公司 基于cmos工艺的红外探测器像元和红外探测器
JP2023028860A (ja) 2021-08-20 2023-03-03 Tdk株式会社 電磁波センサ
JP2023028859A (ja) 2021-08-20 2023-03-03 Tdk株式会社 電磁波センサ
JP2023033861A (ja) 2021-08-30 2023-03-13 Tdk株式会社 構造体及び電磁波センサ
JP2023033862A (ja) 2021-08-30 2023-03-13 Tdk株式会社 構造体及び電磁波センサ
TWI887664B (zh) * 2023-05-31 2025-06-21 松翰科技股份有限公司 微輻射熱測量計及其製造方法

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* Cited by examiner, † Cited by third party
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CN100383504C (zh) * 1999-08-24 2008-04-23 秦内蒂克有限公司 微桥结构

Also Published As

Publication number Publication date
KR100704518B1 (ko) 2007-04-09
JP4284019B2 (ja) 2009-06-24
GB2370156A (en) 2002-06-19
WO2001014838A1 (en) 2001-03-01
CA2381311A1 (en) 2001-03-01
GB0201115D0 (en) 2002-03-06
AU6711000A (en) 2001-03-19
HK1070940A1 (zh) 2005-06-30
TW514723B (en) 2002-12-21
KR20020060692A (ko) 2002-07-18
CA2381311C (en) 2009-02-03
DE60001462T2 (de) 2003-12-04
DE60001462D1 (de) 2003-03-27
EP1206687B1 (en) 2003-02-19
CN1371474A (zh) 2002-09-25
CN100383504C (zh) 2008-04-23
ATE232972T1 (de) 2003-03-15
TR200200495T2 (tr) 2002-06-21
ES2192539T3 (es) 2003-10-16
JP2003507904A (ja) 2003-02-25
AU761197B2 (en) 2003-05-29
CN1558193A (zh) 2004-12-29
US7002153B1 (en) 2006-02-21
EP1206687A1 (en) 2002-05-22
GB9919877D0 (en) 1999-10-27

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